0
Research Papers

A Molecular Dynamics Simulation Study of Material Removal Mechanisms in Vibration Assisted Nano Impact-Machining by Loose Abrasives

[+] Author and Article Information
Sagil James

Department of Mechanical Engineering,
California State University,
Fullerton, CA 92834

Murali Sundaram

Department of Mechanical
and Materials Engineering,
University of Cincinnati,
Cincinnati, OH 45221
e-mail: murali.sundaram@uc.edu

1Corresponding author.

Manuscript received August 19, 2016; final manuscript received April 17, 2017; published online May 11, 2017. Assoc. Editor: Y. B. Guo.

J. Manuf. Sci. Eng 139(8), 081014 (May 11, 2017) (8 pages) Paper No: MANU-16-1452; doi: 10.1115/1.4036559 History: Received August 19, 2016; Revised April 17, 2017

Vibration assisted nano impact-machining by loose abrasives (VANILA) is a novel nanomachining process to perform target-specific nano abrasive machining of hard and brittle materials. In this study, molecular dynamic (MD) simulations are performed to understand the nanoscale material removal mechanisms involved in the VANILA process. The simulation results revealed that the material removal for the given impact conditions happens primarily in ductile mode through three distinct mechanisms, which are nanocutting, nanoplowing, and nanocracking. It was found that domination by any of these mechanisms over the other mechanisms during the material removal process depends on the impact conditions, such as angle of impact and the initial kinetic energy of the abrasive grain. The transition zone from nanocutting to nanoplowing is observed at angle of impact of near 60 deg, while the transition from the nanocutting and nanoplowing mechanisms to nanocracking mechanism is observed for initial abrasive kinetic energies of about 600–700 eV. In addition, occasional lip formation and material pile-up are observed in the impact zone along with amorphous phase transformation. A material removal mechanism map is constructed to illustrate the effects of the impacts conditions on the material removal mechanism. Confirmatory experimentation on silicon and borosilicate glass substrates showed that all the three nanoscale mechanisms are possible, and the nanoplowing is the most common mechanism. It was also found that the material removal rate (MRR) values are found to be highest when the material is removed through nanocracking mechanism and is found to be lowest when the material removal happens through nanocutting mechanism.

FIGURES IN THIS ARTICLE
<>
Copyright © 2017 by ASME
Your Session has timed out. Please sign back in to continue.

References

Sooraj, V. S. , and Radhakrishnan, V. , 2015, “ Investigations on the Application of Elastomagnetic Abrasive Balls for Fine Finishing,” ASME J. Manuf. Sci. Eng., 137(2), p. 021018. [CrossRef]
Abbas, A. T. , Aly, M. , and Hamza, K. , 2016, “ Multiobjective Optimization Under Uncertainty in Advanced Abrasive Machining Processes Via a Fuzzy-Evolutionary Approach,” ASME J. Manuf. Sci. Eng., 138(7), p. 071003. [CrossRef]
Zhu, W.-L. , He, Y. , Ehmann, K. F. , Egea, A. J. S. , Wang, X. , Ju, B.-F. , and Zhu, Z. , 2016, “ Theoretical and Experimental Investigation on Inclined Ultrasonic Elliptical Vibration Cutting of Alumina Ceramics,” ASME J. Manuf. Sci. Eng., 138(12), p. 121011. [CrossRef]
Barnett, A. C. , Jones, J. A. , Lee, Y.-S. , and Moore, J. Z. , 2016, “ Compliant Needle Vibration Cutting of Soft Tissue,” ASME J. Manuf. Sci. Eng., 138(11), p. 111011. [CrossRef]
Li, S. , Wu, Y. , Fujimoto, M. , and Nomura, M. , 2016, “ Improving the Working Surface Condition of Electroplated Cubic Boron Nitride Grinding Quill in Surface Grinding of Inconel 718 by the Assistance of Ultrasonic Vibration,” ASME J. Manuf. Sci. Eng., 138(7), p. 071008. [CrossRef]
James, S. , and Sundaram, M. M. , 2012, “ A Feasibility Study of Vibration-Assisted Nano-Impact Machining by Loose Abrasives Using Atomic Force Microscope,” ASME J. Manuf. Sci. Eng., 134(6), p. 061014. [CrossRef]
Nguyen, H. T. , Wang, H. , and Hu, S. J. , 2013, “ Characterization of Cutting Force Induced Surface Shape Variation in Face Milling Using High-Definition Metrology,” ASME J. Manuf. Sci. Eng., 135(4), p. 041014. [CrossRef]
Shao, C. , Ren, J. , Wang, H. , Jin, J. J. , and Hu, S. J. , 2017, “ Improving Machined Surface Shape Prediction by Integrating Multi-Task Learning With Cutting Force Variation Modeling,” ASME J. Manuf. Sci. Eng., 139(1), p. 011014. [CrossRef]
Grzesik, W. , and Żak, K. , 2015, “ Possibilities of the Generation of Hardened Steel Parts With Defined Topographic Characteristics of the Machined Surfaces,” ASME J. Manuf. Sci. Eng., 137(1), p. 014502. [CrossRef]
Komanduri, R., Chandrasekaran, N., and Raff, L. M., 2001, “ Molecular Dynamics Simulation of the Nanometric Cutting of Silicon,” Plant Ecol. Diversity, 81(12), pp. 1989–2019.
James, S. , and Sundaram, M. M. , 2013, “ A Molecular Dynamics Study of the Effect of Impact Velocity, Particle Size and Angle of Impact of Abrasive Grain in the Vibration Assisted Nano Impact-Machining by Loose Abrasives,” Wear, 303(1–2), pp. 510–518.
James, S. , and Sundaram, M. M. , 2014, “ Modeling of Material Removal Rate in Vibration Assisted Nano Impact-Machining by Loose Abrasives,” ASME J. Manuf. Sci. Eng., 137(2), p. 021008.
Fang, H. , Guo, P. , and Yu, J. , 2006, “ Surface Roughness and Material Removal in Fluid Jet Polishing,” Appl. Opt., 45(17), pp. 4012–4019. [CrossRef] [PubMed]
Zhang, J. , and Zhang, C. , 2008, “ Material Removal Model for Non-Contact Chemical Mechanical Polishing,” Chin. Sci. Bull., 53(23), pp. 3746–3752. [CrossRef]
Xu, X. , Luo, J. , Lu, X. , Zhang, C. , and Guo, D. , 2008, “ Effect of Nanoparticle Impact on Material Removal,” Tribol. Trans., 51(6), pp. 718–722. [CrossRef]
Song, X. Z. , Zhang, F. H. , and Zhang, Y. , 2008, “ Study on Removal Mechanism of Nanoparticle Colloid Jet Machining,” Adv. Mater. Res., 53–54, pp. 363–368. [CrossRef]
Dasari, A. , Yu, Z.-Z. , and Mai, Y.-W. , 2009, “ Fundamental Aspects and Recent Progress on Wear/Scratch Damage in Polymer Nanocomposites,” Mater. Sci. Eng.: R: Rep., 63(2), pp. 31–80. [CrossRef]
Yamaguchi, Y. , and Gspann, J. , 2002, “ Large-Scale Molecular Dynamics Simulations of Cluster Impact and Erosion Processes on a Diamond Surface,” Phys. Rev. B, 66(15), p. 155408. [CrossRef]
Luo, J. , Hu, Y. , and Wen, S. , 2008, Physics and Chemistry of Micro-Nanotribology, ASTM International, West Conshohocken, PA.
Chen, R. , Luo, J. , Guo, D. , and Lu, X. , 2009, “ Energy Transfer Under Impact Load Studied by Molecular Dynamics Simulation,” J. Nanopart. Res., 11(3), pp. 589–600. [CrossRef]
Fangli, D. , Jianbin, L. , Shizhu, W. , and Jiaxu, W. , 2005, “ Atomistic Structural Change of Silicon Surface Under a Nanoparticle Collision,” Chin. Sci. Bull., 50(15), pp. 1661–1665. [CrossRef]
Pogorelko, V. V. , Mayer, A. E. , and Krasnikov, V. S. , 2016, “ High-Speed Collision of Copper Nanoparticle With Aluminum Surface: Molecular Dynamics Simulation,” Appl. Surf. Sci., 390, pp. 289–302. [CrossRef]
Chen, R. , Jiang, R. , Lei, H. , and Liang, M. , 2013, “ Material Removal Mechanism During Porous Silica Cluster Impact on Crystal Silicon Substrate Studied by Molecular Dynamics Simulation,” Appl. Surf. Sci., 264, pp. 148–156. [CrossRef]
Yoon, K. , Ostadhossein, A. , and van Duin, A. C. T. , 2016, “ Atomistic-Scale Simulations of the Chemomechanical Behavior of Graphene Under Nanoprojectile Impact,” Carbon, 99, pp. 58–64. [CrossRef]
Aoki, T. , Seki, T. , and Matsuo, J. , 2016, “ Molecular Dynamics Simulations Study of Nano Particle Migration by Cluster Impact,” Surf. Coat. Technol., 306(Part A), pp. 63–68. [CrossRef]
Plimpton, S. , 1995, “ Fast Parallel Algorithms for Short-Range Molecular Dynamics,” J. Comput. Phys., 117(1), pp. 1–19. [CrossRef]
Huang, Z. G. , Guo, Z. N. , Chen, X. , Yue, T. M. , To, S. , and Lee, W. B. , 2006, “ Molecular Dynamics Simulation for Ultrafine Machining,” Mater. Manuf. Processes, 21(4), pp. 393–397. [CrossRef]
Feng, Z. , and Ball, A. , 1999, “ The Erosion of Four Materials Using Seven Erodents—Towards an Understanding,” Wear, 233–235, pp. 674–684. [CrossRef]

Figures

Grahic Jump Location
Fig. 1

Schematic diagram of the VANILA process: (a) vibrating tool hammers the diamond nanoparticles, (b) nanoparticle impact the workpiece surface causing material removal, and (c) repeated impacts of diamond nanoparticles resulting in nanocavity formation on workpiece surface

Grahic Jump Location
Fig. 2

Pattern design and AFM image of nanocavity pattern machined using the VANILA process on borosilicate glass substrate [6]

Grahic Jump Location
Fig. 3

Tool tip dynamics during the VANILA process

Grahic Jump Location
Fig. 4

Schematic of MDS model of VANILA process: (a) 3D view and (b) sectional view

Grahic Jump Location
Fig. 8

Effect of angle of impact (θ) on the material removal mechanism in the VANILA process—angle of impact: (a) 40 deg and (b) 80 deg for an initial kinetic energy of 500 eV and duration of 1 ps

Grahic Jump Location
Fig. 9

Effect of initial kinetic energy on material removal mechanism in the VANILA process—initial kinetic energy: (a) 200 eV and (b) 800 eV for an angle of impact of 70 deg and duration of 1 ps

Grahic Jump Location
Fig. 10

Material removal mechanism map of the VANILA process showing possible impact conditions for different nanoscale material removal mechanisms

Grahic Jump Location
Fig. 11

Experimental setup (inset: fluid cell)

Grahic Jump Location
Fig. 12

Topography and cross section of representative machined nanocavities on (a) silicon and (b) borosilicate glass

Grahic Jump Location
Fig. 13

Nanocavities machined through nanocutting on (a) silicon and (b) borosilicate glass

Grahic Jump Location
Fig. 14

Nanocavities machined through nanocracking on (a) silicon and (b) borosilicate glass

Tables

Errata

Discussions

Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In