This research addresses the problem of not having access to a localized heating device that easily integrates a variety of testing needs with MEMS packaging. This device can heat MEMS while simultaneously in vacuum, exposed to harsh gases and on a rate table. The solution is a micro-heater built directly into its packaging with the capability to test MEMS at vacuum, which can be pumped down to 1 Torr in a fraction of a second and heats the device to approximately 170 degrees Celsius to simulate the temperatures MEMS devices endure. This packaging integrated with a testing device can accommodate a broad range of MEMS devices.
Micro-Electro-Mechanical Systems (MEMS) Micro-Heater
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Janakos, CN, Goericke, FT, & Pisano, AP. "Micro-Electro-Mechanical Systems (MEMS) Micro-Heater." Proceedings of the ASME 2012 International Mechanical Engineering Congress and Exposition. Volume 9: Micro- and Nano-Systems Engineering and Packaging, Parts A and B. Houston, Texas, USA. November 9–15, 2012. pp. 881-886. ASME. https://doi.org/10.1115/IMECE2012-85814
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