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Research Papers

Force Modeling and Control of SiC Monocrystal Wafer Processing

[+] Author and Article Information
Shujuan Li

School of Mechanical and
Instrument Engineering,
Xi'an University of Technology,
5 South Jinhua Road,
Xi'an, Shaanxi 710048, China
e-mail: shujuanli@xaut.edu.cn

Siming Du

School of Mechanical and
Instrument Engineering,
Xi'an University of Technology,
5 South Jinhua Road,
Xi'an, Shaanxi 710048, China
e-mail: siming-du@hotmail.com

Aofei Tang

School of Mechanical and
Instrument Engineering,
Xi'an University of Technology,
5 South Jinhua Road,
Xi'an, Shaanxi 710048, China
e-mail: tangaofei@xaut.edu.cn

Robert G. Landers

Department of Mechanical and
Aerospace Engineering,
Missouri University of Science and Technology,
Rolla, MO 65409-0050
e-mail: landersr@mst.edu

Yang Zhang

Department of Mechanical and
Aerospace Engineering,
Missouri University of Science and Technology,
Rolla, MO 65409-0050
e-mail: yzqk6@mst.edu

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received June 1, 2014; final manuscript received December 12, 2014; published online September 9, 2015. Assoc. Editor: Tony Schmitz.

J. Manuf. Sci. Eng 137(6), 061003 (Sep 09, 2015) (10 pages) Paper No: MANU-14-1309; doi: 10.1115/1.4029432 History: Received June 01, 2014

Wire saws with fixed diamond abrasive are often used to cut hard and brittle materials owning to the wire saw's narrow kerf, low cutting force, and minimal material waste. Typically, the cutting force changes during the operation since the part diameter and the contact length between the wire saw and part (i.e., contact length) continuously change, even if the process parameters (i.e., wire saw velocity, part feed rate, part rotation speed, and wire saw tension) are fixed, leading to wire saw breakage, wafer collapse, and inferior surface roughness. This study addresses this issue by regulating the force via feedback control. The most significant process parameter affecting the normal force, namely, part feed rate, is taken as the control variable. A system identification routine is used to obtain the transfer function relating the normal force and commanded part feed rate and the model parameters are identified online. An adaptive force controller is designed, and simulation and experimental studies for SiC monocrystal wafer wire saw machining are conducted. The results show the dynamic model well characterizes the normal force generated when wire saw machining SiC monocrystal, and the adaptive controller can effectively track various normal reference force trajectories (i.e., constants, ramps, and sine waves). The experimental results demonstrate that the wire saw machining process with adaptive force control can improve the cutting productivity and significantly decrease wafer surface roughness as compared to the cutting process with a constant part feed rate.

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Figures

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Fig. 1

Wire saw machining schematic

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Fig. 2

Relationship of normal force model with experimental data for various part feed rates

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Fig. 3

Wire saw experimental system schematic

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Fig. 4

Cutting force schematic

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Fig. 5

Experimental results for constant reference force tracking

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Fig. 6

Tangential force for constant part feed rates of 0.05 and 0.075 mm/min as wire changes direction

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Fig. 7

Experimental results for square wave reference force tracking

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Fig. 8

Experimental results for triangle wave reference force tracking

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Fig. 9

Experimental results for sine wave reference force tracking

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Fig. 10

Normal force profile for experiments with different reference forces and constant part feed rate of 0.05 mm/min

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Fig. 11

Part feed rates for controlled experiments with different reference forces

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Fig. 12

Wafer surface topographies for adaptive controller with a reference forces of (a) 5.4 N, (b) 3.6 N, (c) 1.8 N, and (d) constant part feed rate of 0.05 mm/min at wafer radius of 33 mm.

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Fig. 13

Surface roughness for all four experiments at different wafer radii, where 0 corresponds to the wafer center

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