Precision Grinding of Ultra-Thin Quartz Wafers

[+] Author and Article Information
T. G. Bifano, J. B. Hosler

Precision Engineering Laboratory, Aerospace and Mechanical Engineering Department, Boston University, Boston, MA 02215

J. Eng. Ind 115(3), 258-262 (Aug 01, 1993) (5 pages) doi:10.1115/1.2901658 History: Received July 01, 1992; Online April 08, 2008


For bulk acoustic wave quartz resonators, the central resonant frequency is inversely proportional to the wafer thickness. The tolerance of the resonant frequency is directly proportional to the total thickness variation of the quartz wafer. To increase the operating frequency while preserving a high tolerance on frequency, thinner quartz wafers with better thickness tolerances are needed. This paper describes the design and implementation of a precision grinding apparatus capable of producing ultra-thin quartz wafers to better thickness tolerances than previously achieved. A distributed-stress fixturing method that permits machining of ultra-thin, brittle substrates is described. The machine’s precision has been achieved through a high stiffness structural loop and real-time position feedback control. Optical interferometry is used in a new technique to measure thickness variation over the entire wafer. This research will enable production of quartz crystal oscillators with higher frequencies and better quality for the resonator industry.

Copyright © 1993 by The American Society of Mechanical Engineers
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In