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Just Accepted Manuscript
Research-Article May 15, 2023
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4062530
Research-Article May 15, 2023
Coupled Electrical-Thermal-Fluidic Multi-Physics Analysis Of TSV Pin Fin Microchannel In The 3D-Ic
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4062531
Review Articles May 15, 2023
Recent Advances And Trends In Chiplet Design And Heterogeneous Integration Packaging
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4062529
Research-Article April 21, 2023
Multi-level Embedded 3d Manifold Microchannel Heat Sink of Aln Direct Bonded Copper for the High-power Electronic Module
J. Electron. Packag.
doi: https://doi.org/10.1115/1.4062384
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Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling
J. Electron. Packag (December 2023)
