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Journal Articles

A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components

Peter Lukacs, Tibor Rovensky, Alexandr Otahal
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011004.
Paper No: EP-23-1005
DOI: https://doi.org/10.1115/1.4062470
Published Online: May 18, 2023
View Article titled, A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
Click here to open pdf in another window PDF for A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components
Topics: Cross section (Physics), Lead-free solders, Printed circuit boards, Solder joints, Soldering, Solders, Surface mount devices, Capacitors, Dislocations, Reliability
Journal Articles

Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component

Markus Tauscher, Tobias Merk, Aniket Adsule, Andreas Linnemann, Jürgen Wilde
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011003.
Paper No: EP-23-1001
DOI: https://doi.org/10.1115/1.4062404
Published Online: May 15, 2023
View Article titled, Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component
Click here to open pdf in another window PDF for Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component
Topics: Ball-Grid-Array packaging, Creep, Fatigue, Solders, Cycles, Deformation
Journal Articles

Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning

Accepted Manuscript
Linmeng Xu, Wanying Zhao, Junhui Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1063
DOI: https://doi.org/10.1115/1.4062530
Published Online: May 15, 2023
View Article titled, Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
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Topics: Cooling, Simulation, Computer software, Convection, Cooling systems, Energy conservation, Finite element analysis, Finite element methods, Hardware, Heat
Journal Articles

Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic

Accepted Manuscript
Ping Sun, Bing-Huan Huang, Kui Li, Liang Gong, Chuan-Yong Zhu, Ying Zheng
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1080
DOI: https://doi.org/10.1115/1.4062531
Published Online: May 15, 2023
View Article titled, Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic
Click here to open pdf in another window PDF for Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic
Topics: Microchannels, Physics, Flow (Dynamics), Fins, Heat transfer, Circuits, Diamonds, Heat, Integrated circuits, Shapes
Journal Articles

Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package

Ke Zhong, Huanpeng Wang, Jingrou Wang, Yuehang Xu
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011002.
Paper No: EP-22-1090
DOI: https://doi.org/10.1115/1.4062344
Published Online: May 2, 2023
View Article titled, Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
Click here to open pdf in another window PDF for Effect of Heating Power on Ball Grid Array Thermal Shock Reliability for a Fanout Package
Topics: Ball-Grid-Array packaging, Fatigue life, Heat, Heating, Reliability, Solders, Stress, Temperature, Thermal shock, Cycles
Journal Articles

Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure

Zong-Tao Li, Jun-Hao Wu, Guan-Wei Liang, Ren-peng Yang, Zhihui Yang, Jia-Sheng Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. March 2024, 146(1): 011001.
Paper No: EP-22-1071
DOI: https://doi.org/10.1115/1.4062383
Published Online: May 2, 2023
View Article titled, Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure
Click here to open pdf in another window PDF for Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe 3 O 4 -Magnetic Particle Chained Pillar Array Structure
Topics: Columns (Structural), Particulate matter, Reflectance
Journal Articles

Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module

Accepted Manuscript
Yujui Lin, Tiwei Wei, Wyatt Jason Moy, Hao Chen, Man Prakash Gupta, Michael Degner, Mehdi Asheghi, Alan Mantooth, Kenneth Goodson
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag.
Paper No: EP-22-1093
DOI: https://doi.org/10.1115/1.4062384
Published Online: April 21, 2023
View Article titled, Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
Click here to open pdf in another window PDF for Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
Topics: Copper, Heat sinks, Manifolds, Microchannels, Bonding, Computer simulation, Heat, Lasers, Power density, Pressure drop
Journal Articles

Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope

Kaifeng Chang, Yun-Ze Li, Weishu Wang
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031010.
Paper No: EP-22-1097
DOI: https://doi.org/10.1115/1.4062108
Published Online: March 30, 2023
View Article titled, Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
Click here to open pdf in another window PDF for Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope
Topics: Fibers, Heat, Satellites, Temperature, Temperature control, Thermoelectric coolers, Temperature controls
Journal Articles

High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology

Xuesong Zhang, Qian Wang, Chenhui Xia, Chaojie Zhou, Gang Wang, Jian Cai
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031009.
Paper No: EP-22-1039
DOI: https://doi.org/10.1115/1.4056991
Published Online: March 20, 2023
View Article titled, High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology
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Topics: Design, Dipoles (Electromagnetism), Manufacturing, Millimeter waves, Packaging, Radiation (Physics), Signals, Simulation, Warping, Waveguides
Journal Articles

Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications

Khalid Alzoubi, Alexander Hensel, Felix Häußler, Bettina Ottinger, Marcel Sippel, Jörg Franke
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031008.
Paper No: EP-22-1082
DOI: https://doi.org/10.1115/1.4056992
Published Online: March 8, 2023
View Article titled, Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
Click here to open pdf in another window PDF for Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications
Topics: Electronics, Experimental design, Intermetallic compounds, Optimization, Pressure, Shear strength, Silver, Sintering, Temperature, Failure
Journal Articles

A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique

Sushil Doranga, Dongji Xie, Jeffrey Lee, Andy Zhang, Xue Shi, Valeriy Khaldarov
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031007.
Paper No: EP-22-1070
DOI: https://doi.org/10.1115/1.4056886
Published Online: March 7, 2023
View Article titled, A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique
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Topics: Excitation, Fatigue life, Fatigue testing, Finite element analysis, Finite element model, Modeling, Resonance, Simulation, Solder joints, Stress
Journal Articles

Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics

Behnam Garakani, Udara S. Somarathna, Ashraf Umar, Gurvinder Singh Khinda, Mohamed Youssef M. Abdelatty, El Mehdi Abbara, Sari Al Zerey, Mike Hopkins, Sai Srinivas, Chuck Kinzel, Christopher Halseth, Mark Ronay, Mark D. Poliks
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031006.
Paper No: EP-22-1008
DOI: https://doi.org/10.1115/1.4056640
Published Online: February 1, 2023
View Article titled, Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
Click here to open pdf in another window PDF for Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics
Topics: Fatigue, Liquid metals, Tension, Transmission lines, Cycles, Fatigue testing, Reliability, Wearable devices, Metals, Simulation
Journal Articles

Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches

Xin Wei, Sa'd Hamasha, Ali Alahmer, Mohamed El Amine Belhadi
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031005.
Paper No: EP-22-1066
DOI: https://doi.org/10.1115/1.4056559
Published Online: January 27, 2023
View Article titled, Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
Click here to open pdf in another window PDF for Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches
Topics: Ball-Grid-Array packaging, Cycles, Fatigue, Finishes, Solder joints, Stress, Fatigue life, Solders, Alloys
Journal Articles

Mandrel Bend Test of Screen-Printed Silver Conductors

Rui Chen, Justin Chow, Yi Zhou, Suresh K. Sitaraman
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031004.
Paper No: EP-22-1072
DOI: https://doi.org/10.1115/1.4056530
Published Online: January 11, 2023
View Article titled, Mandrel Bend Test of Screen-Printed Silver Conductors
Click here to open pdf in another window PDF for Mandrel Bend Test of Screen-Printed Silver Conductors
Topics: Cycles, Flexible electronics, Silver, Reliability, Inks, Damage, Imaging
Journal Articles

Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications

Giuseppe Mauromicale, Michele Calabretta, Giuseppe Scarcella, Giacomo Scelba, Alessandro Sitta
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031003.
Paper No: EP-22-1049
DOI: https://doi.org/10.1115/1.4056413
Published Online: December 23, 2022
View Article titled, Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
Click here to open pdf in another window PDF for Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications
Topics: Power semiconductor devices, Simulation, Design, Automotive industry, System-in-package, Thermomechanics, Cycles
Journal Articles

Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks

Inderjot Kaur, Shiraz Mujahid, YubRaj Paudel, Hongjoo Rhee, Prashant Singh
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031002.
Paper No: EP-22-1051
DOI: https://doi.org/10.1115/1.4056305
Published Online: December 21, 2022
View Article titled, Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
Click here to open pdf in another window PDF for Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks
Topics: Flow (Dynamics), Fluids, Heat transfer, Heat transfer coefficients, Topology, Temperature
Journal Articles

Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging

Gangli Yang, Xiaoyan Li, Xu Han, Hu Zhang, Linjie Wen, Shanshan Li
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. September 2023, 145(3): 031001.
Paper No: EP-22-1057
DOI: https://doi.org/10.1115/1.4056329
Published Online: December 9, 2022
View Article titled, Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging
Click here to open pdf in another window PDF for Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu 41 Sn 11 /Cu Solder Joint During High-Temperature Aging
Topics: Mechanical properties, Solder joints, Tin, High temperature, Shear strength
Journal Articles

Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization

Pradeep Lall, Kartik Goyal, Curtis Hill
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021011.
Paper No: EP-22-1029
DOI: https://doi.org/10.1115/1.4055986
Published Online: November 23, 2022
View Article titled, Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
Click here to open pdf in another window PDF for Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization
Topics: Copper, Sintering, Surface mount devices, Electrical resistivity, Printing, Drops, Electronics
Journal Articles

Effective Constitutive Relations for Sintered Nano Copper Joints

Sanoop Thekkut, Rajesh Sharma Sivasubramony, Arun Raj, Yuki Kawana, Jones Assiedu, Kabir Mirpuri, Ninad Shahane, Patrick Thompson, Peter Borgesen
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021010.
Paper No: EP-22-1043
DOI: https://doi.org/10.1115/1.4056113
Published Online: November 11, 2022
View Article titled, Effective Constitutive Relations for Sintered Nano Copper Joints
Click here to open pdf in another window PDF for Effective Constitutive Relations for Sintered Nano Copper Joints
Topics: Constitutive equations, Copper, Creep, Deformation, Diffusion (Physics), Oxidation, Stress, Temperature, Transients (Dynamics), Sintering
Journal Articles

A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers

Soumya Bandyopadhyay, Justin A. Weibel
Journal: Journal of Electronic Packaging
Article Type: Research-Article
J. Electron. Packag. June 2023, 145(2): 021009.
Paper No: EP-22-1047
DOI: https://doi.org/10.1115/1.4055987
Published Online: November 1, 2022
View Article titled, A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
Click here to open pdf in another window PDF for A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers
Topics: Heat, Transients (Dynamics), Temperature, Anisotropy