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Research Papers

Modeling of Solid-State Hot Press Bonding and Its Application to the Fabrication of Titanium Alloy Joints

[+] Author and Article Information
C. Zhang

State Key Laboratory of
Solidification Processing,
Northwestern Polytechnical University,
Xi'an 710072, China;
Department of Mechanical Engineering,
Lyon University/INSA-Lyon/CNRS,
Villeurbanne Cedex F-69621, France
e-mail: zc9997242256@126.com

H. Li

State Key Laboratory of
Solidification Processing,
Northwestern Polytechnical University,
Xi'an 710072, China
e-mail: lihong86@nwpu.edu.cn

M. Q. Li

State Key Laboratory of
Solidification Processing,
Northwestern Polytechnical University,
Xi'an 710072, China
e-mail: honeymli@nwpu.edu.cn

1Corresponding authors.

Manuscript received July 3, 2017; final manuscript received May 9, 2018; published online June 1, 2018. Assoc. Editor: Wayne Cai.

J. Manuf. Sci. Eng 140(8), 081007 (Jun 01, 2018) (12 pages) Paper No: MANU-17-1405; doi: 10.1115/1.4040262 History: Received July 03, 2017; Revised May 09, 2018

Solid-state hot press bonding is an advanced joining process wherein two specimens can be joined under high pressure for a period of time at an elevated temperature. The main step in hot press bonding is the void closure process. In the present study, a three-dimensional theoretical model for describing the void closure process is developed. In the model, the void closure process is divided into two stages: in the first stage, surface asperities are flattened by the time-independent local plastic flow mechanism, and isolated voids form at the bonding interface; in the second stage, the void closure is accomplished by three time-dependent mechanisms, namely, the viscoplastic flow mechanism, surface source diffusion mechanism, and interface source diffusion mechanism. The initial and ending conditions of these mechanisms are proposed. The model also includes an analysis of the effect of macroscopic deformation on void closure. Hot press bonding experiments of Ti–6Al–4V alloy are conducted to validate the model. The modeling predictions show good agreement with the experimental results.

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Figures

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Fig. 1

Geometric assumption of a void in (a) a two-dimensional model; (b) a three-dimensional model

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Fig. 6

Remote stresses acting on a void in the unit cell

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Fig. 4

Void and contact areas within the cell unit at the bonding interface (XOY plane)

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Fig. 5

Volume of materials around the void before (a) and after (b) local plastic flow

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Fig. 7

Joined specimen (a) and bonding interface area (b) before macroscopic deformation; joined specimen (c) and bonding interface area (d) after macroscopic deformation

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Fig. 3

Oblate spheroidal void in a unit cell

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Fig. 2

Schematic diagrams of the void closure process

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Fig. 8

Radius of curvature at point A and B in the XOZ plane

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Fig. 9

Material redistribution by the surface source diffusion mechanism: (a) actual change in void shape due to redistribution and (b) volume of matter transfer due to the simplification

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Fig. 10

Stress distribution around void at bonding interface

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Fig. 15

Comparisons between model predictions and experimental results of area fraction bonded: (a) temperature and (b) pressure

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Fig. 14

Experimental results of the bonding interface morphologies under different parameters: (a) 1123 K, 25 MPa, 180 s; (b) 1123 K, 25 MPa, 300 s; (c) 1123 K, 25 MPa, 600 s; (d) 1123 K, 30 MPa, 180 s; (e) 1123 K, 30 MPa, 600 s; (f) 1123 K, 30 MPa, 900 s; (g) 1173 K, 30 MPa, 180 s; and (h) 1173 K, 30 MPa, 600 s

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Fig. 11

Flowchart of the model calculations

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Fig. 12

Optical micrograph of Ti–6Al–4V alloy before bonding

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Fig. 13

Schematic of the hot press bonding process

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