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Research Papers

Improving the Working Surface Condition of Electroplated Cubic Boron Nitride Grinding Quill in Surface Grinding of Inconel 718 by the Assistance of Ultrasonic Vibration

[+] Author and Article Information
Sisi Li

Graduate School,
Akita Prefectural University,
84-4 Aza Ebinokuchi Tsuchiya,
Yurihonjo, Akita 015-0055, Japan
e-mail: jjjjyyzzzz@gmail.com

Yongbo Wu

Machine Intelligence and Systems Engineering,
Akita Prefectural University,
Yurihonjo, Akita 015-0051, Japan
e-mail: wuyb@akita-pu.ac.jp

Masakazu Fujimoto

Department of Mechanical Engineering,
Aoyama Gakuin University,
Fuchinobe 5-10-1,
Chuo-ku,
Sagamihara-shi, Kanagawa 252-5258, Japan
e-mail: fujimoto@me.aoyama.ac.jp

Mitsuyoshi Nomura

Department of Machine Intelligence
and Systems Engineering,
Akita Prefectural University,
84-4 Aza Ebinokuchi Tsuchiya,
Yurihonjo, Akita 015-0055, Japan
e-mail: nomura@akita-pu.ac.jp

1Corresponding author.

Manuscript received April 3, 2015; final manuscript received November 7, 2015; published online March 9, 2016. Assoc. Editor: Z.J. Pei.

J. Manuf. Sci. Eng 138(7), 071008 (Mar 09, 2016) (8 pages) Paper No: MANU-15-1145; doi: 10.1115/1.4032080 History: Received April 03, 2015; Revised November 07, 2015

The working surface condition of abrasive tool is one of the important issues in grinding process. This article discusses the effects of the ultrasonic vibration on the working surface condition involving chips adhesion and abrasive grains wear during ultrasonic-assisted grinding (UAG) of Inconel 718 with an electroplated cBN grinding quill as the abrasive tool. In this study, scanning electron microscopic (SEM) observations were performed on the quill working surface before and after grinding at different vibration amplitudes, and the SEM images were filtered, extracted, and binarized by using image-pro plus to evaluate the quill working surface condition. The obtained results demonstrated that (1) the wear of grinding quill is dominantly attributed to chips adhesion, grains releasing, and grains fracture; (2) both the percentage of chips adhesion area and the size of chips adhered tend to decrease as the vibration amplitude increases; in contrast, the effect of ultrasonic vibration on the number of chips adhesion is not noticeable; (3) the percentage of the number of grains released/fractured decreases as the vibration amplitude rises, e.g., the percentage in UAG at vibration amplitude of App = 9.4 μm was decreased by 40% compared to that in conventional grinding (CG); and (4) higher distribution density of effective cutting edges can be achieved under larger vibration amplitude, and the mean area of effective cutting edges in UAG is smaller than that in CG, demonstrating that the ultrasonication enhances the grinding quill sharpness.

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Figures

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Fig. 1

Schematic illustration of the processing principle of UAG

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Fig. 2

The main portion of the experimental setup

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Fig. 3

Schematic illustration of geometric grain depth of cut gm in surface grinding

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Fig. 4

SEM images of the grinding quill working surfaces before (left sides)/after (right sides) grinding of Inconel 718 (a)without and (b) with ultrasonication

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Fig. 5

SEM images of chips adhered on the grinding quill working surface with and without ultrasonication

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Fig. 6

Effects of vibration amplitude on chips adhesion: (a) percentage of chips adhesion area; (b) number of chips adhered; and (c) mean area of chips

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Fig. 7

Effect of ultrasonic vibration amplitude on the percentage of the grain releasing/fracture number in CG and UAG of Inconel 718

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Fig. 8

Three-dimensional topographies of quill working surface (a) before and (b) after UAG

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Fig. 9

Islands, i.e., effective grain cutting edges, distributions at z = 30 μm

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Fig. 10

Variations of the distribution densities along the radial depth at different amplitudes

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Fig. 11

Variations of the mean cutting edge area along the radial depth

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Fig. 12

Grain cutting trace on workpiece: (a) 3D image of UAG and (b) grinding area of UAG

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Fig. 13

Effect of ultrasonic vibration amplitude on grinding forces

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Fig. 14

Effect of ultrasonic vibration amplitude on chip size: (a) chips formed in CG (left upper); (b) UAG at Ap–p = 9.4 μm (left below); and (c) variation of chip areas with amplitude

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Fig. 15

Effect of ultrasonic vibration amplitude on surface roughness

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Fig. 16

Effect of ultrasonic vibration amplitude on actual removal depth

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