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Research Papers

Investigation of Deformation Behavior of SS304 and Pure Copper Subjected to Electrically Assisted Forming Process

[+] Author and Article Information
Tianhao Jiang

State Key Laboratory of Mechanical System
and Vibration,
Shanghai Jiao Tong University,
Shanghai 200240, China
e-mail: jth@sjtu.edu.cn

Linfa Peng

State Key Laboratory of Mechanical System
and Vibration,
Shanghai Jiao Tong University,
Shanghai 200240, China
e-mail: penglinfa@sjtu.edu.cn

Peiyun Yi

State Key Laboratory of Mechanical System
and Vibration,
Shanghai Jiao Tong University,
Shanghai 200240, China
e-mail: yipeiyun@sjtu.edu.cn

Xinmin Lai

State Key Laboratory of Mechanical System
and Vibration,
Shanghai Jiao Tong University,
Shanghai 200240, China;
Shanghai Key Laboratory of Digital Manufacture
for Thin-Walled Structures,
Shanghai Jiao Tong University,
Shanghai 200240, China
e-mail: xmlai@sjtu.edu.cn

1Corresponding author.

Manuscript received March 12, 2016; final manuscript received May 29, 2016; published online August 8, 2016. Assoc. Editor: Gracious Ngaile.

J. Manuf. Sci. Eng 139(1), 011004 (Aug 08, 2016) (12 pages) Paper No: MANU-16-1161; doi: 10.1115/1.4033904 History: Received March 12, 2016; Revised May 29, 2016

Both electrically assisted tension (EAT) and thermally assisted tension (TAT) tests were performed on SS304 and pure copper to decouple the influence of elevated temperature from electric current on flow stress and ductility. It is found that the reduction on flow stress and ductility of SS304 are more dependent on the elevated temperature than electric current, but electric current has a stronger effect by 10% on reducing flow stress and ductility of pure copper than the elevated temperature does. As the flow stress and ductility of two metals are related to the dislocation evolution, a constitutive model considering both storage and annihilation process of dislocation was established to describe the effect of electric current and temperature on dislocation movement. It is found that electric current accelerated the annihilation process of dislocation in pure copper up to 20% in EAT compared with that in TAT, but such phenomenon was rarely observed in SS304. Furthermore, attempts have also been made to distinguish the influence of elevated temperature with that of electric current on microstructure evolution and it is also found that the formation of [111] crystals in pure copper is nearly 10% less in EAT than that in TAT.

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References

Figures

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Fig. 1

Stress reduction compared to room temperature tensile strength at various strains for 60 A/mm2 case with varying zinc content (data from Dzialo's research [19])

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Fig. 2

Dimensions of tensile specimen (unit: mm)

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Fig. 3

Schematic of tension setup: (a) EAT setup and (b) TAT setup [18]

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Fig. 4

Temperature distribution in both x-axis and y-axis of pure copper treated in 500 A/mm2 at the true strain of 0.18 and 0.29

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Fig. 5

Stress–strain curves of SS304: (i) true stress–strain curves (ii) engineering stress–strain curves and (a) electrically assisted tensile test (b) thermally assisted tensile test [18]

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Fig. 6

Flow stress alternation between EAT and TAT: (a) EAT of 100 A/mm2 and TAT of 100 °C and (b) EAT of 150 A/mm2 and TAT of 204 °C

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Fig. 7

Stress–strain curves of pure Cu: (i) true stress–strain curves (ii) engineering stress–strain curves and (a) electrically assisted tensile test and (b) thermally assisted tensile test

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Fig. 8

Flow stress alternation between EAT and TAT: (a) EAT of 500 A/mm2 and TAT of 75 °C and (b) EAT of 750 A/mm2 and TAT of 122 °C

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Fig. 9

Stress reductions of pure copper and SS304 treated in EAT and TAT (compared to room temperature tensile strength)

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Fig. 10

Maximum temperature distribution of pure copper when necking happens treated in EAT of 500 A/mm2

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Fig. 11

Maximum uniform engineering strain eue of pure copper and SS304 treated in EAT and TAT

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Fig. 12

eue reduction of pure copper and SS304 treated in EAT and TAT (compared to room temperature tensile ductility)

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Fig. 13

Error of softening effect model compared to experimental measurements of Cu: (a) EAT of 500 A/mm2 and TAT of 75 °C; (b) EAT of 750 A/mm2 and TAT of 122° C; (i) model from Ref. [41]; (ii) model from Ref. [42]

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Fig. 14

Hardness measurement under various experimental conditions

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Fig. 15

Comparison between uniform elongation eue obtained in the experiments and that calculated according to annihilation coefficient k2

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Fig. 16

Grain orientation maps of pure copper specimens under various experimental conditions

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Fig. 17

Volume fraction of [111] crystal treated in room temperature, EAT of 500 A/mm2, TAT of 75 °C, EAT of 750 A/mm2, and TAT of 122 °C at the true strain of 0.3

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