Electrochemical grinding (ECG) at macrolevel and microlevel finds increasing use in medical device manufacturing industry. To enhance application of micro-ECG, a comprehensive study of the role electrolyte flow in the formation of hydroxide layer on a workpiece due to electrochemical dissolution, and its removal due to abrasion by a grinding wheel, and erosion by an electrolyte flow has been conducted. Specifically, this paper presents modeling and experimental analysis of turbulent flow in the interelectrode gap (IEG) in the micro-ECG to predict shear stresses at the workpiece boundary. It was found that the shearing forces on the hydroxide layer increase with an increase in electrolyte flow velocity but are halved when the IEG is doubled. Besides elucidating the process mechanism, the theoretical values of forces and metal removal rate (MRR) have been validated experimentally.
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February 2013
Research-Article
Analysis of Electrolytic Flow Effects in Micro-Electrochemical Grinding
Suhas S. Joshi
Suhas S. Joshi
1
e-mail: ssjoshi@iitb.ac.in
Department of Mechanical Engineering,
Mumbai 400 076,
Department of Mechanical Engineering,
Indian Institute of Technology Bombay
,Mumbai 400 076,
India
1Corresponding author.
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Suhas S. Joshi
e-mail: ssjoshi@iitb.ac.in
Department of Mechanical Engineering,
Mumbai 400 076,
Department of Mechanical Engineering,
Indian Institute of Technology Bombay
,Mumbai 400 076,
India
1Corresponding author.
Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received May 17, 2010; final manuscript received December 8, 2012; published online January 24, 2013. Assoc. Editor: Kornel Ehmann.
J. Manuf. Sci. Eng. Feb 2013, 135(1): 011012 (9 pages)
Published Online: January 24, 2013
Article history
Received:
May 17, 2010
Revision Received:
December 8, 2012
Citation
Sapre, P., Mall, A., and Joshi, S. S. (January 24, 2013). "Analysis of Electrolytic Flow Effects in Micro-Electrochemical Grinding." ASME. J. Manuf. Sci. Eng. February 2013; 135(1): 011012. https://doi.org/10.1115/1.4023266
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