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CONTROLLED PHASE INTERACTIONS BETWEEN PULSED ELECTRIC FIELDS, ULTRASONIC VELOCITY, AND MAGNETIC FIELDS IN AN ANODIC DISSOLUTION CELL

[+] Author and Article Information
Curtis Bradley

Researcher, Integration Engineering Laboratory, U.S. Army RDECOM-ARDEC, Benét Laboratories, Watervliet, NY 12189
curtis.w.bradley6.civ@mail.mil

Johnson Samuel

Associate Professor, Department of Mechanical Aerospace and Nuclear Engineering, Rensselaer Polytechnic Institute, Troy, NY 12180
samuej2@rpi.edu

1Corresponding author.

ASME doi:10.1115/1.4038569 History: Received March 28, 2017; Revised November 15, 2017

Abstract

This paper presents the design of a novel testbed that effectively combines pulsed electric field waveforms, ultrasonic velocity, and magnetic field waveforms in an anodic dissolution electrochemical machining (ECM) cell. The testbed consists of a custom 3D printed flow cell that is integrated with (i) a bipolar pulsed ECM circuit, (ii) an ultrasonic transducer, and (iii) a custom-built high-frequency electromagnet. The driving voltages of the ultrasonic transducer and electromagnet are calibrated to achieve a timed workpiece velocity and magnetic field, respectively, in the machining area. The electrochemical machining studies conducted using this testbed reveal that phase-controlled waveform interactions between the three assistances affect both the material removal rate (MRR) and surface roughness (Ra) performance metrics. The triad-assisted ECM case involving phase-specific combinations of all three high-frequency (15.625 kHz) assistance waveforms is found to be capable of achieving a 52% increase in MRR while also simultaneously yielding a 78% improvement in the surface roughness value over the baseline pulsed-ECM case. This result is encouraging because assisted ECM processes reported in literature typically improve only one of these performance metrics at the expense of the other. In general, the findings reported in this paper are expected to enable the realization of multi-field assisted ECM testbeds using phase-specific input waveforms that change on-the-fly to yield preferential combinations of material removal rate and surface finish.

Section 4: U.S. Gov Employees + Reg Authors
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