Research Papers

Sustainable Fabrication of Glass Nanostructures Using Infrared Transparent Mold Assisted by CO2 Laser Scanning Irradiation

[+] Author and Article Information
Mohd Zairulnizam Bin Mohd Zawawi

School of Mechanical Engineering,
National Center for Optically-Assisted
Mechanical Systems,
Yonsei University,
50, Yonsei-ro,
Seoul 03722, Korea
e-mail: zairulnizam@yonsei.ac.kr

Taekyung Kim

National Center for Optically-Assisted
Mechanical Systems,
Yonsei University,
50, Yonsei-ro,
Seoul, 03722, Korea
e-mail: scimatar@yonsei.ac.kr

Myungki Jung

National Center for Optically-Assisted
Mechanical Systems,
Yonsei University,
50, Yonsei-ro,
Seoul 03722, Korea
e-mail: frost@yonsei.ac.kr

Jaehun Im

School of Mechanical Engineering,
National Center for Optically-Assisted
Mechanical Systems,
Yonsei University,
50, Yonsei-ro,
Seoul 03722, Korea
e-mail: iamjh@yonsei.ac.kr

Shinill Kang

School of Mechanical Engineering,
National Center for Optically-Assisted
Mechanical Systems,
Yonsei University,
50, Yonsei-ro,
Seoul 03722, Korea
e-mail: snlkang@yonsei.ac.kr

1M. Z. Bin Mohd Zawawi and T. Kim equally contributed to this work.

2Corresponding author.

Manuscript received April 23, 2018; final manuscript received August 2, 2018; published online September 21, 2018. Assoc. Editor: Donggang Yao.

J. Manuf. Sci. Eng 140(12), 121005 (Sep 21, 2018) (9 pages) Paper No: MANU-18-1268; doi: 10.1115/1.4041181 History: Received April 23, 2018; Revised August 02, 2018

Direct thermal imprinting of nanostructures on glass substrates is reliable when manufacturing net-shaped glass devices with various surface functions. However, several problems are recognized, including a long thermal cycle, tedious optimization, difficulties in ensuring high level replication fidelity, and unnecessary thermal deformation of the glass substrate. Here, we describe a more sustainable and energy efficient method for direct thermal imprinting of nanostructures onto glass substrates; we use silicon mold transparent to infrared between 2.5 and 25 μm in wavelength combined with CO2 laser scanning irradiation. The glass strongly absorbed the 10.6 μm wavelength irradiation, triggering substantial heating of a thin layer on the glass surface, which significantly enhanced the filling of pressed glass material into nanostructured silicon mold cavities. For comparison, we conducted conventional direct glass thermal imprinting experiments, further emphasizing the advantages of our new method, which outperformed conventional methods. The thermal mass cycle was shorter and the imprint pattern quality and yield, higher. Our method is sustainable, allowing more rapid scalable fabrication of glass nanostructures using less energy without sacrificing the quality and productivity of the fabricated devices.

Copyright © 2018 by ASME
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Grahic Jump Location
Fig. 2

The transmittance profiles of the silicon mold and the optical glass K-PG375

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Fig. 1

Schematic illustration of (a) conventional direct glass thermal imprinting and (b) glass imprinting using CO2 laser irradiation through IR transparent mold

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Fig. 3

Schematic of the CO2 laser-assisted scanning process: (a) system setup and (b) method of laser beam scanning

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Fig. 4

(a) Photographs of imprinted glass samples from CO2 laser-assisted scanning process (left) with AFM pattern height measuring points across 100 mm2 of glass imprinted area and conventional imprinting process (right), a SEM image, an AFM 3D profile and an AFM 2D cross section of (b) silicon mold (c) imprinted glass from CO2 laser-assisted scanning process (contact imprinting time: 9 s), and (d) imprinted glass from conventional imprinting process (contact imprinting time: 1200 s)

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Fig. 5

(a) AFM measurement result of the imprinted nanograting surface roughness (b) stylus profilometer measurement lines and AFM measurement points for the CO2 laser scanning imprinted bulk glass (c) Surface roughness measurement of the raw bulk glass and the imprinted bulk glass and optical microscope measurement of (d) raw glass thickness, (e) CO2 laser scanning-assisted imprinted glass thickness, and (f) conventional imprinting glass thickness

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Fig. 6

Comparison of temperatures history profiles of the glass substrate and silicon as functions of time based on simulations and experiments

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Fig. 7

Simulated temperature distributions at various glass depths at a constant laser power of 30 W for 70 ms

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Fig. 8

Comparison of (a) thermal cycle time and (b) heating energy consumption per cycle between proposed method and conventional method



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