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research-article

An experimental research on the force and energy during the sapphire sawing using reciprocating electroplated diamond wire saw

[+] Author and Article Information
Hui Huang

Institute of Manufacturing Engineering, Huaqiao University, Xiamen, 361021, Fujian Province, P. R. China
huanghuihh@hotmail.com

Xixi Li

Institute of Manufacturing Engineering, Huaqiao University, Xiamen, 361021, Fujian Province, P. R. China
1158855172@qq.com

Xipeng Xu

Institute of Manufacturing Engineering, Huaqiao University, Xiamen, 361021, Fujian Province, P. R. China
xpxu@hqu.edu.cn

1Corresponding author.

ASME doi:10.1115/1.4038109 History: Received March 31, 2017; Revised September 28, 2017

Abstract

This study investigated the slicing of A-plane and C-plane sapphire with the reciprocating diamond wire saw. The influences of process parameters and sapphire crystal structure on sawing force were researched. The experimental results shown that material structure, wire speed and feed rate had effect on the tangential forces in the sawing process. The tangential force had good linear relationships with the martial removed rate. The specific sawing energy in the stable stage was obviously smaller than the case in the unstable stage.

Copyright (c) 2017 by ASME
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