... temperature and is subsequently cooled down to a lower temperature. The developed model can be helpful for stress-strain analyses and physical design of electronic and photonic assemblies of the type in question, and particularly those employed in holographic memory systems. Modeling of thermal stress...

... due to the generation of thermal stress, the initial variability, created during the film deposition process and not eliminated in the annealing, is a substantial part of this. Additional discrepancies may be due to other idealizations in the model. For example, the film thickness and grain size...

...B. Neethi Simon; K. Ramesh Transient thermal stresses of a bimaterial specimen with interface cracks, under uniform cooling by convection, are analyzed by photothermoelasticity and a coupled temperature-displacement, finite element scheme. The stress intensity factors of the interface crack...

... that, in the presence of thermal stresses, the J k domain integral over a closed path, which does not enclose singularities, is a function of temperature and body force. A method is proposed to compute the stress intensity factors for bimaterial interface crack subjected to thermal loading by combining this domain...

... lightweight structures nickel alloys niobium alloys silicon compounds stoichiometry active cooling lightweight structures sandwich panels hypersonics multi-functional optimization thermal stresses materials selection Components that experience extreme heat flux, while simultaneously...

...Fumihiro Ashida; Sei-ichiro Sakata; Kouhei Matsumoto In order to realize a plan for a hypersonic aircraft, development of a smart heat-resisting plate possible to control a thermal stress has been required because the safety of structural members must be secured even if they are exposed to a severe...

... these vibrations and determine the stresses they provoke. The proposed procedure relies on three main steps: an exact solution for the temperature field is first obtained, by means of Fourier–Bessel expansions; quasistatic thermal stresses are then computed as a function of the calculated temperature distribution...

... 10.1063/1.362938 , 80 , pp. 1388 – 1398 . Wikstrom , A. , Gudmundson , P. , and Suresh , S. , 1999 , “ Analysis of Average Thermal Stresses in Passivated Metal Interconnects ,” J. Appl. Phys. 0021-8979 10.1063/1.371658 , 86 , pp. 6088 – 6095 . Park , T.-S...

.... In the set of Eqs. 18 , the thermal stress is related through the pre-buckling terms such as N 0 x and N 0 s in N L 0 . The edges of the nano-tubes are assumed to be simply supported and the buckling of the carbon nanotubes under two types of temperature distributions...

... subjected to uniform heat flow and moisture transfer in the x 1 - x 2 plane or x 3 direction are now obtained. With these solutions three typical numerical examples are illustrated and compared by ANSYS finite element software package. 23 03 2005 28 06 2005 laminates thermal stresses...

.... , 1970 , “ Numerical Inversion of Laplace Transforms ,” Commun. ACM , 13 , pp. 47 – 49 ; 13 , p. 624 624 . porous materials anisotropic media thermoelasticity porosity thermal stresses heat transfer thermal expansion diffusion A great deal of attention has been...

..., Theory of Thermal Stresses , Krieger, Malabar, FL. Chadwick, P. C., 1960, “Thermoelasticity, the Dynamical Theory,” in Progress in Solid Mechanics , Sneddon, I. N. and Hill, R., North–Holland, Amsterdam, Vol. 1. van der Pol, B...

.... The problem of determining thermal stresses is thus reduced to the problem of a laminated beam subjected to the external axial forces and moments as shown in Fig. 2b . In developing the theory and experiments of the condition of delamination growth, not only the total energy release rate but its mode I...

... solidification, and the use of a second reference temperature, which is the melting point of the target material for computing the thermal stress of the resolidified material. This finite element model is used to simulate a pulsed laser bending process, during which the curvature of a thin stainless steel plate...

... element analysis integration Newton-Raphson method laminates vectors thermoelasticity thermal stresses elastic deformation The sudden application of a heat flux to a structure modeled as a beam, plate, or shell has the tendency to cause the structure to vibrate. This phenomenon is called...

..., a thermal stress model is used to study the temperature effect on wound roll stresses. Key inputs to the models are the stack modulus, contact clearance, and air film reference clearance. A method is developed to measure these key model inputs. Results of a parametric study show that among the processing...

..., Mar. 31, 2003. Associate Editor: J. R. Barber. 16 Sep 2002 31 Mar 2003 10 10 2003 thermal stresses thermal shock stress analysis temperature distribution polynomials reviews failure (mechanical) A number of studies on the thermal shock behavior of finite...

...J. P. Blanchard Rapid surface heating will induce waves in an elastic material. Closed-form solutions for the resulting longitudinal and transverse thermal stresses are derived using Laplace Transforms. The model is one-dimensional, consisting of a half-space subjected to a step change...

..., August 14, 2001; final revision, December 16, 2002. Associate Editor: V. K. Kinra. 14 August 2001 16 December 2002 25 08 2003 stress analysis internal stresses modelling elasticity thermal stresses thermoelasticity Web materials are wound onto rolls for storage...

...S. Itou, Professor, Axially symmetric thermal stresses in the vicinity of a finite cylindrical crack in an elastic pipe are calculated. The surfaces of the crack are assumed to be insulated. The outer surface of the pipe is heated so as to maintain a constant temperature T d , and the inner surface...