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Proceedings Papers

Topology Optimization of Heat Sink for 3d Integrated Power Converters

Xiaoqiang Xu, Abdul Basit Mirza, Lingfeng Gao, Fang Luo, Shikui Chen
Proc. ASME. InterPACK2022, ASME 2022 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T09A009, October 25–27, 2022
Paper No: IPACK2022-98066
DOI: https://doi.org/10.1115/IPACK2022-98066
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Topics: Heat sinks, Optimization, Power converters, Topology, Design, Convection, Cooling, Computer simulation, Density, Filtration
Proceedings Papers

Thermal Model of the Package Integrated Cyclone COoler (PICCO): Achieving High Thermal Conductance Using Swirled Two-Phase Flow

Rinaldo L. Miorini, Darin J. Sharar, Peter deBock
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A012, October 27–29, 2020
Paper No: IPACK2020-2605
DOI: https://doi.org/10.1115/IPACK2020-2605
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Topics: Thermal conductivity, Two-phase flow, Flow (Dynamics), Additive manufacturing, Army, Boundary-value problems, Bubbles, Buoyancy, Capacitance, Collaboration
Proceedings Papers

Evaporation Rate Measurement at Multiple Scales Using Temperature-Sensitive Fluorescence Dyes

Youngjoon Suh, Cheng-Hui Lin, Hamsa Gowda, Yoonjin Won
Proc. ASME. InterPACK2019, ASME 2019 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 7–9, 2019
Paper No: IPACK2019-6372
DOI: https://doi.org/10.1115/IPACK2019-6372
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Topics: Evaporation, Fluorescence, Temperature, Microscale devices, Cooling, Vapors, Calibration, Cutting, Drying, Electronics
Proceedings Papers

Orientation Effects in Two-Phase Microgap Flow

Franklin L. Robinson, Avram Bar-Cohen
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A015, August 27–30, 2018
Paper No: IPACK2018-8383
DOI: https://doi.org/10.1115/IPACK2018-8383
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Topics: Flow (Dynamics), Gravity (Force), Coolers, Boiling, Cooling, Flux (Metallurgy), Heat, Aircraft, Fluids, Gravitational acceleration
Proceedings Papers

Effect of Interfacial Thermal Conductance Between the Nanoparticles

Anil Yuksel, Edward T. Yu, Michael Cullinan, Jayathi Murthy
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A002, August 27–30, 2018
Paper No: IPACK2018-8212
DOI: https://doi.org/10.1115/IPACK2018-8212
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Topics: Nanoparticles, Thermal conductivity, Heat, Heat transfer, Heat conduction, Radiation (Physics), Thermal management
Proceedings Papers

Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling

Nicolas Vayas Tobar, Pavolas N. Christidis, Nathaniel J. O'Connor, Michal Talmor, Jamal Seyed-Yagoobi
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A012, August 27–30, 2018
Paper No: IPACK2018-8322
DOI: https://doi.org/10.1115/IPACK2018-8322
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Topics: Computer cooling, Electrohydrodynamics, Heat conduction, Pumps, Flow (Dynamics), Flexible electronics, Microscale devices, Actuators, Biology, Biomedicine
Proceedings Papers

Evaporative Wicking Phenomena on Nanotextured Surfaces for Heat Pipe Applications

Duong Vy Le, Shiwei Zhang, Jonggyu Lee, Yoonjin Won
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A025, August 27–30, 2018
Paper No: IPACK2018-8456
DOI: https://doi.org/10.1115/IPACK2018-8456
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Topics: Cooling, Copper, Design, Electronics, Energy dissipation, Evaporation, Evaporative cooling, Heat, Heat conduction, Heat flux
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
DOI: https://doi.org/10.1115/IPACK2017-74196
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Inverse Conduction Heat Transfer and Kriging Interpolation Applied to Temperature Sensor Location in Microchips

D. Gonzalez Cuadrado, A. Marconnet, G. Paniagua
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A028, August 29–September 1, 2017
Paper No: IPACK2017-74224
DOI: https://doi.org/10.1115/IPACK2017-74224
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Topics: Heat conduction, Heat transfer, Integrated circuits, Interpolation, Temperature sensors, Temperature, Optimization, Sensors, Finite element analysis, Genetic algorithms
Proceedings Papers

Challenges in 3D Printing of High Conductivity Copper

Tahany El-Wardany, Ying She, Vijay Jagdale, Jacquelynn K. Garofano, Joe Liou, Wayde Schmidt
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A005, August 29–September 1, 2017
Paper No: IPACK2017-74306
DOI: https://doi.org/10.1115/IPACK2017-74306
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Topics: Additive manufacturing, Copper, Electrical conductivity, Thermal conductivity, Engines, Motors, Electromagnetic induction, Machinery, Aerospace industry, Electric vehicles
Proceedings Papers

State of the Art of Electronics Cooling for Radar Antenna Applications

Girish Upadhya, Clayton Pullins, Karl Freitag, George Hall, James Marthinuss
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A023, August 29–September 1, 2017
Paper No: IPACK2017-74080
DOI: https://doi.org/10.1115/IPACK2017-74080
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Topics: Computer cooling, Radar, Cooling, Heat flux, Defense industry, Design, Electronics, Refrigerants, Two-phase flow, Analytical methods
Proceedings Papers

Numerical Performance Characterization of an Innovative Micro-Scale Electrohydrodynamic Conduction Pumping Device

Michal Talmor, Jamal Yagoobi
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A024, August 29–September 1, 2017
Paper No: IPACK2017-74107
DOI: https://doi.org/10.1115/IPACK2017-74107
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Topics: Electrohydrodynamics, Heat conduction, Microscale devices, Performance characterization, Pumps, Electrodes, Fluids, Electronics, Flow (Dynamics), Aerospace industry
Proceedings Papers

Numerical Simulation of Advanced Monolithic Microcooler Designs for High Heat Flux Microelectronics

Sebastian Scholl, Catherine Gorle, Farzad Houshmand, Tanya Liu, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A009, July 6–9, 2015
Paper No: IPACK2015-48122
DOI: https://doi.org/10.1115/IPACK2015-48122
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Topics: Boundary-value problems, Computational fluid dynamics, Computer simulation, Cooling, Design, Fins, Flow (Dynamics), Fluid dynamics, Geometry, Heat conduction
Proceedings Papers

Computational Modeling of Extreme Heat Flux Microcooler for GaN-Based HEMT

Hyoungsoon Lee, Yoonjin Won, Farzad Houshmand, Catherine Gorle, Mehdi Asheghi, Kenneth E. Goodson
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A018, July 6–9, 2015
Paper No: IPACK2015-48670
DOI: https://doi.org/10.1115/IPACK2015-48670
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Topics: Computer simulation, Gallium nitride, Heat flux, Microcoolers, Microchannels, Simulation, Computational fluid dynamics, Flow (Dynamics), Fluids, Heat conduction
Proceedings Papers

Quantification of Phase Change Material Energy Storage Capability Using Multiphysics Simulations

W. E. O’Connor, A. P. Wemhoff
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A065, July 6–9, 2015
Paper No: IPACK2015-48522
DOI: https://doi.org/10.1115/IPACK2015-48522
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Topics: Energy storage, Engineering simulation, Phase change materials, Simulation, Thermal energy storage, Finite element analysis, Heat flux, Heating, Latent heat, Melting
Proceedings Papers

Full Scale Simulation of an Integrated Monolithic Heat Sink for Thermal Management of a High Power Density GaN-SiC Chip

Tanya Liu, Farzad Houshmand, Catherine Gorle, Sebastian Scholl, Hyoungsoon Lee, Yoonjin Won, Mehdi Asheghi, Kenneth Goodson, Hooman Kazemi, Kenneth Vanhille
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A057, July 6–9, 2015
Paper No: IPACK2015-48592
DOI: https://doi.org/10.1115/IPACK2015-48592
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Topics: Gallium nitride, Heat sinks, Power density, Simulation, Thermal management, Cooling, Flow (Dynamics), Microchannels, Design, Heat transfer
Proceedings Papers

Liquid Flow Analysis in Porous Media for Large Vapor Chamber With Multiple Heat Sources

Sergio Escobar, Niru Kumari, Rocky Shih, Sarah Anthony, Cullen Bash
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A060, July 6–9, 2015
Paper No: IPACK2015-48770
DOI: https://doi.org/10.1115/IPACK2015-48770
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Topics: Flow (Dynamics), Heat, Porous materials, Vapors, Cooling, Heat transfer, Approximation, Capillarity, Computational fluid dynamics, Design
Proceedings Papers

The Efficiency of Heat Transfer Through the Interface of Sintered Silver Nanoparticles

Tomasz Fałat, Przemysław Matkowski, Krzysztof Stojek, Jan Felba, Bartosz Płatek, Andrzej Mościcki
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A077, July 6–9, 2015
Paper No: IPACK2015-48732
DOI: https://doi.org/10.1115/IPACK2015-48732
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Topics: Heat transfer, Nanoparticles, Silver, Temperature, Junctions, Transistors, Copper, Heat conduction, Inspection, Structural analysis
Proceedings Papers

Electrical-Thermal-Reliability Co-Design for TSV-Based 3D-ICs

Tiantao Lu, Ankur Srivastava
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A037, July 6–9, 2015
Paper No: IPACK2015-48386
DOI: https://doi.org/10.1115/IPACK2015-48386
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Topics: Design, Reliability, Finite element methods, Stress, Circuits, Design methodology, Electrodiffusion, Flow (Dynamics), Heat conduction, Optimization
Proceedings Papers

Temperature Depression Under Heat Sources With Cylindrical Contact Thermocouples

Kayvan Abbasi, Sukhvinder Kang
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A006, July 6–9, 2015
Paper No: IPACK2015-48641
DOI: https://doi.org/10.1115/IPACK2015-48641
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Topics: Heat, Temperature, Thermocouples, Heat sinks, Temperature distribution, Approximation, Errors, Heat conduction, Heat transfer coefficients, Springs