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Research Papers

An Experimental Research on the Force and Energy During the Sapphire Sawing Using Reciprocating Electroplated Diamond Wire Saw

[+] Author and Article Information
Hui Huang

Institute of Manufacturing Engineering,
Huaqiao University,
Xiamen 361021, Fujian, China
e-mail: huanghuihh@hotmail.com

Xixi Li

Institute of Manufacturing Engineering,
Huaqiao University,
Xiamen 361021, Fujian, China
e-mail: 1158855172@qq.com

Xipeng Xu

Institute of Manufacturing Engineering,
Huaqiao University,
Xiamen 361021, Fujian, China
e-mail: xpxu@hqu.edu.cn

1Corresponding author.

Manuscript received March 31, 2017; final manuscript received September 28, 2017; published online November 2, 2017. Assoc. Editor: Kai Cheng.

J. Manuf. Sci. Eng 139(12), 121011 (Nov 02, 2017) (5 pages) Paper No: MANU-17-1201; doi: 10.1115/1.4038109 History: Received March 31, 2017; Revised September 28, 2017

This study investigated the sawing of A-plane and C-plane sapphires using the reciprocating diamond wire saw. The influences of process parameters and sapphire crystal structure on sawing force were experimentally researched. The experimental results indicated that, in sapphire sawing process, the sapphire crystal structure, the wire speed, and the feed rate had effects on the tangential sawing forces, and the tangential forces had good linear relationships with the material removal rates (MRRs). The specific sawing energies in the stable stage were clearly smaller than in the unstable stage.

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Copyright © 2017 by ASME
Topics: Wire , Sawing , Diamonds , Sapphire
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References

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Figures

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Fig. 1

(a) Schematic diagram of experimental setup for sapphire sawing using reciprocating diamond wire saws and (b) illustration of real system

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Fig. 2

(a) Orientation of A-plane and C-plane of sapphire and (b) schematic illustration of reference plane on C-plane and A-plane sapphire wafers

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Fig. 3

Tangential sawing forces versus cutting depths at a wire speed of 350 m/min and a feed rate of 0.25 mm/min

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Fig. 4

Tangential sawing forces at various wire speeds and constant feed speed of 0.25 mm/min: (a) sawing on A-plane and (b) sawing on C-plane

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Fig. 5

Tangential sawing forces of at various feed rates at constant wire speed of 350m/min: (a) sawing on A-plane and (b) sawing on C-plane

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Fig. 6

Relationships between tangential sawing forces and MRRs sawn sapphires: (a) sawing on A-plane and (b) sawing on C-plane

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Fig. 7

Unit length forces at various wire speeds at a constant feeding rate of 0.25 mm/min: (a) sawing on A-plane and (b) sawing on C-plane

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Fig. 8

Unit length forces at various feed speeds at a constant wire speed of 350 m/min: (a) sawing on A-plane and (b) sawing on C-plane

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Fig. 9

Relationship between the unit length material volumes on the sawing specific energies: (a) sawing on A-plane, (b) sawing on C-plane

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