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Research Papers

Analytical Elastic–Plastic Cutting Model for Predicting Grain Depth-of-Cut in Ultrafine Grinding of Silicon Wafer

[+] Author and Article Information
Bin Lin, Ziguang Wang, Ying Yan, Renke Kang, Dongming Guo

Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China

Ping Zhou

Key Laboratory for Precision and Non-traditional
Machining Technology of Ministry of Education,
Dalian University of Technology,
Dalian 116024, China
e-mail: pzhou@dlut.edu.cn

1Corresponding author.

Manuscript received February 24, 2018; final manuscript received August 14, 2018; published online September 17, 2018. Assoc. Editor: Zhijian (ZJ) Pei.

J. Manuf. Sci. Eng 140(12), 121001 (Sep 17, 2018) (7 pages) Paper No: MANU-18-1118; doi: 10.1115/1.4041245 History: Received February 24, 2018; Revised August 14, 2018

Grain depth-of-cut, which is the predominant factor determining the surface morphology, grinding force, and subsurface damage, has a significant impact on the surface quality of the finished part made of hard and brittle materials. When the existing analytical models are used to predict the gain depth-of-cut in ultra-precision grinding process of silicon wafer, the results obtained become unreasonable due to an extremely shallow grain depth-of-cut, which is inconsistent with the theory of the contact mechanics. In this study, an improved model for analyzing the grain depth-of-cut in ultra-fine rotational grinding is proposed, in which the minimum grain depth-of-cut for chip formation, the equivalent grain cutting tip radius, elastic recovery deformation in cutting process, and the actual number of effective grains are considered in the prediction of the ultrafine rotational grinding of brittle materials. The improved model is validated experimentally and shows higher accuracy than the existing model. Furthermore, the sensitivity of the grain depth-of-cut to three introduced factors is analyzed, presenting the necessity of the consideration of these factors during the prediction of grain depth-of-cut in ultrafine grinding.

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Figures

Grahic Jump Location
Fig. 1

Schematic diagram of rotational grinding. Area Aw represents the cross-sectional area removed per wheel revolution at a radial distance of r1.

Grahic Jump Location
Fig. 2

Schematic diagram of the geometric relationship between the grinding wheel and the workpiece and between the penetration depth and grain depth-of cut. Rc is the cutting tip radius, Rce is the radius of a virtual cutting tip. The elastic–plastic cutting process by real cutting tip is as same as the rigid-plastic cutting process by the virtual cutting tip.

Grahic Jump Location
Fig. 3

Profile of the ground surface obtained by AFM. The profile is perpendicular to the direction of grinding marks.

Grahic Jump Location
Fig. 4

Comparison of simulated and experimental values of surface roughness: (a) #1500, 10 μm/min, (b) #1500, 50 μm/min, (c) #5000, 10 μm/min, and (d) #5000, 30 μm/min

Grahic Jump Location
Fig. 5

Effect of minimum grain depth-of-cut on grain depth-of-cut. #1500 Grinding wheel, nw = 120 rpm, ns = 2399 rpm, f = 50 μm/min, Rce = 0.2R, and K = 0.1

Grahic Jump Location
Fig. 6

Effect of the equivalent cutting tip radius on grain depth-of-cut. #1500 Grinding wheel, nw = 120 rpm, ns = 2399 rpm, and f = 50 μm/min, dmin = 0.1Rce, and K = 0.1

Grahic Jump Location
Fig. 7

Effect of equivalent grain number factor on grain depth-of-cut. #1500 Grinding wheel, nw = 120 rpm, ns = 2399 rpm, and f = 50 μm/min, dmin = 0.1Rce, and Rce = 0.2R

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