Research Papers

Modeling of Diffusion Bonding Time in Dissimilar Titanium Alloys: Preliminary Results

[+] Author and Article Information
Neha Kulkarni

Department of Mechanical Engineering,
University of Washington,
Box 352600,
Seattle, WA 98195

M. Ramulu

Department of Mechanical Engineering,
University of Washington,
Box 352600,
Seattle, WA 98195
e-mail: ramulum@uw.edu

Daniel G. Sanders

Boeing Research and Technology,
Metallic Materials and Processes,
The Boeing Company
P.O. Box 3707 MS 5K-63
Seattle, WA 98124-2207

1Corresponding author.

Manuscript received November 16, 2015; final manuscript received June 23, 2016; published online August 5, 2016. Assoc. Editor: Donggang Yao.

J. Manuf. Sci. Eng 138(12), 121010 (Aug 05, 2016) (9 pages) Paper No: MANU-15-1595; doi: 10.1115/1.4034133 History: Received November 16, 2015; Revised June 23, 2016

Titanium alloys are excellent candidates for aerospace applications due to their high strength-to-weight ratio and corrosion resistance. In the aerospace industry, diffusion bonding (DB) combined with superplastic forming is widely adopted to produce near net shape of titanium alloy structural parts. Of all the titanium alloys, bonding parameters have been well established for producing high-quality bonds only between Ti-6Al-4V and Ti-6Al-4V. The DB of similar alloys has been modeled successfully by many researchers. However, to date the DB time has not been modeled for dissimilar alloys. In the current work, the probabilistic model developed to predict DB time in similar titanium alloys is adapted for prediction of bonding time for Ti-64SG/Ti-6Al-2Sn-4Zr-2Mo SG dissimilar titanium alloys.

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Fig. 1

Surface profiles of dissimilar Ti-alloys aligned for surface characteristics at bonding interface

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Fig. 2

(a) Microstructure along the bonding interface: Ti-64SG/Ti-6242SG and (b) microstructure of fractured surface along bonding interface: Ti-64SG/Ti-6242SG

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Fig. 3

The vertical section through the cylindrical geometry used to define bonding [18]

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Fig. 4

Superimposed profile of bonding interface of dissimilar titanium alloys (Ti-64SG/Ti-6242SG)

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Fig. 5

Distribution fit of the void height at the bonding interface of dissimilar alloys—Ti64SG/Ti-6242SG

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Fig. 6

Revised superimposed profile at the bonding interface of dissimilar alloys—Ti64SG/Ti-6242SG (from the mean line of both the profiles)

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Fig. 7

Distribution fit of the void width at the bonding interface of dissimilar alloys—Ti64SG/Ti-6242SG

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Fig. 8

Variation of volume fraction of β phase with temperature in Ti-64SG/Ti-6242SG

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Fig. 9

Predicted CDF of bonding time at different temperatures for dissimilar Ti-64SG/Ti-6242SG

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Fig. 10

Diffusion bonding: Sample preparation (a) representative diffusion pack configuration, after evacuation and close out and (b) completed diffusion pack, in press

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Fig. 11

Effect of grain size diameter on bonding time

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Fig. 12

Effect of surface roughness on bonding time

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Fig. 13

Effect of temperature on bonding in similar and dissimilar Ti-64SG/Ti-6242SG joints

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Fig. 14

Flowchart of surface profile characterization and bonding time estimation at the joining interface of dissimilar alloys




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