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Proceedings Papers

Transient Performance and Melt Front Characterization of Phase Change Materials

Tyler Stamps, David Huitink
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A005, October 26–28, 2021
Paper No: IPACK2021-73252
DOI: https://doi.org/10.1115/IPACK2021-73252
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Topics: Phase change materials, Transients (Dynamics), Matlab, Temperature, Computation, Computer simulation, Convection, Finite element analysis, Heat, Heat flux
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
DOI: https://doi.org/10.1115/IPACK2017-74196
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Numerical and Experimental Investigation of Shell-and-Tube Phase Change Material Thermal Storage Unit

Thomas H. Sherer, II, Yogendra Joshi
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A051, July 6–9, 2015
Paper No: IPACK2015-48061
DOI: https://doi.org/10.1115/IPACK2015-48061
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Topics: Phase change materials, Shells, Thermal energy storage, Temperature, Transients (Dynamics), Enthalpy, Flow (Dynamics), Fluids, Heat transfer, Paraffin wax
Proceedings Papers

The Influence of Nanoparticle Type on the Viscosity of Nanoenhanced Energy Storage Materials

Kieran Hess, Amy S. Fleischer
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A062, July 6–9, 2015
Paper No: IPACK2015-48082
DOI: https://doi.org/10.1115/IPACK2015-48082
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Topics: Energy storage, Nanoparticles, Viscosity, Multi-walled carbon nanotubes, Fluids, Graphite, Temperature, Currents, Heat transfer, Nanofibers
Proceedings Papers

Application of a Thermal Network Method to Thermal Analysis of Electronic Devices Using Phase Change Materials

Sadakazu Takakuwa, Masaru Ishizuka, Shinji Nakagawa, Kanji Takagi
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 471-477, July 19–23, 2009
Paper No: InterPACK2009-89218
DOI: https://doi.org/10.1115/InterPACK2009-89218
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Topics: Phase change materials, Thermal analysis, Fins, Temperature, Transients (Dynamics), Absorption, Cooling, Design, Electronic equipment, Energy dissipation
Proceedings Papers

Transient Performance of a Finned PCM Heat Sink

V. Shatikian, G. Ziskind, R. Letan
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 137-142, July 17–22, 2005
Paper No: IPACK2005-73113
DOI: https://doi.org/10.1115/IPACK2005-73113
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Topics: Heat sinks, Transients (Dynamics), Temperature, Melting, Fins, Phase change materials, Aluminum, Computer simulation, Density, Heat
Proceedings Papers

Artificial Neural Network Trained, Genetic Algorithms Optimized Thermal Energy Storage Heatsinks for Electronics Cooling

Jeevan Kanesan, Parthiban Arunasalam, Kankanhalli N. Seetharamu, Ishak A. Azid
Proc. ASME. InterPACK2005, Advances in Electronic Packaging, Parts A, B, and C, 1389-1395, July 17–22, 2005
Paper No: IPACK2005-73053
DOI: https://doi.org/10.1115/IPACK2005-73053
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Topics: Artificial neural networks, Computer cooling, Genetic algorithms, Thermal energy storage, Fins, Operating temperature, Optimization, Phase transition temperature, Computer simulation, Aluminum