Thermal Aspects of Grinding: The Effect of the Wheel Bond on Heat Transfer to an Abrasive Grain

[+] Author and Article Information
M. W. Harris, A. S. Lavine

Department of Mechanical, Aerospace and Nuclear Engineering, University of California, Los Angeles, Los Angeles, CA 90024-1597

J. Eng. Ind 113(4), 395-401 (Nov 01, 1991) (7 pages) doi:10.1115/1.2899713 History: Received October 01, 1990; Online April 08, 2008


Heat generated during grinding can cause thermal damage to the workpiece and wheel. It is therefore important to understand the thermal aspects of grinding. This paper addresses heat conduction into the wheel, by considering a single abrasive grain in contact with the workpiece. In particular, the effect of the bond material on conduction into the grain is investigated. The results for the grain surface temperature are given in terms of parameters describing the geometry and thermal properties of the grain and bond. The beneficial effect of a high thermal conductivity for both the grain and the bond is clearly demonstrated.

Copyright © 1991 by The American Society of Mechanical Engineers
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