...Khalid Alzoubi; Alexander Hensel; Felix Häußler; Bettina Ottinger; Marcel Sippel; Jörg Franke Power electronics is concerned with the use of electronic devices to control and transfer electric power from one form to another. Power electronics can be found in laptop chargers, electric grids...

... thermal conductivities of 6.0 and 8.5 W/m K. HALT specimens were prepared by applying TIM through a 4-mil stencil over AlSiC baseplates in the shape of those used in Wolfspeed CAS325M12HM2 power electronics modules. Baseplates were mounted onto aluminum carrier blocks with embedded thermocouples...

... with Standards such as Joint Electron Device Engineering Council (JEDEC) and Institute for Printed Circuits (IPC) is to the best of our knowledge lacking. To fill this gap, a detailed review of failure mechanism driven reliability models, with emphasis on physics of failure (PoF) for power electronics...

...Justin Hollis; Darin J. Sharar; Todd Bandhauer High-temperature silicon carbide (SiC) die are the most critical and expensive component in electric vehicle (EV) power electronics (PE) packages and require both active and passive methods to dissipate heat during transient operation. The use of phase...

... scattering in the tested HVPE-grown bulk GaN substrates. The results provide useful information for designing thermal management solutions for vertical GaN power electronic devices. e-mail:  sukwon.choi@psu.edu 13 01 2020 02 06 2020 10 07 2020 gallium nitride (GaN) power...

... in automotive power electronics, such as in traction inverters, has yet to be fulfilled. A brief discussion is made on some of the potential areas of application and challenges relating to more widespread adoption of PCMs, with reference to a case study using computational model of a commercially available...

... (GaN) with an aim to accomplish an improvement in size, weight, and power of power electronics beyond current devices based on silicon (Si). However, the increased operating power densities and reduced areal footprints of WBG device technologies result in significant levels of self-heating that can...

.... Fig. 11 Exploded view of the laminated foil TLP bonding fixture plus assembly (left) and actual fabrication setup (right) e-mail:  yanghe.liu@toyota.com 04 02 2019 26 07 2019 19 09 2019 transient liquid phase high-temperature bond wide band-gap power electronics...

...Alexander Otto; Sven Rzepka; Bernhard Wunderle Active power cycling (APC) is a standardized and well-established method for reliability assessment and product qualification in power electronics (PEs) technologies. Repetitive pulses of load current are applied to cause cyclic thermal swings in the p...

...Darshan G. Pahinkar; Lauren Boteler; Dimeji Ibitayo; Sreekant Narumanchi; Paul Paret; Douglas DeVoto; Joshua Major; Samuel Graham With recent advances in the state-of-the-art of power electronic devices, packaging has become one of the critical factors limiting the performance and durability...

...Paolo Emilio Bagnoli; Cristina Padovani; Andrea Pagni; Giuseppe Pasquinelli The DJOSER analytical thermal solver for multilayer mounting structures has been tested as a useful and friendly tool for the thermal analysis of power electronic devices and their packages, able to replace the onerous...

...Manu Mital; Elaine P. Scott This paper presents a thermal design methodology for an integrated power electronic module (IPEM) using embedded, single-phase, and laminar-flow rectangular microchannels. Three-dimensional packaging of electronic components in a small and compact volume makes thermal...

...Y. Pang; E. Scott; J. D. van Wyk; Z. Liang The increased heat generation in power electronic components can greatly reduce the reliability of the components and increase the chances of malfunction to the components. A good understanding of the thermal behavior of these components can help...

...J. Dirker; J. D. van Wyk; J. P. Meyer Thermal issues have become a major consideration in the design and development of electronic components. In power electronics, thermal limitations have been identified as a barrier to future developments such as three-dimensional integration. This paper...

...M. Herna´ndez-Mora; J. E. Gonza´lez; M. Ve´lez-Reyes; J. M. Ortiz-Rodrı´guez; Y. Pang; E. Scott Background: This paper presents a reduced mathematical model using a practical numerical formulation of the thermal behavior of an integrated power electronics module (IPEM). This model is based...

... and Systems, Reno, Nevada . Ye , H. , Lin , M. , and Basaran , C. , 2002 , “ Failure Modes and FEM Analysis of Power Electronic Packaging ,” Finite Elem. Anal. Design 0168-874X , 38 ( 7 ), pp. 601 – 612 . Ye , H. , Basaran , C. , and Hopkins , D. , 2003...

...A. G. Evans; M. Y. He; J. W. Hutchinson; M. Shaw A thermal analysis has been performed for a package design pertinent to power electronics. The objective has been the derivation of straightforward expressions that relate the materials used and their physical dimensions to the power input...

... received by the EEPD Division November 25, 1999. Associate Technical Editor: Y. Joshi. 25 November 1999 thermal management (packaging) surface mount technology thermal resistance magnetic devices power electronics In the present microelectronics industrial revolution, designers...