Design Innovation Paper

A novel electromagnetic fixture for incremental sheet metal forming

[+] Author and Article Information
Harish K. Nirala

Department of Mechanical Engineering, Indian Institute of Technology Ropar, Rupnagar, Punjab, India - 140001

Anupam Agrawal

Department of Mechanical Engineering, Indian Institute of Technology Ropar, Rupnagar, Punjab, India - 140001

1Corresponding author.

ASME doi:10.1115/1.4042109 History: Received April 30, 2018; Revised November 21, 2018


Single Point Incremental Sheet Forming (SPISF) is a promising die less forming technique. It has a variety of applications in many industries viz. automobile, aerospace and bone transplants. In SPISF, forming of the sheet is done by using Numerically Controlled (NC) single point, hemispherical end shaped forming tool, which incrementally deforms the sheet by highly localized plastic deformation. SPISF is a flexible yet relatively slow process when compared with conventional forming techniques like deep drawing and spinning. Since the beginning of die less forming technology, researchers are recommending it for small batch production system or for customized fabrication. Being a slow process, it still has not achieved wide industrial acceptability. Among several key parameters dictating the process speed, sheet clamping mechanism is one of the significant parameters of SPISF. Clamping mechanism plays a vital role in its manufacturing lead time. However, research efforts in this direction have been largely neglected. In this investigation, to improve the process speed, a novel electromagnetic clamping mechanism for SPISF is proposed. Detailed numerical and experimental investigations have been carried out to establish its applicability for the SPISF process. From the available literature, it has been found that this type of clamping mechanism in SPISF has not been studied or investigated. The proposed electromagnetic clamping makes the process of sheet clamping faster, convenient and provides one-click clamping solution. This concept can take the process towards better industrial acceptability. Furthermore, SPISF of symmetric and asymmetric components is conducted to test the feasibility of the concept.

Copyright (c) 2018 by ASME
Your Session has timed out. Please sign back in to continue.





Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In