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T. C. Kuo
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Journal Articles

A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests

M. Y. Tsai, T. C. Kuo
Journal: Journal of Electronic Packaging
Publisher: ASME
Article Type: Technical Briefs
J. Electron. Packag. September 2023, 145(3): 034502.
Paper No: EP-22-1060
https://doi.org/10.1115/1.4056717
Published Online: February 8, 2023
View Article titled, A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests
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Topics: Bending strength, Silicon, Stress, Displacement, Failure mechanisms
Journal Articles

Particle Trajectories Around a Flying Slider

S. C. Lin, T. C. Kuo, C. C. Chieng
Journal: Journal of Tribology
Publisher: ASME
Article Type: Research Papers
J. Tribol. January 1998, 120(1): 69–74.
https://doi.org/10.1115/1.2834192
Published Online: January 1, 1998
View Article titled, Particle Trajectories Around a Flying Slider
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Topics: Particulate matter, Disks, Drops, Collisions (Physics), Probability, Brownian motion, Equations of motion, Fluids, Mean free path, Navier-Stokes equations