Technical Brief

Process-Property Relationships for Fused Filament Fabrication on Preexisting Polymer Substrates

[+] Author and Article Information
Harry A. Pierson

Department of Industrial Engineering 4207 Bell Engineering Center Fayetteville, AR, 72701

Bharat Chivukula

Department of Industrial Engineering 4207 Bell Engineering Center Fayetteville, AR, 72701

1Corresponding author.

ASME doi:10.1115/1.4039766 History: Received November 05, 2017; Revised March 18, 2018


Recent advances in fused filament fabrication (FFF), such as 5-axis printing, patching existing parts, and certain hybrid manufacturing processes, involve printing atop a previously manufactured polymer substrate. The success of these technologies depends upon the bond strength between the substrate and the newly added geometry. ANOVA and response surface methods were used to determine the effect of three process parameters on bond tensile strength: surface roughness, layer thickness, and raster angle. Experimental results indicate that the process-property relationships are not identical to those found in single, continuous FFF operations, and that the physical bonding mechanisms may also be different. Bond strength was found to be highly sensitive to surface roughness and layer thickness, and distinct optimal parameter settings exist. These results represent a first step toward understanding bond strength in such circumstances, allowing manufacturers to intelligently select process parameters for the production of both the substrate and the secondary geometry.

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