Several analytical and semi-analytical models to predict solder joint durability under thermal cycling loadings have been proposed. In general, these models are overtly conservative often requiring extensive experimental and/or finite element calibration. We present, based on the physics of the deformation process, a direct approach to improve these classes of model by resolving one of the major causes of conservatism. Our contribution is applicable to virtually all known surface mount configurations. The improved models (henceforth termed as constraint models) retain the simplicity of use of the existing ones. The efficacy of constraint approach is demonstrated on leadless resistors and comparisons are made with existing models and experimental data.
- Electronic and Photonic Packaging Division
Improved Analytical and Semi-Analytical Durability Models (Constrained Models) for Various Surface-Mount Configurations
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Sharma, P, & Loman, J. "Improved Analytical and Semi-Analytical Durability Models (Constrained Models) for Various Surface-Mount Configurations." Proceedings of the ASME 2002 International Mechanical Engineering Congress and Exposition. Electronic and Photonic Packaging, Electrical Systems Design and Photonics, and Nanotechnology. New Orleans, Louisiana, USA. November 17–22, 2002. pp. 159-164. ASME. https://doi.org/10.1115/IMECE2002-39634
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