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Proceedings Papers

Thermal Conductivity Prediction Model for Composite Thermal Interface Materials Using Copper Metal Foam

Shinya Kawakita, Yuki Ishizaka, Kazuyoshi Fushinobu
Proc. ASME. InterPACK2021, ASME 2021 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T06A002, October 26–28, 2021
Paper No: IPACK2021-70410
DOI: https://doi.org/10.1115/IPACK2021-70410
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Topics: Composite materials, Copper, Thermal conductivity
Proceedings Papers

Thermal Analysis of Wavy Thermal Management System With Phase Change Composite and Pyrolytic Graphite Sheet for Cylindrical Lithium-Ion Battery Packs

Damon Gresham-Chisolm, Sonya Smith
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T07A005, October 27–29, 2020
Paper No: IPACK2020-2565
DOI: https://doi.org/10.1115/IPACK2020-2565
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Topics: Composite materials, Graphite, Lithium-ion batteries, Thermal analysis, Thermal management, Cooling, Design, Heat, Batteries, Stress
Proceedings Papers

Effective Thermal Conductivity of Phase Change Material-Based Composites for High Heat Flux Electronic Cooling

Ayushman Singh, Srikanth Rangarajan, Leila Choobineh, Bahgat Sammakia
Proc. ASME. InterPACK2020, ASME 2020 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T05A001, October 27–29, 2020
Paper No: IPACK2020-2562
DOI: https://doi.org/10.1115/IPACK2020-2562
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Topics: Composite materials, Computer cooling, Heat flux, Heat sinks, Phase change materials, Thermal conductivity
Proceedings Papers

Nanoindentation Measurements of the Mechanical Properties of Individual Phases Within Lead Free Solder Joints Subjected to Isothermal Aging

Abdullah Fahim, Sudan Ahmed, Jeffrey C. Suhling, Pradeep Lall
Proc. ASME. InterPACK2018, ASME 2018 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T03A005, August 27–30, 2018
Paper No: IPACK2018-8408
DOI: https://doi.org/10.1115/IPACK2018-8408
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Topics: Lead-free solders, Mechanical properties, Nanoindentation, Tin, Solder joints, Particulate matter, Composite materials, Creep, Deformation, Elastic moduli
Proceedings Papers

Is the Heterogeneous Microstructure of SnAgCu (SAC) Solders Going to Pose a Challenge for Heterogeneous Integration?

Qian Jiang, Abhishek Deshpande, Abhijit Dasgupta
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A009, August 29–September 1, 2017
Paper No: IPACK2017-74133
DOI: https://doi.org/10.1115/IPACK2017-74133
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Topics: Solders, Anisotropy, Tin, Solder joints, Ball-Grid-Array packaging, Crystals, Temperature, Alloys, Composite materials, Cooling
Proceedings Papers

Optimization of Filling Mass Fraction for Composite PCMs Based Thermal Management System

Bofeng Shang, Jinyan Hu, Xingjian Yu, Bin Xie, Ruikang Wu, Xiaobing Luo
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T01A027, August 29–September 1, 2017
Paper No: IPACK2017-74196
DOI: https://doi.org/10.1115/IPACK2017-74196
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Topics: Composite materials, Optimization, Phase change materials, Thermal management, Thermal conductivity, Latent heat, Temperature, Heat flux, Cooling, Graphite
Proceedings Papers

Thermal Metamaterials for Heat Flow Control in Electronics

Ercan M. Dede, Feng Zhou, Paul Schmalenberg, Tsuyoshi Nomura
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A006, August 29–September 1, 2017
Paper No: IPACK2017-74112
DOI: https://doi.org/10.1115/IPACK2017-74112
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Topics: Electronics, Flow control, Heat, Metamaterials, Flow (Dynamics), Anisotropy, Blocks (Building materials), Circuit design, Composite materials, Design
Proceedings Papers

Optimization of Graphite Composite Latent Heat Storage Systems

Anne Mallow, Kyle Gluesenkamp, Omar Abdelaziz, Samuel Graham
Proc. ASME. InterPACK2017, ASME 2017 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, V001T04A002, August 29–September 1, 2017
Paper No: IPACK2017-74244
DOI: https://doi.org/10.1115/IPACK2017-74244
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Topics: Composite materials, Graphite, Latent heat, Optimization, Storage, Density, Temperature, Heat, Power density, Thermal conductivity
Proceedings Papers

Pre-Applied Inter Chip Fill for 3D-IC Chip Joining

Yasuhiro Kawase, Makoto Ikemoto, Masaya Sugiyama, Hidehiro Yamamoto, Hideki Kiritani
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T01A015, July 6–9, 2015
Paper No: IPACK2015-48738
DOI: https://doi.org/10.1115/IPACK2015-48738
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Topics: Joining, Pellet fusion, Thermal conductivity, Fillers (Materials), Aluminum, Boron, Composite materials, Cooling, Density, Epoxy adhesives
Proceedings Papers

Physics of Interfacial Heat Transfer Events in Flow Boiling of FC-72 Liquid in Microchannels

Sajjad Bigham, Saeed Moghaddam
Proc. ASME. InterPACK2015, Volume 2: Advanced Electronics and Photonics, Packaging Materials and Processing; Advanced Electronics and Photonics: Packaging, Interconnect and Reliability; Fundamentals of Thermal and Fluid Transport in Nano, Micro, and Mini Scales, V002T06A017, July 6–9, 2015
Paper No: IPACK2015-48581
DOI: https://doi.org/10.1115/IPACK2015-48581
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Topics: Boiling, Flow (Dynamics), Heat transfer, Microchannels, Physics, Bubbles, Evaporation, Heat flux, Resolution (Optics), Thermal conductivity
Proceedings Papers

A Numerical Study on the Thermal Conductivity of Hybrid-Filler-Nanoparticle Composite Materials

Ich-Long Ngo, Chan Byon
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A089, July 6–9, 2015
Paper No: IPACK2015-48740
DOI: https://doi.org/10.1115/IPACK2015-48740
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Topics: Composite materials, Fillers (Materials), Nanoparticles, Thermal conductivity, Particulate matter, Polymers
Proceedings Papers

A Composite Cu/HOPG Heat Spreader for Immersion Cooling of High Power Chips

Arthur Suszko, Mohamed S. El-Genk
Proc. ASME. InterPACK2015, Volume 1: Thermal Management, V001T09A088, July 6–9, 2015
Paper No: IPACK2015-48678
DOI: https://doi.org/10.1115/IPACK2015-48678
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Topics: Composite materials, Cooling, Flat heat pipes, Critical heat flux, Copper, Dielectric liquids, Graphite, Nucleate pool boiling, Numerical analysis, Surface roughness
Proceedings Papers

Lid-Integral Cold Plate Topology Integration, Performance, and Reliability

Gerd Schlottig, Marco de Fazio, Werner Escher, Paola Granatieri, Vijayeshwar D. Khanna, Thomas Brunschwiler
Proc. ASME. InterPACK2015, Volume 3: Advanced Fabrication and Manufacturing; Emerging Technology Frontiers; Energy, Health and Water- Applications of Nano-, Micro- and Mini-Scale Devices; MEMS and NEMS; Technology Update Talks; Thermal Management Using Micro Channels, Jets, Sprays, V003T10A004, July 6–9, 2015
Paper No: IPACK2015-48427
DOI: https://doi.org/10.1115/IPACK2015-48427
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Topics: Reliability, Topology, Silicon, Packaging, Composite materials, Cooling, Finite element model, Fracture (Materials), Fracture (Process), Gaskets
Proceedings Papers

Transparent Electrodes From Graphene/Single Wall Carbon Nanotube Composites

Hossein Sojoudi, Fernando Reiter, Samuel Graham
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T07A008, July 16–18, 2013
Paper No: IPACK2013-73158
DOI: https://doi.org/10.1115/IPACK2013-73158
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Topics: Composite materials, Electrodes, Graphene, Single-walled carbon nanotubes, Transparency, Single-walled nanotubes, Chemical vapor deposition, Electrical properties, Annealing, Heat conduction
Proceedings Papers

Enhanced Electrical and Thermal Interconnects by the Self-Assembly of Nanoparticle Necks Utilizing Capillary Bridging

Thomas Brunschwiler, Gerd Schlottig, Songbo Ni, Yu Liu, Javier V. Goicochea, Jonas Zürcher, Heiko Wolf
Proc. ASME. InterPACK2013, Volume 1: Advanced Packaging; Emerging Technologies; Modeling and Simulation; Multi-Physics Based Reliability; MEMS and NEMS; Materials and Processes, V001T03A001, July 16–18, 2013
Paper No: IPACK2013-73092
DOI: https://doi.org/10.1115/IPACK2013-73092
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Topics: Nanoparticles, Self-assembly, Columns (Structural), Evaporation, Particulate matter, Annealing, Bridges (Structures), Composite materials, Copper, Electronic packages
Proceedings Papers

Effect of Interfacial Layers on the Performance of Cu-In Liquid Phase Sintered Composites as Thermal Interface and Interconnect Materials

J. Liu, P. Kumar, I. Dutta, C. M. Nagaraj, R. Raj, M. Renavikar, R. Mahajan
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 2, 773-780, July 6–8, 2011
Paper No: IPACK2011-52221
DOI: https://doi.org/10.1115/IPACK2011-52221
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Topics: Composite materials, Solders, Sintering, Yield strength, Melting, Contact resistance, Diffusion (Physics), Electrical properties, Intermetallic compounds, Shear (Mechanics)
Proceedings Papers

Characterization of a Macrofiber Piezoelectric Composite

David A. Miller
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 437-441, July 6–8, 2011
Paper No: IPACK2011-52293
DOI: https://doi.org/10.1115/IPACK2011-52293
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Topics: Composite materials, Epoxy adhesives, Epoxy resins, Displacement measurement, Electrical measurement, Excitation, Fibers, Laminates, Resonance, Service life (Equipment)
Proceedings Papers

Thermo-Mechanical Fatigue Life Prediction of Orthotropic Composite Pin Fin Heat Sinks for Electronic Packaging

Sulaman Pashah, Abul Fazal M. Arif
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 271-279, July 6–8, 2011
Paper No: IPACK2011-52181
DOI: https://doi.org/10.1115/IPACK2011-52181
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Topics: Composite materials, Electronic packaging, Fatigue life, Heat sinks, Thermal stresses, Thermomechanics
Proceedings Papers

Ionic Polymer Metal Composite (IPMC) for MEMS Actuator and Sensor

Hiroki Yanamori, Takuma Kobayashi, Masaki Omiya
Proc. ASME. InterPACK2011, ASME 2011 Pacific Rim Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Systems, MEMS and NEMS: Volume 1, 417-424, July 6–8, 2011
Paper No: IPACK2011-52259
DOI: https://doi.org/10.1115/IPACK2011-52259
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Topics: Actuators, Metallic composites, Microelectromechanical systems, Polymers, Sensors, Electrodes, Electric fields, Membranes, Temperature, Composite materials
Proceedings Papers

Development of a Metal Micro-Textured Thermal Interface Material

R. Kempers, R. Frizzell, A. Lyons, A. J. Robinson
Proc. ASME. InterPACK2009, ASME 2009 InterPACK Conference, Volume 2, 587-595, July 19–23, 2009
Paper No: InterPACK2009-89366
DOI: https://doi.org/10.1115/InterPACK2009-89366
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Topics: Metals, Thermal conductivity, Fillers (Materials), Particulate matter, Composite materials, Deformation, Engineering prototypes, Flow (Dynamics), Manufacturing, Metal foil