Search Results | InterPACK | ASME Digital Collection

1-20 of 36

Sort by

Sort Order Select

Proceedings Papers

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

Bin Xie, Haochen Liu, Xiao Wei Sun, Xingjian Yu, Kai Wang, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A006, August 27–30, 2018

Paper No: IPACK2018-8301

DOI: https://doi.org/10.1115/IPACK2018-8301

View Paper

Topics: Temperature, Phosphors, Silicones, Light sources, Light-emitting diodes, Nanoparticles, Quantum dots, Rendering, Shells, Stability

Proceedings Papers

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Piyas Chowdhury, Kamal Sikka, Anuja De Silva, Indira Seshadri

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A007, August 27–30, 2018

Paper No: IPACK2018-8337

DOI: https://doi.org/10.1115/IPACK2018-8337

View Paper

Topics: Algorithms, Fillers (Materials), Packing (Shipments), Packings (Cushioning), Design, Elastic moduli, Heat, Thermal conductivity, Viscosity, Errors

Proceedings Papers

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Xingjian Yu, Run Hu, Ruikang Wu, Bin Xie, Xiaoyu Zhang, Xiaobing Luo

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A001, August 27–30, 2018

Paper No: IPACK2018-8211

DOI: https://doi.org/10.1115/IPACK2018-8211

View Paper

Topics: Light-emitting diodes, Packaging, Silicones, Wetting, Coating processes, Coatings, Phosphors, Domes (Structural elements), Geometry, Particulate matter

Proceedings Papers

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Hao Huang, Qian Jiang, Abhijit Dasgupta, Ehsan Mirbagheri, Krishna Darbha

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A008, August 27–30, 2018

Paper No: IPACK2018-8345

DOI: https://doi.org/10.1115/IPACK2018-8345

View Paper

Topics: Adhesives, Creep, Pressure, Stress, Bonding, Hydrostatics, Temperature, Cavitation, Cavities, Design

Proceedings Papers

Effect of Interfacial Thermal Conductance Between the Nanoparticles

Anil Yuksel, Edward T. Yu, Michael Cullinan, Jayathi Murthy

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 27–30, 2018

Paper No: IPACK2018-8212

DOI: https://doi.org/10.1115/IPACK2018-8212

View Paper

Topics: Nanoparticles, Thermal conductivity, Heat, Heat transfer, Heat conduction, Radiation (Physics), Thermal management

Proceedings Papers

Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

Hao Cheng, Zi Zhou Yang, Yang Peng, Yun Mou, Ming Xiang Chen

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A003, August 27–30, 2018

Paper No: IPACK2018-8226

DOI: https://doi.org/10.1115/IPACK2018-8226

View Paper

Topics: Cements (Adhesives), Ceramics, Low temperature, Manufacturing, Packaging, Ultraviolet radiation, Shear strength, Hardening (Curing), Heat, Light-emitting diodes

Proceedings Papers

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Huayan Wang, Shuai Shao, Vanlai Pham, Panju Shang, Cheng Zhong, Seungbae Park

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A004, August 27–30, 2018

Paper No: IPACK2018-8257

DOI: https://doi.org/10.1115/IPACK2018-8257

View Paper

Topics: Packaging, Corners (Structural elements), Finite element analysis, Deformation, Delamination, Fracture (Materials), Fracture (Process), Reliability, Damage, Electronics

Proceedings Papers

Lidded vs. Lidless: A Thermal Study

Xiaopeng Huang, Vadim Gektin

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 27–30, 2018

Paper No: IPACK2018-8294

DOI: https://doi.org/10.1115/IPACK2018-8294

View Paper

Topics: Design, Junctions, Packaging, Thermal resistance

Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017

Paper No: IPACK2017-74133

DOI: https://doi.org/10.1115/IPACK2017-74133

View Paper

Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling

Proceedings Papers

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Nilabh Roy, Obehi Dibua, Chee Seng Foong, Michael Cullinan

Paper No: IPACK2017-74173

DOI: https://doi.org/10.1115/IPACK2017-74173

View Paper

Topics: Lasers, Manufacturing, Microscale devices, Sintering, Fluence (Radiation measurement), Additive manufacturing, Copper, Density, Design, Energy dissipation

Proceedings Papers

Advanced Cooling of 3D ICs With Nanoparticle Packings

Anil Yuksel, Paul S. Ho, Jayathi Murthy

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A025, August 29–September 1, 2017

Paper No: IPACK2017-74137

DOI: https://doi.org/10.1115/IPACK2017-74137

View Paper

Topics: Cooling, Nanoparticles, Packings (Cushioning), Energy dissipation, Heat, Thermal management, Dimensions, High temperature, Phonons, Polaritons

Proceedings Papers

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Pradeep Lall, Vikas Yadav, Di Zhang, Jeff Suhling

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A017, August 29–September 1, 2017

Paper No: IPACK2017-74233

DOI: https://doi.org/10.1115/IPACK2017-74233

View Paper

Topics: Alloys, High temperature, Lead-free solders, Vibration, Temperature, Electronics, Vehicles, Solder joints, Solders, Automotive industry

Proceedings Papers

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Adam Morgan, Leila Choobineh, David Fresne, Douglas C. Hopkins

Paper No: IPACK2017-74222

DOI: https://doi.org/10.1115/IPACK2017-74222

View Paper

Topics: Temperature distribution, Electronic packaging, Packaging, Power density, Power semiconductor devices, Power conversion systems, Temperature, Computer simulation, Density, Gallium nitride

Proceedings Papers

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder

Nianjun Fu, Jing Wu, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall

Paper No: IPACK2017-74266

DOI: https://doi.org/10.1115/IPACK2017-74266

View Paper

Topics: Lead-free solders, Tin, Cross section (Physics), Microscopy, Particulate matter, Cooling, Intermetallic compounds, Nanoindentation, Polishing, Scanning electron microscopy

Proceedings Papers

The Effect of Surface Texture on Thermal Sensation and Comfort

Han Zhang, Alan Hedge

Paper No: IPACK2017-74179

DOI: https://doi.org/10.1115/IPACK2017-74179

View Paper

Topics: Computers, Heat, Surface roughness, Surface texture, Surfaces (Materials), Temperature

Proceedings Papers

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Deng Yun Chen, Michael Osterman

Paper No: IPACK2017-74249

DOI: https://doi.org/10.1115/IPACK2017-74249

View Paper

Topics: Ball-Grid-Array packaging, Corners (Structural elements), Fatigue life, Solder joints, Solders, Adhesives, Failure, Materials properties, Stress, Temperature

Proceedings Papers

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

Hiroki Kikuchi, Kazuhiko Sasagawa, Kazuhiro Fujisaki

Paper No: IPACK2017-74059

DOI: https://doi.org/10.1115/IPACK2017-74059

View Paper

Topics: Current density, Damage, Electrodiffusion, Metals, Evaluation methods, Atoms, Circuit design, Computer simulation, Density, Electrons

Proceedings Papers

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Jing Wang, Yuling Niu, Seungbae Park

Paper No: IPACK2017-74017

DOI: https://doi.org/10.1115/IPACK2017-74017

View Paper

Topics: Delamination, Reflow soldering, Fracture (Materials), Stress, Vapor pressure, Ball-Grid-Array packages, Displacement, Finite element analysis, Fracture mechanics, Lead-free solders

Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo

Paper No: IPACK2017-74196

DOI: https://doi.org/10.1115/IPACK2017-74196

View Paper

Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite

Proceedings Papers

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Ryuji Takaya, Kazuhiko Sasagawa, Kazuhiro Fujisaki, Takeshi Moriwaki

Paper No: IPACK2017-74092

DOI: https://doi.org/10.1115/IPACK2017-74092

View Paper

Topics: Current density, Damage, Electrodiffusion, Reservoirs, Shapes, Density, Anodes, Computer simulation

NARROW

Reduced Working Temperature of Quantum Dots-Light-Emitting Diodes Optimized by QDs@Silica-on-Chip Structure

On Thermal Interface Materials With Polydisperse Fillers: Packing Algorithm and Effective Properties

Cylindrical Tuber Encapsulant Layer Realization by Patterned Surface for COB-LEDs Packaging

Creep Response of Assemblies Bonded With Pressure Sensitive Adhesive (PSA)

Effect of Interfacial Thermal Conductance Between the Nanoparticles

Low Temperature Fabrication of Three-Dimensional Ceramic Substrate by Using Inorganic Alkali Activated Aluminosilicate Cement Paste for UV-LED Packaging

Quantification of Underfill Influence to Chip Packaging Interactions of WLCSP

Lidded vs. Lidless: A Thermal Study

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Preliminary Results on the Fabrication of Interconnect Structures Using Microscale Selective Laser Sintering

Advanced Cooling of 3D ICs With Nanoparticle Packings

Effect of Alloy Composition and Aging on the Survivability of Leadfree Solders in High Temperature Vibration in Automotive Environments

Numerical and Experimental Determination of Temperature Distribution in 3D Stacked Power Devices

Investigation of Aging Induced Evolution of the Microstructure of SAC305 Lead Free Solder

The Effect of Surface Texture on Thermal Sensation and Comfort

Effect of Corner Staking on the Fatigue Life of BGA Under Thermal Cycling

Analysis for Evaluation of Threshold Current Density of Electromigration Damage in Taper-Shaped Metal Line

An Investigation of Moisture-Induced Interfacial Delamination in Plastic IC Package During Solder Reflow

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Relationship Between Threshold Current Density of Electromigration Damage Considering Void and Hillock Formation and Reservoir Shape in Interconnect Line

Journals

Conference Proceedings

eBooks

Resources

Opportunities

Journals

Conference Proceedings

eBooks

Resources

Opportunities

This Feature Is Available To Subscribers Only