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Journal Articles

A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond

Song Yuan, Xiaoguang Guo, Hao Wang, Shang Gao

J. Manuf. Sci. Eng. July 2023, 145(7): 071006.

Paper No: MANU-22-1408

DOI: https://doi.org/10.1115/1.4057008

Published Online: March 21, 2023

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Topics: Damage, Diamonds, Machining, Polishing, Simulation, Ultraviolet radiation

Journal Articles

Identification of Tool Life Stages and Redressing Criterion for Polycrystalline Diamond Micro-Grinding Tools Using a Machine Learning Approach

Ashwani Pratap, Karali Patra, Suhas S. Joshi

J. Manuf. Sci. Eng. April 2023, 145(4): 041007.

Paper No: MANU-22-1428

DOI: https://doi.org/10.1115/1.4056490

Published Online: January 19, 2023

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Topics: Cutting, Grinding, Machine learning, Support vector machines, Wear, Diamonds, Machining, Algorithms

Journal Articles

Turning Parameters Optimization for Diffraction Effect Suppression of Diamond-Turned Surface Combining Surface Micro-Topography Model and Scattering Theory

Pengfeng Sheng, Zhengxiang Shen, Li Jiang, Shenghuan Fang, Zhanshan Wang

J. Manuf. Sci. Eng. November 2021, 143(11): 111011.

Paper No: MANU-20-1721

DOI: https://doi.org/10.1115/1.4051058

Published Online: June 14, 2021

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Topics: Diamonds, Diffraction, Scattering theory

Journal Articles

Ultra-Precision Machining: Cutting With Diamond Tools

D. A. Lucca, M. J. Klopfstein, O. Riemer

J. Manuf. Sci. Eng. November 2020, 142(11): 110817.

Paper No: MANU-20-1087

DOI: https://doi.org/10.1115/1.4048194

Published Online: October 5, 2020

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Topics: Cutting, Diamond tools, Diamond turning, Diamonds, Machining, Crystals, Milling, Machine tools

Journal Articles

Investigation of Tool and Workpiece Interaction on Surface Quality While Diamond Turning of Copper Beryllium Alloy

A. Sharma, Suhas S. Joshi, D. Datta, R. Balasubramaniam

J. Manuf. Sci. Eng. February 2020, 142(2): 021011.

Paper No: MANU-19-1316

DOI: https://doi.org/10.1115/1.4045721

Published Online: January 3, 2020

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Topics: Cutting, Diamond turning, Machining, Surface roughness, Contamination, Particulate matter, Diamonds, Wear

Journal Articles

Molecular Dynamics Simulation of Mechanical Polishing on Stainless Steel Using Diamond Nanoparticles

Prabhat Ranjan, R. Balasubramaniam, V.K. Jain

J. Manuf. Sci. Eng. January 2019, 141(1): 014504.

Paper No: MANU-18-1016

DOI: https://doi.org/10.1115/1.4041914

Published Online: November 26, 2018

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Topics: Diamonds, Molecular dynamics simulation, Particulate matter, Polishing, Simulation

Journal Articles

High-Speed Drawing of Al Alloy Wire by Diamond-Coated Drawing Die Under Environmentally Friendly Water-Based Emulsion Lubrication

Xinchang Wang, Chengchuan Wang, Xiaotian Shen, Fanghong Sun

J. Manuf. Sci. Eng. December 2018, 140(12): 124502.

Paper No: MANU-17-1680

DOI: https://doi.org/10.1115/1.4041477

Published Online: October 5, 2018

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Topics: Aluminum alloys, Diamonds, Emulsions, Lubrication, Tribology, Water, Wire, Diamond films, Polishing, Wear

Journal Articles

Wear Mechanism and Modeling of Tribological Behavior of Polycrystalline Diamond Tools When Cutting Ti6Al4V

Guangxian Li, Shuang Yi, Cuie Wen, Songlin Ding

J. Manuf. Sci. Eng. December 2018, 140(12): 121011.

Paper No: MANU-18-1227

DOI: https://doi.org/10.1115/1.4041327

Published Online: October 5, 2018

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Topics: Cutting, Stress, Temperature, Tribology, Wear, Diamonds, Shear stress, Adhesion, Abrasion, Flow (Dynamics)

Journal Articles

Drilling CFRP Laminates by Dual-Axis Grinding Wheel System With Copper/Diamond Functionally Graded Grinding Wheel

Takahiro Kunimine, Hideaki Tsuge, Daisuke Ogawa, Motoko Yamada, Hisashi Sato, Yoshimi Watanabe

J. Manuf. Sci. Eng. July 2018, 140(7): 071011.

Paper No: MANU-17-1202

DOI: https://doi.org/10.1115/1.4039650

Published Online: May 11, 2018

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Topics: Carbon reinforced plastics, Drilling, Grinding wheels, Laminates, Diamonds, Machining, Copper, Thrust, Hole quality

Journal Articles

Feasibility Study of Longitudinal–Torsional-Coupled Rotary Ultrasonic Machining of Brittle Material

Jianjian Wang, Jianfu Zhang, Pingfa Feng, Ping Guo, Qiaoli Zhang

J. Manuf. Sci. Eng. May 2018, 140(5): 051008.

Paper No: MANU-17-1408

DOI: https://doi.org/10.1115/1.4038728

Published Online: March 6, 2018

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Topics: Brittleness, Cutting, Diamonds, Machining, Surface roughness, Ultrasonic machining, Vibration, Fracture (Materials), Trajectories (Physics), Abrasives

Journal Articles

An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw

Hui Huang, Xixi Li, Xipeng Xu

J. Manuf. Sci. Eng. December 2017, 139(12): 121011.

Paper No: MANU-17-1201

DOI: https://doi.org/10.1115/1.4038109

Published Online: November 2, 2017

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Topics: Diamonds, Sapphire, Sawing, Wire

Journal Articles

Grinding of Chromium Carbide Coatings Using Electroplated Diamond Wheels

Zhongde Shi, Amr Elfizy, Helmi Attia, Gilbert Ouellet

J. Manuf. Sci. Eng. December 2017, 139(12): 121014.

Paper No: MANU-17-1207

DOI: https://doi.org/10.1115/1.4037183

Published Online: November 2, 2017

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Topics: Grinding, Wheels, Coatings, Diamonds, Surface roughness

Journal Articles

Performance of Diamond and Silicon Carbide Wheels on Grinding of Bioceramic Material Under Minimum Quantity Lubrication Condition

P. Suya Prem Anand, N. Arunachalam, L. Vijayaraghavan

J. Manuf. Sci. Eng. December 2017, 139(12): 121019.

Paper No: MANU-17-1235

DOI: https://doi.org/10.1115/1.4037940

Published Online: November 2, 2017

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Topics: Diamonds, Grinding, Grinding wheels, Wheels, Silicon, Fluids, Lubrication

Journal Articles

Diamond Wheel Dressing: A Comprehensive Review

Wenfeng Ding, Haonan Li, Liangchi Zhang, Jiuhua Xu, Yucan Fu, Honghua Su

J. Manuf. Sci. Eng. December 2017, 139(12): 121006.

Paper No: MANU-17-1177

DOI: https://doi.org/10.1115/1.4037991

Published Online: November 2, 2017

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Topics: Diamonds, Grinding wheels, Lasers, Wheels, Grinding

Journal Articles

A Molecular Dynamics Simulation Study of Material Removal Mechanisms in Vibration Assisted Nano Impact-Machining by Loose Abrasives

Sagil James, Murali Sundaram

J. Manuf. Sci. Eng. August 2017, 139(8): 081014.

Paper No: MANU-16-1452

DOI: https://doi.org/10.1115/1.4036559

Published Online: May 11, 2017

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Topics: Abrasives, Borosilicate glasses, Heat resistant glass, Kinetic energy, Machining, Nanoparticles, Nanoscale phenomena, Silicon, Simulation, Vibration

Journal Articles

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Ping Zhou, Ying Yan, Ning Huang, Ziguang Wang, Renke Kang, Dongming Guo

J. Manuf. Sci. Eng. August 2017, 139(8): 081012.

Paper No: MANU-16-1608

DOI: https://doi.org/10.1115/1.4036125

Published Online: May 10, 2017

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Topics: Deformation, Diamonds, Grinding, Semiconductor wafers, Stress, Wheels, Stress concentration, Damage, Silicon

Journal Articles

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

Shujuan Li, Aofei Tang, Yong Liu, Jiabin Wang, Dan Cui, Robert G. Landers

J. Manuf. Sci. Eng. April 2017, 139(4): 041003.

Paper No: MANU-16-1250

DOI: https://doi.org/10.1115/1.4034792

Published Online: October 18, 2016

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Topics: Cutting, Semiconductor wafers, Wire, Machining, Modeling, Diamonds

Journal Articles

An Assessment of the Wear Characteristics of Microcutting Arrays Produced From Polycrystalline Diamond and Cubic Boron Nitride Composites

M. Pacella, D. A. Axinte, P. W. Butler-Smith, P. Shipway, M. Daine, C. Wort

J. Manuf. Sci. Eng. February 2016, 138(2): 021001.

Paper No: MANU-14-1583

DOI: https://doi.org/10.1115/1.4030761

Published Online: September 9, 2015

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Topics: Composite materials, Cutting, Diamonds, Wear, Binders (Materials)

Journal Articles

A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond

Florestan Schindler, Richard Brocker, Fritz Klocke, Patrick Mattfeld

J. Manuf. Sci. Eng. January 2016, 138(1): 011002.

Paper No: MANU-14-1449

DOI: https://doi.org/10.1115/1.4029804

Published Online: September 9, 2015

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Topics: Diamonds, Grinding

Journal Articles

Force Modeling and Control of SiC Monocrystal Wafer Processing

Shujuan Li, Siming Du, Aofei Tang, Robert G. Landers, Yang Zhang

J. Manuf. Sci. Eng. December 2015, 137(6): 061003.

Paper No: MANU-14-1309

DOI: https://doi.org/10.1115/1.4029432

Published Online: September 9, 2015

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Topics: Cutting, Semiconductor wafers, Wire, Machining, Control equipment, Surface roughness, Diamonds, Tension

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Journal citation

NARROW

A Theoretical and Experimental Study on High-Efficiency and Ultra-Low Damage Machining of Diamond

Identification of Tool Life Stages and Redressing Criterion for Polycrystalline Diamond Micro-Grinding Tools Using a Machine Learning Approach

Turning Parameters Optimization for Diffraction Effect Suppression of Diamond-Turned Surface Combining Surface Micro-Topography Model and Scattering Theory

Ultra-Precision Machining: Cutting With Diamond Tools

Investigation of Tool and Workpiece Interaction on Surface Quality While Diamond Turning of Copper Beryllium Alloy

Molecular Dynamics Simulation of Mechanical Polishing on Stainless Steel Using Diamond Nanoparticles

High-Speed Drawing of Al Alloy Wire by Diamond-Coated Drawing Die Under Environmentally Friendly Water-Based Emulsion Lubrication

Wear Mechanism and Modeling of Tribological Behavior of Polycrystalline Diamond Tools When Cutting Ti6Al4V

Drilling CFRP Laminates by Dual-Axis Grinding Wheel System With Copper/Diamond Functionally Graded Grinding Wheel

Feasibility Study of Longitudinal–Torsional-Coupled Rotary Ultrasonic Machining of Brittle Material

An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw

Grinding of Chromium Carbide Coatings Using Electroplated Diamond Wheels

Performance of Diamond and Silicon Carbide Wheels on Grinding of Bioceramic Material Under Minimum Quantity Lubrication Condition

Diamond Wheel Dressing: A Comprehensive Review

A Molecular Dynamics Simulation Study of Material Removal Mechanisms in Vibration Assisted Nano Impact-Machining by Loose Abrasives

Residual Stress Distribution in Silicon Wafers Machined by Rotational Grinding

Analytical Force Modeling of Fixed Abrasive Diamond Wire Saw Machining With Application to SiC Monocrystal Wafer Processing

An Assessment of the Wear Characteristics of Microcutting Arrays Produced From Polycrystalline Diamond and Cubic Boron Nitride Composites

A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond

Force Modeling and Control of SiC Monocrystal Wafer Processing

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