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Seungwon Shin
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Journal Articles

Identification of Controlling Parameters on Thermal Deformation of Mobile Device by Injection Molding Process

Eunyoung Chang, Seungwon Shin, Haseung Chung
Journal: Journal of Manufacturing Science and Engineering
Article Type: Research-Article
J. Manuf. Sci. Eng. February 2013, 135(1): 011008.
Paper No: MANU-12-1081
DOI: https://doi.org/10.1115/1.4023284
Published Online: January 22, 2013
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Topics: Batteries, Computer simulation, Deformation, Design, Injection molding, Numerical analysis, Temperature, Thermal deformation, Stress, Computer-aided design
Proceedings Papers

Numerical Simulation of Multiple Seeds Interaction During Three-Dimensional Dendritic Solidification With Fluid Flow

Ikroh Yoon, Seungwon Shin
Proc. ASME. MNHMT2009, ASME 2009 Second International Conference on Micro/Nanoscale Heat and Mass Transfer, Volume 2, 651-658, December 18–21, 2009
Paper No: MNHMT2009-18129
DOI: https://doi.org/10.1115/MNHMT2009-18129
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Topics: Computer simulation, Fluid dynamics, Solidification
Journal Articles

Modeling of Melting, Evaporating, and Resolidifying Procedure in Laser-Induced Metal Processing

Seungwon Shin, Haseung Chung
Journal: Journal of Manufacturing Science and Engineering
Article Type: Technical Briefs
J. Manuf. Sci. Eng. April 2009, 131(2): 024501.
DOI: https://doi.org/10.1115/1.3063654
Published Online: March 17, 2009
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Topics: Evaporation, Lasers, Melting, Metals, Temperature, Heat flux, Scaling laws (Mathematical physics), Boundary-value problems, Modeling