Research Papers

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

[+] Author and Article Information
Bin Lin, Ziguang Wang, Ying Yan, Renke Kang, Dongming Guo

Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China

Ping Zhou

Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
e-mail: pzhou@dlut.edu.cn

1Corresponding author.

Manuscript received February 24, 2018; final manuscript received August 14, 2018; published online September 17, 2018. Assoc. Editor: Zhijian (ZJ) Pei.

J. Manuf. Sci. Eng 140(12), 121001 (Sep 17, 2018) (7 pages) Paper No: MANU-18-1118; doi: 10.1115/1.4041245 History: Received February 24, 2018; Revised August 14, 2018

Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle materials. When the existing analytical models are used to predict the gain depth-of-cut in ultra-precision grinding process of silicon wafer, the results obtained become unreasonable due to an extremely shallow grain depth-of-cut, which is inconsistent with the theory of the contact mechanics. In this study, an improved model for analyzing the grain depth-of-cut in ultra-fine rotational grinding is proposed, in which the minimum grain depth-of-cut for chip formation, the equivalent grain cutting tip radius, elastic recovery deformation in cutting process, and the actual number of effective grains are considered in the prediction of the ultrafine rotational grinding of brittle materials. The improved model is validated experimentally and shows higher accuracy than the existing model. Furthermore, the sensitivity of the grain depth-of-cut to three introduced factors is analyzed, presenting the necessity of the consideration of these factors during the prediction of grain depth-of-cut in ultrafine grinding.

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Namba, Y. , Abe, M. , and Kobayashi, A. , 1993, “ Ultraprecision Grinding of Optical Glasses to Produce Super-Smooth Surfaces,” CIRP Ann. Manuf. Technol., 42(1), pp. 417–420. [CrossRef]
Hahn, P. O. , 2001, “ The 300 mm Silicon Wafer—A Cost and Technology Challenge,” Microelectron. Eng., 56(1–2), pp. 3–13. [CrossRef]
Gnatenko, Y. P. , Bukivskij, P. M. , Piryatinski, Y. P. , Faryna, O. , Fur'yer, S. , Shigiltchoff, A., Gamernyk, V. , Kukhtarev, N. , and Kukhtareva, T. , 2010, “ Fast Near-Infrared CdHgTe:V:Mn Photorefractive Material for Optical and Biomedical Applications,” International Conference on Advanced Optoelectronics and Lasers. Optoelectron, pp. 124–126.
Cao, J. , Wu, Y. , Li, J. , and Zhang, Q. , 2015, “ A Grinding Force Model for Ultrasonic Assisted Internal Grinding (UAIG) of SiC Ceramics,” Int. J. Adv. Manuf. Technol., 81(5–8), pp. 875–885. [CrossRef]
Tönshoff, H. K. , Schmieden, W. , and Inasaki, I. , 1990, “ Abrasive Machining of Silicon,” CIRP Ann. Manuf. Technol., 39(2), pp. 621–635. [CrossRef]
Pei, Z. J. , and Strasbaugh, A. , 2001, “ Fine Grinding of Silicon Wafers,” Int. J. Mach. Tools Manuf., 41(5), pp. 659–672. [CrossRef]
Brinksmeier, E. , Mutlugünes, Y. , Klocke, F. , Aurich, C. , Shore, P. , and Ohmori, H. , 2010, “ Ultra-Precision Grinding,” CIRP Ann. Manuf. Technol., 59(2), pp. 652–671. [CrossRef]
Tricard, M. , Kassir, S. , Herron, P. , and Pei, Z. J. , 1998, “ New Abrasive Trends in Manufacturing of Silicon Wafers,” Silicon Machining Symposium, pp. 23–25.
Pei, Z. J. , Fisher, G. R. , and Liu, J. , 2008, “ Grinding of Silicon Wafers: A Review From Historical Perspectives,” Int. J. Mach. Tools Manuf., 48(12–13), pp. 1297–1307. [CrossRef]
Malkin, S. , and Guo, C. , 2008, Grinding Technology: Theory and Application of Machining With Abrasives, 2nd ed., Industrial Press, New York.
Miller, M. H. , and Dow, T. A. , 1999, “ Influence of the Grinding Wheel in the Ductile Grinding of Brittle Materials: Development and Verification of Kinematic Based Model,” ASME J. Manuf. Sci. Eng., 121(4), pp. 638–646. [CrossRef]
Sharp, K. W. , Miller, M. H. , and Scattergood, R. O. , 2000, “ Analysis of the Grain Depth-of-Cut in Plunge Grinding,” Precis. Eng., 24(3), pp. 220–230. [CrossRef]
Zhang, Z. , Song, Y. , Huo, F. , and Guo, D. , 2012, “ Nanoscale Material Removal Mechanism of Soft-Brittle HgCdTe Single Crystals Under Nanogrinding by Ultrafine Diamond Grits,” Tribol. Lett., 46(1), pp. 95–100. [CrossRef]
Zhang, Z. , Song, Y. , Xu, C. , and Guo, D. , 2012, “ A Novel Model for Undeformed Nanometer Chips of Soft-Brittle HgCdTe Films Induced by Ultrafine Diamond Grits,” Scr. Mater., 67(2), pp. 197–200. [CrossRef]
Zhou, L. , Tian, Y. B. , Huang, H. , Sato, H. , and Shimizu, J. , 2012, “ A Study on the Diamond Grinding of Ultra-Thin Silicon Wafers,” Proc. Inst. Mech. Eng., Part B: J. Eng. Manuf., 226(1), pp. 66–75. [CrossRef]
Young, H. T. , Liao, H. T. , and Huang, H. Y. , 2007, “ Novel Method to Investigate the Critical Depth of Cut of Ground Silicon Wafer,” J. Mater. Process. Technol., 182(1–3), pp. 157–162. [CrossRef]
Huang, H. , Wang, B. L. , Wang, Y. , Zou, J. , and Zhou, B. , 2008, “ Characteristics of Silicon Substrates Fabricated Using Nanogrinding and Chemo-Mechanical-Grinding,” Mat. Sci. Eng. A, 479(1–2), pp. 373–379. [CrossRef]
Linkde, B. S. , Garretson, I. , Torner, F. , and Seewig, J. , 2017, “ Grinding Energy Modeling Based on Friction, Plowing and Shearing,” ASME J. Manuf. Sci. Eng., 139(12), p. 121009. [CrossRef]
Ramos, A. C. , Autenrieth, H. , Strauß, T. , Deuchert, M. , Hoffmeister, J. , and Schulze, V. , 2012, “ Characterization of the Transition From Ploughing to Cutting in Micro Machining and Evaluation of the Minimum Thickness of Cut,” J. Mater. Process. Technol., 212(3), pp. 594–600. [CrossRef]
Son, S. M. , Han, S. L. , and Ahn, J. H. , 2005, “ Effects of the Friction Coefficient on the Minimum Cutting Thickness in Micro Cutting,” Int. J. Mach. Tools Manuf., 45(4–5), pp. 529–535. [CrossRef]
Liu, X. , Devor, R. E. , and Kapoor, S. G. , 2006, “ An Analytical Model for the Prediction of Minimum Chip Thickness in Micromachining,” ASME J. Manuf. Sci. Eng., 128(2), pp. 474–481. [CrossRef]
Jiang, J. L. , Ge, P. Q. , Bi, W. B. , Zhang, L. , Wang, D. X. , and Zhang, Y. , 2013, “ 2D/3D Ground Surface Topography Modeling Considering Dressing and Wear Effects in Grinding Process,” Int. J. Mach. Tools Manuf., 74, pp. 29–40. [CrossRef]
Gassilloud, R. , Ballif, C. , Gasser, P. , Buerki, G. , and Michler, J. , 2005, “ Deformation Mechanisms of Silicon During Nanoscratching,” Phys. Status. Solidi Appl. Mater. Sci., 202(15), pp. 2858–2869. [CrossRef]
Shi, F. , Shu, Y. , Dai, Y. F. , Peng, Q. , and Li, Y. , 2013, “ Magnetorheological Elastic Super-Smooth Finishing for High-Efficiency Manufacturing of Ultraviolet Laser Resistant Optics,” Opt. Eng., 52(7), p. 075104. [CrossRef]
Weiß, M. , Klocke, F. , Barth, S. , Rasim, M. , and Mattfeld, P. , 2017, “ Detailed Analysis and Description of Grinding Wheel Topographies,” ASME J. Manuf. Sci. Eng., 139(5), p. 054502. [CrossRef]
Hou, Z. B. , and Komanduri, R. , 2003, “ On the Mechanics of the Grinding Process–Part I. Stochastic Nature of the Grinding Process,” Int. J. Mach. Tools Manuf., 43(15), pp. 1579–1593. [CrossRef]
Li, K. , and Liao, T. W. , 1997, “ Modelling of Ceramic Grinding Processes—Part I: Number of Cutting Points and Grinding Forces Per Grit,” J. Mater. Process. Technol., 65(1–3), pp. 1–10. [CrossRef]
Zhou, L. , Ebina, Y. , Wu, K. , Shimizu, J. , Onuki, T. , and Ojima, H. , 2017, “ Theoretical Analysis on Effects of Grain Size Variation,” Precis. Eng, 50, pp. 27–31. [CrossRef]
Suto, T. , and Sata, T. , 1981, “ Simulation of Grinding Process Based on Wheel Surface Charaterisitcs,” Bull. Jpn. Soc. Precis. Eng., 15, pp. 27–33.
Ali, Y. M. , and Zhang, L. C. , 1999, “ Surface Roughness Prediction of Ground Components Using a Fuzzy Logic Approach,” J. Mater. Process. Technol., 89–90, pp. 561–568. [CrossRef]
Hecker, R. L. , and Liang, S. Y. , 2003, “ Predictive Modeling of Surface Roughness in Grinding,” Int. J. Mach. Tools Manuf., 43(8), pp. 755–761. [CrossRef]
Agarwal, S. , and Rao, P. V. , 2005, “ A Probabilistic Approach to Predict Surface Roughness in Ceramic Grinding,” Int. J. Mach. Tools Manuf., 45(6), pp. 609–616. [CrossRef]
Agarwal, S. , and Rao, P. V. , 2005, “ Surface Roughness Prediction Model for Ceramic Grinding,” ASME Paper No. IMECE2005-79180.
Agarwal, S. , and Rao, P. V. , 2010, “ Modeling and Prediction of Surface Roughness in Ceramic Grinding,” Int. J. Mach. Tools Manuf., 50(12), pp. 1065–1076. [CrossRef]
Yuan, Z. J. , Zhou, M. , and Dong, S. , 1996, “ Effect of Diamond Tool Sharpness on Minimum Cutting Thickness and Cutting Surface Integrity in Ultraprecision Machining,” J. Mater. Process. Technol., 62(4), pp. 327–330. [CrossRef]
Vogler, M. P. , Devor, R. E. , and Kapoor, S. G. , 2004, “ On the Modeling and Analysis of Machining Performance in Micro-Endmilling—Part I: Surface Generation,” ASME J. Manuf. Sci. Eng., 126(4), pp. 685–694. [CrossRef]
Lee, S. H. , 2012, “ Analysis of Ductile Mode and Brittle Transition of AFM Nanomachining of Silicon,” Int. J. Mach. Tools Manuf., 61, pp. 71–79. [CrossRef]


Grahic Jump Location
Fig. 1

Schematic diagram of rotational grinding. Area Aw represents the cross-sectional area removed per wheel revolution at a radial distance of r1.

Grahic Jump Location
Fig. 2

Schematic diagram of the geometric relationship between the grinding wheel and the workpiece and between the penetration depth and grain depth-of cut. Rc is the cutting tip radius, Rce is the radius of a virtual cutting tip. The elastic–plastic cutting process by real cutting tip is as same as the rigid-plastic cutting process by the virtual cutting tip.

Grahic Jump Location
Fig. 3

Profile of the ground surface obtained by AFM. The profile is perpendicular to the direction of grinding marks.

Grahic Jump Location
Fig. 4

Comparison of simulated and experimental values of surface roughness: (a) #1500, 10 μm/min, (b) #1500, 50 μm/min, (c) #5000, 10 μm/min, and (d) #5000, 30 μm/min

Grahic Jump Location
Fig. 5

Effect of minimum grain depth-of-cut on grain depth-of-cut. #1500 Grinding wheel, nw = 120 rpm, ns = 2399 rpm, f = 50 μm/min, Rce = 0.2R, and K = 0.1

Grahic Jump Location
Fig. 6

Effect of the equivalent cutting tip radius on grain depth-of-cut. #1500 Grinding wheel, nw = 120 rpm, ns = 2399 rpm, and f = 50 μm/min, dmin = 0.1Rce, and K = 0.1

Grahic Jump Location
Fig. 7

Effect of equivalent grain number factor on grain depth-of-cut. #1500 Grinding wheel, nw = 120 rpm, ns = 2399 rpm, and f = 50 μm/min, dmin = 0.1Rce, and Rce = 0.2R



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