This research addresses the problem of not having access to a localized heating device that easily integrates a variety of testing needs with MEMS packaging. This device can heat MEMS while simultaneously in vacuum, exposed to harsh gases and on a rate table. The solution is a micro-heater built directly into its packaging with the capability to test MEMS at vacuum, which can be pumped down to 1 Torr in a fraction of a second and heats the device to approximately 170 degrees Celsius to simulate the temperatures MEMS devices endure. This packaging integrated with a testing device can accommodate a broad range of MEMS devices.

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