This study focuses on thermomechanical effects in cryopreservation associated with a novel approach of volumetric heating by means on nanoparticles in an alternating electromagnetic field. This approach is studied for the application of cryopreservation by vitrification, where the crystalline phase is completely avoided—the cornerstone of cryoinjury. Vitrification can be achieved by quickly cooling the material to cryogenic storage, where ice cannot form. Vitrification can be maintained at the end of the cryogenic protocol by quickly rewarming the material back to room temperature. The magnitude of the rewarming rates necessary to maintain vitrification is much higher than the magnitude of the cooling rates that are required to achieve it in the first place. The most common approach to achieve the required cooling and rewarming rates is by exposing the specimen's surface to a temperature-controlled environment. Due to the underlying principles of heat transfer, there is a size limit in the case of surface heating beyond which crystallization cannot be prevented at the center of the specimen. Furthermore, due to the underlying principles of solid mechanics, there is a size limit beyond which thermal expansion in the specimen can lead to structural damage and fractures. Volumetric heating during the rewarming phase of the cryogenic protocol can alleviate these size limitations. This study suggests that volumetric heating can reduce thermomechanical stress, when combined with an appropriate design of the thermal protocol. Without such design, this study suggests that the level of stress may still lead to structural damage even when volumetric heating is applied. This study proposes strategies to harness nanoparticles heating in order to reduce thermomechanical stress in cryopreservation by vitrification.
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January 2016
Research-Article
Thermomechanical Stress in Cryopreservation Via Vitrification With Nanoparticle Heating as a Stress-Moderating Effect
David P. Eisenberg,
David P. Eisenberg
Biothermal Technology Laboratory,
Department of Mechanical Engineering,
Carnegie Mellon University,
Pittsburgh, PA 15213
Department of Mechanical Engineering,
Carnegie Mellon University,
Pittsburgh, PA 15213
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John C. Bischof,
John C. Bischof
Bioheat and Mass Transfer Laboratory,
Department of Mechanical Engineering,
University of Minnesota,
Minneapolis, MN 55455
Department of Mechanical Engineering,
University of Minnesota,
Minneapolis, MN 55455
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Yoed Rabin
Yoed Rabin
Biothermal Technology Laboratory,
Department of Mechanical Engineering,
Carnegie Mellon University,
Pittsburgh, PA 15213
e-mail: rabin@cmu.edu
Department of Mechanical Engineering,
Carnegie Mellon University,
Pittsburgh, PA 15213
e-mail: rabin@cmu.edu
Search for other works by this author on:
David P. Eisenberg
Biothermal Technology Laboratory,
Department of Mechanical Engineering,
Carnegie Mellon University,
Pittsburgh, PA 15213
Department of Mechanical Engineering,
Carnegie Mellon University,
Pittsburgh, PA 15213
John C. Bischof
Bioheat and Mass Transfer Laboratory,
Department of Mechanical Engineering,
University of Minnesota,
Minneapolis, MN 55455
Department of Mechanical Engineering,
University of Minnesota,
Minneapolis, MN 55455
Yoed Rabin
Biothermal Technology Laboratory,
Department of Mechanical Engineering,
Carnegie Mellon University,
Pittsburgh, PA 15213
e-mail: rabin@cmu.edu
Department of Mechanical Engineering,
Carnegie Mellon University,
Pittsburgh, PA 15213
e-mail: rabin@cmu.edu
1Corresponding author.
Manuscript received July 12, 2015; final manuscript received November 18, 2015; published online December 8, 2015. Assoc. Editor: Hai-Chao Han.
J Biomech Eng. Jan 2016, 138(1): 011010 (8 pages)
Published Online: December 8, 2015
Article history
Received:
July 12, 2015
Revised:
November 18, 2015
Citation
Eisenberg, D. P., Bischof, J. C., and Rabin, Y. (December 8, 2015). "Thermomechanical Stress in Cryopreservation Via Vitrification With Nanoparticle Heating as a Stress-Moderating Effect." ASME. J Biomech Eng. January 2016; 138(1): 011010. https://doi.org/10.1115/1.4032053
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