Thermal Analysis of the Grinding Process

[+] Author and Article Information
N. R. Des Ruisseaux, R. D. Zerkle

Department of Mechanical Engineering, University of Cincinnati, Cincinnati, Ohio

J. Eng. Ind 92(2), 428-433 (May 01, 1970) (6 pages) doi:10.1115/1.3427768 History: Received July 01, 1969; Online July 15, 2010


A theoretical thermal analysis of the grinding process is developed. The investigation considers temperature in the vicinity of chip formation and relates this temperature to the temperature experienced by the workpiece surface which remains after grinding. The relation is established by considering grinding geometry. The results indicate that temperatures predicted at the region of chip formation can be substantially greater than those which result on the surface of the remaining workpiece. Furthermore, the temperature in the workpiece at a distance of several ten-thousands below the surface are virtually unaffected by chip shear plane temperature.

Copyright © 1970 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In