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Keywords: TSV micropin fin
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Journal Articles
Journal:
Journal of Electronic Packaging
Publisher: ASME
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011005.
Paper No: EP-22-1080
Published Online: June 6, 2023
... adder are 885 kW/m 2 and 1.832 MW/m 2 combined with the layout size, respectively. Meanwhile, the effects of the shape and arrangement of TSV micropin fins on the flow and heat transfer characteristics are investigated. The result shows that the 1.2:1 diamond micropin fin microchannel with staggered...
