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Proceedings Papers

Proceedings Volume Cover
ASME 2003 International Electronic Packaging Technical Conference and Exhibition
July 6–11, 2003
Maui, Hawaii, USA
Conference Sponsors:
  • Electronic and Photonic Packaging Division
ISBN:
0-7918-3690-8
2003 International Electronic Packaging Technical Conference and Exhibition, Volume 1

Education

InterPACK 2003; 7-10doi:https://doi.org/10.1115/IPACK2003-35333

Electrical Design, Simulation, and Test

InterPACK 2003; 11-15doi:https://doi.org/10.1115/IPACK2003-35125
InterPACK 2003; 17-23doi:https://doi.org/10.1115/IPACK2003-35154
InterPACK 2003; 25-31doi:https://doi.org/10.1115/IPACK2003-35204
InterPACK 2003; 33-36doi:https://doi.org/10.1115/IPACK2003-35207
InterPACK 2003; 37-41doi:https://doi.org/10.1115/IPACK2003-35222
InterPACK 2003; 43-46doi:https://doi.org/10.1115/IPACK2003-35332

Manufacturing and Test

InterPACK 2003; 47-51doi:https://doi.org/10.1115/IPACK2003-35025
InterPACK 2003; 53-59doi:https://doi.org/10.1115/IPACK2003-35083
InterPACK 2003; 61-64doi:https://doi.org/10.1115/IPACK2003-35117
InterPACK 2003; 65-71doi:https://doi.org/10.1115/IPACK2003-35137
InterPACK 2003; 73-80doi:https://doi.org/10.1115/IPACK2003-35206

Materials, Processes, and Technologies

InterPACK 2003; 81-86doi:https://doi.org/10.1115/IPACK2003-35005
InterPACK 2003; 87-91doi:https://doi.org/10.1115/IPACK2003-35009
InterPACK 2003; 93-99doi:https://doi.org/10.1115/IPACK2003-35011
InterPACK 2003; 101-107doi:https://doi.org/10.1115/IPACK2003-35030
InterPACK 2003; 109-114doi:https://doi.org/10.1115/IPACK2003-35038
InterPACK 2003; 115-121doi:https://doi.org/10.1115/IPACK2003-35046
InterPACK 2003; 123-130doi:https://doi.org/10.1115/IPACK2003-35061
InterPACK 2003; 131-136doi:https://doi.org/10.1115/IPACK2003-35087
InterPACK 2003; 137-140doi:https://doi.org/10.1115/IPACK2003-35120
InterPACK 2003; 141-145doi:https://doi.org/10.1115/IPACK2003-35126
InterPACK 2003; 147-153doi:https://doi.org/10.1115/IPACK2003-35130
InterPACK 2003; 155-160doi:https://doi.org/10.1115/IPACK2003-35165
InterPACK 2003; 161-167doi:https://doi.org/10.1115/IPACK2003-35188
InterPACK 2003; 169-176doi:https://doi.org/10.1115/IPACK2003-35192
InterPACK 2003; 177-182doi:https://doi.org/10.1115/IPACK2003-35193
InterPACK 2003; 183-189doi:https://doi.org/10.1115/IPACK2003-35238
InterPACK 2003; 191-195doi:https://doi.org/10.1115/IPACK2003-35261
InterPACK 2003; 197-201doi:https://doi.org/10.1115/IPACK2003-35262
InterPACK 2003; 203-208doi:https://doi.org/10.1115/IPACK2003-35336

Microelectromechanical Systems (MEMS) and Nanoscale Phenomena in Electronics

InterPACK 2003; 209-212doi:https://doi.org/10.1115/IPACK2003-35032
InterPACK 2003; 213-217doi:https://doi.org/10.1115/IPACK2003-35040
InterPACK 2003; 219-223doi:https://doi.org/10.1115/IPACK2003-35042
InterPACK 2003; 225-231doi:https://doi.org/10.1115/IPACK2003-35053
InterPACK 2003; 233-238doi:https://doi.org/10.1115/IPACK2003-35123
InterPACK 2003; 239-244doi:https://doi.org/10.1115/IPACK2003-35145
InterPACK 2003; 245-249doi:https://doi.org/10.1115/IPACK2003-35203
InterPACK 2003; 251-255doi:https://doi.org/10.1115/IPACK2003-35208
InterPACK 2003; 257-264doi:https://doi.org/10.1115/IPACK2003-35258
InterPACK 2003; 265-268doi:https://doi.org/10.1115/IPACK2003-35329
InterPACK 2003; 269-277doi:https://doi.org/10.1115/IPACK2003-35341

Modeling and Characterization

InterPACK 2003; 279-285doi:https://doi.org/10.1115/IPACK2003-35014
InterPACK 2003; 287-293doi:https://doi.org/10.1115/IPACK2003-35031
InterPACK 2003; 295-302doi:https://doi.org/10.1115/IPACK2003-35049
InterPACK 2003; 303-307doi:https://doi.org/10.1115/IPACK2003-35078
InterPACK 2003; 309-316doi:https://doi.org/10.1115/IPACK2003-35082
InterPACK 2003; 317-323doi:https://doi.org/10.1115/IPACK2003-35086
InterPACK 2003; 325-333doi:https://doi.org/10.1115/IPACK2003-35095
InterPACK 2003; 335-342doi:https://doi.org/10.1115/IPACK2003-35110
InterPACK 2003; 343-348doi:https://doi.org/10.1115/IPACK2003-35132
InterPACK 2003; 349-354doi:https://doi.org/10.1115/IPACK2003-35135
InterPACK 2003; 355-361doi:https://doi.org/10.1115/IPACK2003-35138
InterPACK 2003; 363-370doi:https://doi.org/10.1115/IPACK2003-35167
InterPACK 2003; 371-376doi:https://doi.org/10.1115/IPACK2003-35170
InterPACK 2003; 377-382doi:https://doi.org/10.1115/IPACK2003-35171
InterPACK 2003; 383-390doi:https://doi.org/10.1115/IPACK2003-35178
InterPACK 2003; 391-397doi:https://doi.org/10.1115/IPACK2003-35180
InterPACK 2003; 399-415doi:https://doi.org/10.1115/IPACK2003-35185
InterPACK 2003; 417-422doi:https://doi.org/10.1115/IPACK2003-35209
InterPACK 2003; 423-429doi:https://doi.org/10.1115/IPACK2003-35212
InterPACK 2003; 431-437doi:https://doi.org/10.1115/IPACK2003-35218
InterPACK 2003; 439-448doi:https://doi.org/10.1115/IPACK2003-35219
InterPACK 2003; 449-459doi:https://doi.org/10.1115/IPACK2003-35224
InterPACK 2003; 461-471doi:https://doi.org/10.1115/IPACK2003-35225
InterPACK 2003; 473-483doi:https://doi.org/10.1115/IPACK2003-35232
InterPACK 2003; 485-495doi:https://doi.org/10.1115/IPACK2003-35236
InterPACK 2003; 497-503doi:https://doi.org/10.1115/IPACK2003-35252
InterPACK 2003; 505-512doi:https://doi.org/10.1115/IPACK2003-35254
InterPACK 2003; 513-519doi:https://doi.org/10.1115/IPACK2003-35277
InterPACK 2003; 521-527doi:https://doi.org/10.1115/IPACK2003-35297
InterPACK 2003; 529-535doi:https://doi.org/10.1115/IPACK2003-35311
InterPACK 2003; 537-542doi:https://doi.org/10.1115/IPACK2003-35325
InterPACK 2003; 543-550doi:https://doi.org/10.1115/IPACK2003-35327
InterPACK 2003; 551-558doi:https://doi.org/10.1115/IPACK2003-35328
InterPACK 2003; 559-573doi:https://doi.org/10.1115/IPACK2003-35331
InterPACK 2003; 575-583doi:https://doi.org/10.1115/IPACK2003-35334
InterPACK 2003; 585-593doi:https://doi.org/10.1115/IPACK2003-35346
InterPACK 2003; 595-604doi:https://doi.org/10.1115/IPACK2003-35352
InterPACK 2003; 605-610doi:https://doi.org/10.1115/IPACK2003-35356

Photonics

InterPACK 2003; 611-619doi:https://doi.org/10.1115/IPACK2003-35015
InterPACK 2003; 621-628doi:https://doi.org/10.1115/IPACK2003-35062
InterPACK 2003; 629-637doi:https://doi.org/10.1115/IPACK2003-35111
InterPACK 2003; 639-649doi:https://doi.org/10.1115/IPACK2003-35166
InterPACK 2003; 651-654doi:https://doi.org/10.1115/IPACK2003-35199
Topics: Switches
InterPACK 2003; 655-663doi:https://doi.org/10.1115/IPACK2003-35202
InterPACK 2003; 665-671doi:https://doi.org/10.1115/IPACK2003-35239
InterPACK 2003; 673-680doi:https://doi.org/10.1115/IPACK2003-35287
InterPACK 2003; 681-686doi:https://doi.org/10.1115/IPACK2003-35300

Reliability

InterPACK 2003; 687-691doi:https://doi.org/10.1115/IPACK2003-35012
InterPACK 2003; 693-699doi:https://doi.org/10.1115/IPACK2003-35017
InterPACK 2003; 701-708doi:https://doi.org/10.1115/IPACK2003-35028
InterPACK 2003; 709-716doi:https://doi.org/10.1115/IPACK2003-35054
InterPACK 2003; 717-722doi:https://doi.org/10.1115/IPACK2003-35064
InterPACK 2003; 723-728doi:https://doi.org/10.1115/IPACK2003-35065
InterPACK 2003; 729-734doi:https://doi.org/10.1115/IPACK2003-35080
InterPACK 2003; 735-739doi:https://doi.org/10.1115/IPACK2003-35081
InterPACK 2003; 741-747doi:https://doi.org/10.1115/IPACK2003-35093
InterPACK 2003; 749-756doi:https://doi.org/10.1115/IPACK2003-35096
InterPACK 2003; 757-763doi:https://doi.org/10.1115/IPACK2003-35101
InterPACK 2003; 765-768doi:https://doi.org/10.1115/IPACK2003-35118
InterPACK 2003; 769-776doi:https://doi.org/10.1115/IPACK2003-35136
InterPACK 2003; 777-782doi:https://doi.org/10.1115/IPACK2003-35139
InterPACK 2003; 783-790doi:https://doi.org/10.1115/IPACK2003-35143
InterPACK 2003; 791-798doi:https://doi.org/10.1115/IPACK2003-35146
InterPACK 2003; 799-808doi:https://doi.org/10.1115/IPACK2003-35150
InterPACK 2003; 809-815doi:https://doi.org/10.1115/IPACK2003-35177
InterPACK 2003; 817-822doi:https://doi.org/10.1115/IPACK2003-35228
InterPACK 2003; 823-830doi:https://doi.org/10.1115/IPACK2003-35243
InterPACK 2003; 831-836doi:https://doi.org/10.1115/IPACK2003-35246
InterPACK 2003; 837-843doi:https://doi.org/10.1115/IPACK2003-35250
InterPACK 2003; 845-851doi:https://doi.org/10.1115/IPACK2003-35276
InterPACK 2003; 853-862doi:https://doi.org/10.1115/IPACK2003-35281
InterPACK 2003; 863-877doi:https://doi.org/10.1115/IPACK2003-35296
InterPACK 2003; 879-883doi:https://doi.org/10.1115/IPACK2003-35298
InterPACK 2003; 885-895doi:https://doi.org/10.1115/IPACK2003-35303
InterPACK 2003; 897-905doi:https://doi.org/10.1115/IPACK2003-35318
InterPACK 2003; 907-921doi:https://doi.org/10.1115/IPACK2003-35319
InterPACK 2003; 923-931doi:https://doi.org/10.1115/IPACK2003-35321
InterPACK 2003; 933-939doi:https://doi.org/10.1115/IPACK2003-35335
InterPACK 2003; 941-946doi:https://doi.org/10.1115/IPACK2003-35353
InterPACK 2003; 947-953doi:https://doi.org/10.1115/IPACK2003-35359
InterPACK 2003; 955-960doi:https://doi.org/10.1115/IPACK2003-35361
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