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research-article

Boundary control of embedded heaters for uniform bondline temperatures during composite joining

[+] Author and Article Information
Brandon Smith

Department of Mechanical Engineering, University of Washington, Seattle, Washington 98185
smithbp1@uw.edu

Mahdi Ashrafi

Department of Mechanical Engineering, University of Washington, Seattle, Washington 98185
ashrafi@uw.edu

Mark Tuttle

Department of Mechanical Engineering, University of Washington, Seattle, Washington 98185
tuttle@u.washington.edu

Santosh Devasia

Department of Mechanical Engineering, University of Washington, Seattle, Washington 98185
devasia@uw.edu

1Corresponding author.

ASME doi:10.1115/1.4040545 History: Received August 31, 2017; Revised June 08, 2018

Abstract

This paper investigates an out-of-autoclave (OoA), embedded-resistive heating method to precisely control the bondline temperature when curing high strength adhesives for joining composite adherends. A challenge with OoA methods is that non-uniform heat loss, e.g., due to substructures that act as local heat sinks, can lead to non-uniform temperatures in the bondline, which in turn, results in uneven curing and potentially weak joints. The main contribution of this work is to apply a voltage pattern at the boundary of the embedded heater to control the distribution of the electrical power at the interior bondline, and thereby reduce temperature variations. Additionally, this work devises an empirical model (that can be applied when material parameters and models are not readily available) to predict the desired power generation, and to design the embedded heater and voltage pattern that minimizes the bondline temperature variation. The technique is demonstrated experimentally for bonding a single-lap joint, and the maximum temperature variation in the bond area was reduced by 5 times from 31.6 ?C to 6.0 ?C.

Copyright (c) 2018 by ASME
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