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Proceedings Papers

Melt Front Enhancement of Phase Change Materials via Nanoparticle Inclusion for Improved Heat Transfer and Cyclability

Joshua Kasitz, Larry Marshall, Jr., David Huitink
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A002, October 25–27, 2022
Paper No: IPACK2022-97399
DOI: https://doi.org/10.1115/IPACK2022-97399
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Topics: Cooling, Heat transfer, Nanoparticles, Phase change materials, Thermal conductivity
Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Paper No: IPACK2021-73252
DOI: https://doi.org/10.1115/IPACK2021-73252
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

Phase Change Material’s (PCMs) Effectiveness Index for Rapid Assessment in Thermal Management of Transient Pulse Electronics

Adrian Olivera, Jhonathan Rosales, Pedro O. Quintero
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A003, October 26–28, 2021
Paper No: IPACK2021-69321
DOI: https://doi.org/10.1115/IPACK2021-69321
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Topics: Design, Electronics, Heat, Phase change materials, Thermal management, Transients (Dynamics)
Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Paper No: IPACK2020-2562
DOI: https://doi.org/10.1115/IPACK2020-2562
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Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity
Proceedings Papers

System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities in the Next Generation of Electric and Hybrid Electric Vehicles

Bakhtiyar Mohammad Nafis, Ange-Christian Iradukunda, Imam Al Razi, David R. Huitink, Yarui Peng
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T08A003, October 7–9, 2019
Paper No: IPACK2019-6429
DOI: https://doi.org/10.1115/IPACK2019-6429
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Topics: Electronics, Hybrid electric vehicles, Reliability, Thermal management, Phase change materials, Cooling, Temperature, Electronic packaging, Heat, Automobiles
Proceedings Papers

Evaluation of Thermal and Electrical Properties of Nano-Enhanced PCM for Usage in High-Voltage Systems

Ange-Christian Iradukunda, Josh Kasitz, Fernando Moreno, David Huitink
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A010, October 7–9, 2019
Paper No: IPACK2019-6422
DOI: https://doi.org/10.1115/IPACK2019-6422
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Topics: Electrical properties, Electronic packages, Electronics, Graphene, Heat, Iron, Latent heat, Nanocomposites, Particulate matter, Phase change materials
Proceedings Papers

Metallic PCM’s Microstructural Stability Under Repetitive Melting/Solidification Cycles

Rafael Báez, Luis E. González, Pedro O. Quintero, Lauren M. Boteler
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A005, October 7–9, 2019
Paper No: IPACK2019-6385
DOI: https://doi.org/10.1115/IPACK2019-6385
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Topics: Cooling, Cycles, Melting, Solidification, Stability, Thermal stability, Alloys, Metals, Temperature, Thermal management
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
DOI: https://doi.org/10.1115/IPACK2017-74196
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Voiding Effects on the Thermal Response of Metallic Phase Change Materials Under Pulsed Power Loading

David Gonzalez-Nino, Lauren M. Boteler, Nicholas R. Jankowski, Dimeji Ibitayo, Pedro O. Quintero
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, August 29–September 1, 2017
Paper No: IPACK2017-74118
DOI: https://doi.org/10.1115/IPACK2017-74118
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Topics: Phase change materials, Heat, Silicon nitride ceramics, Temperature, Cooling, Cooling systems, Cycles, Inspection, Optical quality control, Temperature profiles
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Paper No: IPACK2017-74244
DOI: https://doi.org/10.1115/IPACK2017-74244
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Paper No: IPACK2015-48522
DOI: https://doi.org/10.1115/IPACK2015-48522
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Mechanical Characterization of Metal Foams for Contact Resistance in Thermal Interface Applications

Ninad Trifale, Eric Nauman, Kazuaki Yazawa
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A075, July 6–9, 2015
Paper No: IPACK2015-48535
DOI: https://doi.org/10.1115/IPACK2015-48535
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Topics: Contact resistance, Metal foams, Porosity, Fillers (Materials), Foams (Chemistry), Aluminum, Elastic moduli, Elasticity, Phase change materials, Simulation
Proceedings Papers

Numerical and Experimental Investigation of Shell-and-Tube Phase Change Material Thermal Storage Unit

Thomas H. Sherer, II, Yogendra Joshi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A051, July 6–9, 2015
Paper No: IPACK2015-48061
DOI: https://doi.org/10.1115/IPACK2015-48061
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Topics: Phase change materials, Shells, Thermal energy storage, Temperature, Transients (Dynamics), Enthalpy, Flow (Dynamics), Fluids, Heat transfer, Paraffin wax
Proceedings Papers

Mechanical Solution for Dealing With Phase Change Material Flow When Mounting Electrical Components

Paul J. Grosskreuz, Rui Zhou, Kelly J. Bronk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A076, July 6–9, 2015
Paper No: IPACK2015-48634
DOI: https://doi.org/10.1115/IPACK2015-48634
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Topics: Electrical components, Flow (Dynamics), Phase change materials, Cooling systems, Electronic components, Heat, Heat sinks, Servomotors, Temperature, Thermal systems
Proceedings Papers

The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials

Kieran Hess, Amy S. Fleischer
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A062, July 6–9, 2015
Paper No: IPACK2015-48082
DOI: https://doi.org/10.1115/IPACK2015-48082
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Topics: Energy storage, Nanoparticles, Viscosity, Multi-walled carbon nanotubes, Fluids, Graphite, Temperature, Currents, Heat transfer, Nanofibers
Proceedings Papers

Enhanced Melting for Transient Thermal Management

T. Rozenfeld, R. Hayat, Y. Kozak, G. Ziskind
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A063, July 6–9, 2015
Paper No: IPACK2015-48369
DOI: https://doi.org/10.1115/IPACK2015-48369
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Topics: Melting, Thermal management, Transients (Dynamics), Fins, Phase change materials, Heat transfer, Energy dissipation, Geometry, Heat, Latent heat
Proceedings Papers

Passive Thermal Management Using Phase Change Materials: Experimental Evaluation of Thermal Resistances

Yash Ganatra, Amy Marconnet
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A064, July 6–9, 2015
Paper No: IPACK2015-48499
DOI: https://doi.org/10.1115/IPACK2015-48499
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Topics: Phase change materials, Thermal management, Energy dissipation, Heat, Temperature, Thermal conductivity, Density, Energy consumption, Flow (Dynamics), Heat capacity
Proceedings Papers

Experimental Validation of a Detailed Phase Change Model on a Hardware Testbed

Charlie De Vivero, Fulya Kaplan, Ayse K. Coskun
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A086, July 6–9, 2015
Paper No: IPACK2015-48568
DOI: https://doi.org/10.1115/IPACK2015-48568
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Topics: Hardware, Temperature, Phase change materials, Thermal management, Complementary metal oxide semiconductors, Computation, Cooling, Design, Errors, Heat
Proceedings Papers

Reliability of Bonded Interfaces for Automotive Power Electronics

Douglas DeVoto, Paul Paret, Sreekant Narumanchi, Mark Mihalic
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T05A004, July 16–18, 2013
Paper No: IPACK2013-73143
DOI: https://doi.org/10.1115/IPACK2013-73143
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Topics: Electronics, Reliability, Cycles, Acoustics, Adhesives, Carbon fibers, Silver, Thermal resistance, Copper, Damage
Proceedings Papers

Development of a Hybrid PCM-Air Heat Sink

Y. Kozak, B. Abramzon, G. Ziskind
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 173-178, July 6–8, 2011
Paper No: IPACK2011-52097
DOI: https://doi.org/10.1115/IPACK2011-52097
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Topics: Heat sinks, Temperature, Heat, Melting, Energy dissipation, Phase change materials, Thermal management, Aluminum, Cooling, Delays