Research Papers

Analysis on the Effects of Grinding Wheel Speed on Removal Behavior of Brittle Optical Materials

[+] Author and Article Information
Ping Li, Zongfu Guo, Jun Yi, Meina Qu

National Engineering Research Centre
for High Efficiency Grinding,
Hunan University,
Changsha 410082, Hunan, China

Tan Jin

National Engineering Research Centre
for High Efficiency Grinding,
Hunan University,
Changsha 410082, Hunan, China
e-mail: tjin@hnu.edu.cn

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received August 17, 2016; final manuscript received August 30, 2016; published online October 6, 2016. Editor: Y. Lawrence Yao.

J. Manuf. Sci. Eng 139(3), 031014 (Oct 06, 2016) (8 pages) Paper No: MANU-16-1442; doi: 10.1115/1.4034665 History: Received August 17, 2016; Revised August 30, 2016

It is often desired to increase the machining rate while maintaining the desired surface and subsurface integrity during fabricating high-quality optical glass components. This paper proposed a high-speed high-efficiency low-damage grinding technology for machining brittle optical materials, which consists of three grinding processes: rough grinding, semifinishing grinding, and finishing grinding. Grinding characteristics are investigated with respect to grinding forces, specific cutting energy, surface roughness, ground surface quality, subsurface damage, and material removal mechanisms in grinding of fused silica optical glasses with this technology at grinding speeds of up to 150 m/s. These indications are thoroughly discussed by contacting the undeformed chip thickness. The results indicate that the level of these indications is significantly improved with an increase in the wheel speed due to the decrease of the undeformed chip thickness. It is also found that the improvement of ground surface quality is limited when the wheel speed increases from 120 m/s to 150 m/s, which may be due to the influence of vibration caused by the higher wheel speed. For different grinding processes, these results are also substantially improved with the change of grinding conditions. It is found that the material removal mechanism is dominated by brittle fracture at rough and semifinishing grinding processes, while ductile flow mode can be observed at the finishing grinding process. There are some differences between the experimental results and the previous predicted model of subsurface damage depth.

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Axinte, E. , 2011, “ Glasses as Engineering Materials: A Review,” Mater. Des., 32(4), pp. 1717–1732. [CrossRef]
An, Q. , Ming, W. , and Chen, M. , 2015, “ Experimental Investigation on Cutting Characteristics in Nanometric Plunge-Cutting of BK7 and Fused Silica Glasses,” Materials, 8(4), pp. 1428–1441. [CrossRef]
Campbell, J. H. , 2002, “ Damage Resistant Optical Glasses for High Power Lasers: A Continuing Glass Science and Technology Challenge,” Proceedings of the First International Workshop on Glass and the Photonics Revolution, Bad Soden, Germany, May 29–29, pp. 91–108.
Miller, P. E. , Suratwala, T. I. , Wong, L. L. , Feit, M. D., Menapace, J. A., Davis, P. J., and Steele, R. A., 2005, “ The Distribution of Subsurface Damage in Fused Silica,” Proc. SPIE, 5991, pp. 1–25.
Esmaeilzare, A. , Rahimi, A. , and Rezaei, S. M. , 2014, “ Investigation of Subsurface Damages and Surface Roughness in Grinding Process of Zerodur® Glass–Ceramic,” Appl. Surf. Sci., 313, pp. 67–75. [CrossRef]
Zhao, Q. , Liang, Y. , Stephenson, D. , and Corbett, J., 2007, “ Surface and Subsurface Integrity in Diamond Grinding of Optical Glasses on Tetraform ‘C’,” Int. J. Mach. Tools Manuf., 47(14), pp. 2091–2097. [CrossRef]
Kordonski, W. L. , and Golini, D. , 1999, “ Fundamentals of Magneto Rheological Fluid Utilization in High Precision Finishing,” J. Intell. Mater. Syst. Struct., 10(9), pp. 683–689. [CrossRef]
Verma, Y. , Chang, A. K. , Berrett, J. W. , Futtere, K., Gardopee, G. J., Kelley, J., Kyler, T., Lee, J., Lyford, N., Proscia, D. and Sommer, P. R., 2006, “ Rapid Damage-Free Shaping of Silicon Carbide Using Reactive Atom Plasma (RAP) Processing,” Proc. SPIE, 62730, pp. 1–8.
Kanaoka, M. , Liu, C. , and Nomura, K. , 2008, “ Processing Efficiency of Elastic Emission Machining for Low-Thermal-Expansion Material,” Surf. Interface Anal., 40(6–7), pp. 1002–1006. [CrossRef]
Tong, S. , Gracewski, S. M. , and Funkenbusch, P. D. , 2006, “ Measurement of the Preston Coefficient of Resin and Bronze Bond Tools for Deterministic Microgrinding of Glass,” Precis. Eng., 30(2), pp. 115–122. [CrossRef]
Klocke, F. , Brinksmeier, E. , Evans, C. , Howes, T., Inasaki, I., Minke, E., H Tonshoff, J A. Webster, and Stuff, D., 1997, “ High Speed Grinding—Fundamental and State of Art in Europe, Japan and USA,” CIRP Ann. Manuf. Technol., 46(2), pp. 715–724. [CrossRef]
Huang, H. , Yin, L. , and Zhou, L. , 2003, “ High Speed Grinding of Silicon Nitride With Resin Bond Diamond Wheels,” J. Mater. Process. Technol., 141(3), pp. 329–336. [CrossRef]
Lang, L. Ü. , Xiong, W. L. , and Gao, H. , 2008, “ Mechanical-Electric Coupling Dynamical Characteristics of All Ultra-High Speed Grinding Motorized Spindle System,” Chin. J. Mech. Eng., 21(5) pp. 34–40. [CrossRef]
Ramesh, K. , Huang, H. , and Yin, L. , 2004, “ Analytical and Experimental Investigation of Coolant Velocity in High Speed Grinding,” Int. J. Mach. Tools Manuf., 44(10), pp. 1069–1076.
Chen, J. , Shen, J. , Huang, H. , and Xu, X. , 2010, “ Grinding Characteristics in High Speed Grinding of Engineering Ceramics With Brazed Diamond Wheels,” J. Mater. Process. Technol., 210(6–7), pp. 899–906. [CrossRef]
Rowe, W. B. , 2013, Principles of Modern Grinding Technology, 2nd ed, William Andrew, Kidlington, UK.
Malkin, S. , and Guo, C. , 2008, Grinding Technology: Theory and Applications of Machining With Abrasives, Industrial Press, Dearborn, MI.
Shaw, M. , 1996, Principles of Abrasive Processing, Oxford University Press, Oxford, UK.
Jahanmir, S. , Xu, H. K. , and Ives, L. K. , 1999,” Mechanisms of Material Removal in Abrasive Machining of Ceramics,” Manufacturing Engineering and Materials Processing, Vol. 53, CRC Press, FL, pp. 11–84.
Gutowski, T. , Dahmus, J. , and Thiriez, A. , 2006, “ Electrical Energy Requirements for Manufacturing Processes,” 13th CIRP International Conference on Life Cycle Engineering, Leuven, Belgium, pp. 623–638.
Gutowski, T. G. , Branham, M. S. , Dahmus, J. B. , Jones, A. J. , Thiriez, A. , and Sekulic, D. P. , 2009, “ Thermodynamic Analysis of Resources Used in Manufacturing Processes,” Environ. Sci. Technol., 43(5), pp. 1584–1590. [CrossRef] [PubMed]
Marshall, D. B. , Lawn, B. R. , and Cook, R. F. , 1987, “ Microstructural Effects on Grinding of Alumina and Glass-Ceramics,” Commun. Am. Ceram. Soc., 70(6), pp. 139–140. [CrossRef]
Bifano, T. G. , Dow, T. A. , and Scattergood, R. O. , 1991, “ Ductile-Regime Grinding: A New Technology for Machining Brittle Materials,” ASME J. Eng. Ind., 113(2), pp. 184–189. [CrossRef]
Lambropoulos, J. C. , Jacobs, S. D. , and Ruckman, J. , 1999, “ Material Removal Mechanisms From Grinding to Polishing,” Ceram. Trans. 102, pp. 113–128.
Li, Y. , Zheng, N. , Li, H. , Hou, J., Lei, X., Chen, X., Yuan, Z., Guo, Z., Wang, J., Guo, Y. and Xu, Q., 2011, “ Morphology and Distribution of Subsurface Damage in Optical Fused Silica Parts: Bound-Abrasive Grinding,” Appl. Surf. Sci., 257(6), pp. 2066–2073. [CrossRef]
Li, S. , Wang, Z. , and Wu, Y. , 2008, “ Relationship Between Subsurface Damage and Surface Roughness of Optical Materials in Grinding and Lapping Processes,” J. Mater. Process. Technol., 205(1–3), pp. 34–41. [CrossRef]
Mahmoud, T. A. , Tamaki, J. , and Yan, J. W. , 2003, “ Three-Dimensional Shape Modeling of Diamond Abrasive Grains Measured by a Scanning Laser Microscope,” Key Eng. Mater., 238–239, pp. 131–136. [CrossRef]


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Fig. 1

Schematic of truing (a), sharpening (b), and grinding (c) setup

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Fig. 2

Grinding forces versus the wheel speed

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Fig. 3

Surface roughness versus the wheel speed

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Fig. 4

Surface morphologies versus the wheel speed for the three grinding processes

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Fig. 5

Subsurface damages: (a) typical optical microscopy images and (b) depth of subsurface damage versus the wheel speed

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Fig. 6

Undeformed chip geometry for straight grinding [17]

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Fig. 7

Specific grinding forces versus the undeformed chip thickness

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Fig. 8

Specific grinding energy versus the undeformed chip thickness

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Fig. 9

Wheel runout before and after balancing in rough grinding process

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Fig. 10

Surface roughness versus the undeformed chip thickness

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Fig. 11

The surface roughness versus the specific grinding force

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Fig. 12

Subsurface damage depth versus the undeformed chip thickness

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Fig. 13

Subsurface damage depth versus the single grit normal grinding force




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