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Proceedings Papers

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A010, October 25–27, 2022

Paper No: IPACK2022-97438

DOI: https://doi.org/10.1115/IPACK2022-97438

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Topics: Shock (Mechanics), Solders, Temperature, Operating temperature, Alloys, High temperature, Stress, Stress-strain curves, Testing, Aerospace industry

Proceedings Papers

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T10A013, October 25–27, 2022

Paper No: IPACK2022-97449

DOI: https://doi.org/10.1115/IPACK2022-97449

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Topics: Mechanical properties, Solders, Temperature, Alloys, Storage, Aerospace industry, Automotive industry, Constitutive equations, Finite element analysis, Low temperature materials

Proceedings Papers

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Nikhil R. Lakhkar

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A001, October 26–28, 2021

Paper No: IPACK2021-68870

DOI: https://doi.org/10.1115/IPACK2021-68870

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Topics: Cooling, Design, Electric vehicles, Hybrid electric vehicles, Vehicles, Compressors, Batteries, Electrification, HVAC equipment, Internal combustion engines

Proceedings Papers

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A022, October 26–28, 2021

Paper No: IPACK2021-74069

DOI: https://doi.org/10.1115/IPACK2021-74069

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Topics: Low temperature, Mechanical properties, Storage, Temperature, Alloys, Solders, Avionics, Climate, Design, Electronic packages

Proceedings Papers

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Pradeep Lall, Padmanava Choudhury, Jaimal Williamson

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A013, October 27–29, 2020

Paper No: IPACK2020-2676

DOI: https://doi.org/10.1115/IPACK2020-2676

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Topics: Ball-Grid-Array packaging, Composite building materials, Crack propagation, Damage, Delamination, Displacement, Electronics, Failure, Flip-chip, Fracture (Materials)

Proceedings Papers

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Pradeep Lall, Yunli Zhang, Haotian Wu, Ed Davis, Jeff Suhling

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A014, October 27–29, 2020

Paper No: IPACK2020-2677

DOI: https://doi.org/10.1115/IPACK2020-2677

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Topics: Damage, Design, Elastic moduli, Electronic components, Electronic packaging, Elongation, High temperature, Mechanical properties, Mechanical testing, Operating temperature

Proceedings Papers

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

Pradeep Lall, Vikas Yadav, Jeff Suhling, David Locker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, October 27–29, 2020

Paper No: IPACK2020-2658

DOI: https://doi.org/10.1115/IPACK2020-2658

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Topics: Alloys, Temperature, Operating temperature, Solders, Avionics, Constitutive equations, Electronic equipment, Electronics, Energy dissipation, Engines

Proceedings Papers

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

Pradeep Lall, Mrinmoy Saha, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A010, October 27–29, 2020

Paper No: IPACK2020-2659

DOI: https://doi.org/10.1115/IPACK2020-2659

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Topics: Alloys, Avionics, Climate, Design, Electronic packages, Electronic packaging, High temperature, Lead-free solders, Low temperature, Low temperature materials

Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Pradeep Lall, Vishal Mehta, Jeff Suhling, Ken Blecker

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 27–29, 2020

Paper No: IPACK2020-2660

DOI: https://doi.org/10.1115/IPACK2020-2660

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Topics: High temperature, Mechanical properties, Testing, Alloys, Operating temperature, Solders, Stress, Aerospace industry, Biomedicine, Electronic components

Proceedings Papers

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

Pradeep Lall, Madhu Kasturi, Haotian Wu, Ed Davis, Jeff Suhling

Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A012, October 27–29, 2020

Paper No: IPACK2020-2675

DOI: https://doi.org/10.1115/IPACK2020-2675

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Topics: Glass transition, High temperature, Mechanical properties, Optical microscopes, Oxidation, Viscoelasticity, Electronics, Operating temperature, Reliability, Storage

Proceedings Papers

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Pradeep Lall, Vishal Mehta, Jeff Suhling, David Locker

Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A011, October 7–9, 2019

Paper No: IPACK2019-6576

DOI: https://doi.org/10.1115/IPACK2019-6576

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Topics: Mechanical properties, Storage, Temperature, Alloys, Operating temperature, Electronic components, Electronics, High temperature, Lead-free solders, Shock (Mechanics)

Proceedings Papers

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Pratik V. Bansode, Jimil M. Shah, Gautam Gupta, Dereje Agonafer, Harsh Patel, David Roe, Rick Tufty

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A010, August 27–30, 2018

Paper No: IPACK2018-8432

DOI: https://doi.org/10.1115/IPACK2018-8432

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Topics: Temperature, Pumps, Cooling, Fluids, Failure, Operating temperature, Air pollution, Condensation, Corrosion, Data centers

Proceedings Papers

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Yusuke Nakajo, Jayati Athavale, Minami Yoda, Yogendra Joshi, Hiroaki Nishi

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T02A005, August 27–30, 2018

Paper No: IPACK2018-8305

DOI: https://doi.org/10.1115/IPACK2018-8305

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Topics: Cooling, Data centers, Energy efficiency, Temperature, Stress, Energy consumption, Internet of things, Air conditioning, Air flow, Cloud computing

Proceedings Papers

Thermal Characterization of Si BEOL Microelectronic Structures

Assaad El Helou, Peter E. Raad, Archana Venugopal, Dhishan Kande

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A002, August 27–30, 2018

Paper No: IPACK2018-8350

DOI: https://doi.org/10.1115/IPACK2018-8350

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Topics: Computer simulation, Design, Dimensions, Heat sinks, Operating temperature, Reliability, Resistors, Temperature, Thermal characterization, Thermal properties

Proceedings Papers

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

Mohammad S. Alam, K. M. Rafidh Hassan, Jeffrey C. Suhling, Pradeep Lall

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A020, August 27–30, 2018

Paper No: IPACK2018-8396

DOI: https://doi.org/10.1115/IPACK2018-8396

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Topics: Lead-free solders, Mechanical behavior, Temperature effects, High temperature, Solders, Temperature, Mechanical properties, Alloys, Stress, Tensile strength

Proceedings Papers

Practical Concerns for Adoption of Microjet Cooling

Stephen M. Walsh, James P. Smith, Eric A. Browne, Timothy W. Hennighausen, Bernard A. Malouin

Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A026, August 27–30, 2018

Paper No: IPACK2018-8468

DOI: https://doi.org/10.1115/IPACK2018-8468

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Topics: Cooling, Electronics, Erosion, Flux (Metallurgy), Heat, Numerical analysis, Operating temperature, Power density, Pressure, Robustness

Proceedings Papers

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Sandeep Mallampati, Liang Yin, David Shaddock, Harry Schoeller, Junghyun Cho

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A004, August 29–September 1, 2017

Paper No: IPACK2017-74169

DOI: https://doi.org/10.1115/IPACK2017-74169

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Topics: Electronics, High temperature, Alloys, Fracture (Materials), Deformation, Shear strength, Solders, Tension, Thermal conductivity, Brittleness

Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017

Paper No: IPACK2017-74196

DOI: https://doi.org/10.1115/IPACK2017-74196

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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite

Proceedings Papers

The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick

Joon Hong Boo, Hyun Gon Kim, Chang Woo Han

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A010, August 29–September 1, 2017

Paper No: IPACK2017-74095

DOI: https://doi.org/10.1115/IPACK2017-74095

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Topics: Computer cooling, Heat pipes, Stress, Thermal resistance, Fluids, Wire screens, Containers, Cooling, Copper, Density

Proceedings Papers

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

Pradeep Lall, Di Zhang, Jeff Suhling, David Locker

Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A009, August 29–September 1, 2017

Paper No: IPACK2017-74300

DOI: https://doi.org/10.1115/IPACK2017-74300

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Topics: Alloys, Storage, High temperature, Solders, Temperature, Deformation, Electronics, Operating temperature, Constitutive equations, Elastic moduli

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NARROW

High Strain Rate Properties and Evolution of Plastic-Work for Doped Solder SAC-Q for Isothermal Aging Up to 240-Days at 100°C

Effect of Aging on High Strain Rate Mechanical Properties of SAC+Bi Solders After Exposure to Isothermal Aging of 50°C Up To 120 Days

Thermal Design of Variable Frequency Drives for Hybrid and Electric Transport Applications

Determination of High and Low Temperature High Strain Rate Mechanical Properties for SAC-R After Exposure to Isothermal Aging of 50°C Up To 8 Months

Experimental Study of Crack Propagation at the PCB/Underfill Interface due to Thermal Aging

Degradation Mechanisms of Underfills Subjected to Isothermal Long-Term Aging From 150°C to 200°C

Evolution of Anand Parameters With Elevated Temperature Aging for SAC Leadfree Alloys

High Strain Rate Low Temperature Properties for SAC-R After Exposure to Isothermal Aging

High Strain Rate Mechanical Properties of SAC-Q Between -65°C and +200°C After Exposure to Isothermal Aging

Correlation of Microstructural Evolution With the Dynamic-Mechanical Viscoelastic Properties of Underfill Under Sustained High Temperature Operation

High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100°C

Measurement of the Thermal Performance of a Single-Phase Immersion Cooled Server at Elevated Temperatures for Prolonged Time

Improving Energy Efficiency in Data Centers by Controlling Task Distribution and Cooling

Thermal Characterization of Si BEOL Microelectronic Structures

Investigation of the Effects of High Temperature Aging on the Mechanical Behavior of Lead Free Solders

Practical Concerns for Adoption of Microjet Cooling

Lead-Free Alternatives for Interconnects in High-Temperature Electronics

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

The Performance Enhancement of a Heat Pipe for Power Electronics Cooling With a Partially Applied Hybrid Wick

Anand Parameters for SAC305 Alloys After Prolonged Storage up to 1-Year

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