Research Papers

A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond

[+] Author and Article Information
Florestan Schindler

Laboratory for Machine Tools
and Production Engineering (WZL)
of RWTH Aachen University,
Steinbachstr. 19,
Aachen D52074, Germany
e-mail: f.schindler@wzl.rwth-aachen.de

Richard Brocker

Laboratory for Machine Tools
and Production Engineering (WZL)
of RWTH Aachen University,
Steinbachstr. 19,
Aachen D52074, Germany
e-mail: r.brocker@wzl.rwth-aachen.de

Fritz Klocke

Laboratory for Machine Tools
and Production Engineering (WZL)
of RWTH Aachen University,
Steinbachstr. 19,
Aachen D52074, Germany
e-mail: f.klocke@wzl.rwth-aachen.de

Patrick Mattfeld

Laboratory for Machine Tools
and Production Engineering (WZL)
of RWTH Aachen University,
Steinbachstr. 19,
Aachen D52074, Germany
e-mail: p.mattfeld@wzl.rwth-aachen.de

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received August 29, 2014; final manuscript received February 9, 2015; published online September 9, 2015. Assoc. Editor: Guillaume Fromentin.

J. Manuf. Sci. Eng 138(1), 011002 (Sep 09, 2015) (5 pages) Paper No: MANU-14-1449; doi: 10.1115/1.4029804 History: Received August 29, 2014

Polycrystalline diamond (PCD) grinding takes an important role in the field of tool manufacture. Regardless, there is still lack of process knowledge about the occurring material removal mechanisms in PCD grinding. In order to get a better understanding of the process characteristics, the surface integrity zone of PCD inserts has been analyzed in detail after grinding for the first time. The drawn conclusion questions solely ductile or brittle behavior as removal mechanisms. Both thermal and mechanical process loads during the grinding process lead to thermophysical and chemical effects on a micro- and mesoscopic-scale and might thus have a significant impact on the material removal mechanism.

Copyright © 2016 by ASME
Topics: Grinding , Diamonds
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Abele, E. , and Schramm, B. , 2008, “Using PCD for Machining CGI With CO2 Coolant System,” Prod. Eng. Res. Dev., 2(2), pp. 165–169. [CrossRef]
Heath, P. J. , 2011, “Developments in Applications of PCD Tooling,” J. Mater. Process. Technol., 116(1), pp. 31–38. [CrossRef]
Kozak, J. , Rajurkar, K. P. , and Wang, S. Z. , 1994, “Material Removal in WEDM of PCD Blanks,” ASME J. Manuf. Sci. Eng., 116(3), pp. 363–369.
Tso, P.-L. , and Liu, Y.-G. , 2002, “Study on PCD Machining,” Int. J. Mach. Tools Manuf., 42(3), pp. 331–334. [CrossRef]
Linke, B. S. , “Review on Grinding Tool Wear With Regard to Sustainability,” ASME J. Manuf. Sci. Eng. (to be published).
Kenter, M. , 1990, Schleifen von polykristallinem Diamant, Dissertation, Bremen University, Bremen, Germany.
Fineberg, J. , 2011, “Tribology: Diamonds Are Forever—Or Are They?,” Nat. Mater., 10(3–4), pp. 3–4. [CrossRef] [PubMed]
Vervoort, L. , 1910, Diamond Its Properties and Its Machining, State Library Munich, Antwerp, Belgium.
Pierson, H. , 1993, Handbook of Carbon, Graphite, Diamond and Fullerenes; Properties, Processing and Applications, Noyes Publications, Albuquerque, NM.
Lachmund, U. , and Spur, G. , 1997, “Verschleißverhalten von polykristallinem Diamant bei instationärer Beanspruchung,” Ph.D. dissertation, Technical University of Berlin, Berlin.
Friemuth, T. , 2002, Herstellung spanender Werkzeuge, Habilitation, Hannover University, Hannover, Germany.
Brecher, C. , Klocke, F. , Schindler, F. , Janssen, A. , Fischer, B. , and Hermani, J.-P. , 2013, “Finishing of Polycrystalline Diamond Tools by Combining Laser Ablation With Grinding,” Prod. Eng. Res. Dev., 7(4), pp. 361–371. [CrossRef]
Koshy, P. , Jain, V. K. , and Lal, G. K. , 1996, “Mechanism of Material Removal in Electrical Discharge Diamond Grinding,” Int. J. Mach. Tools Manuf., 36(10), pp. 1173–1185. [CrossRef]
Kozak, J. , 2002, “Abrasive Electrodischarge Grinding (AEDG) of Advanced Materials,” Arch. Civ. Mech. Eng., 2(1–2), pp. 83–101.
Liu, X. L. , Yan, F. G. , Wang, Y. , Hu, J. S. , and Wang, Y. J. , 2006, “Study on Precision Grinding Technique of PCD Tool's Cutting Edge,” Key Eng. Mater., 305, pp. 186–190. [CrossRef]
Bifano, T. G. , Dow, T. A. , and Scattergood, R. O. , 1991, “Ductile-Regime Grinding: A New Technology for Machining Brittle Materials,” J. Eng. Ind., 113(2), pp. 186–189. [CrossRef]
Chen, Y. , Zhang, L. C. , Arsecularatne, J. A. , and Montross, C. , 2006, “Polishing of Polycrystalline Diamond by the Technique of Dynamic Friction Part I-V,” Int. J. Mach. Tools Manuf., 46(6), pp. 580–587. [CrossRef]
Pastewka, L. , Moser, S. , Gumbsch, P. , and Moseler, M. , 2010, “Anisotropic Mechanical Amorphization Drives Wear in Diamond,” Nat. Mater., 10(1), pp. 34–38. [CrossRef] [PubMed]
Element Six Ltd., 2014, “Diamond Materials for Metalworking,” (last accessed Sept. 25, 2014), http://www.e6.com
De Fonton, S. , Oberlin, A. , and Inagaki, M. , 1980, “Characterization by Electron Microscopy of Carbon Phases (Intermediate Turbostratic Phase Graphite) in Hard Carbons When Heat-Treated Under Pressure,” J. Mater. Sci., 15(4), pp. 909–917. [CrossRef]
Kuznetsov, V. L. , Zilberg, I. L. , Butenko, Y. V. , Chuvilin, A. L. , and Segal, B. , 1999, “Theoretical Study of the Formation of Closed Curved Graphite Like Structures During Annealing of Diamond Surface,” J. Appl. Phys., 86(2), pp. 863–870. [CrossRef]
Oya, A. , and Marsh, H. , 1982, “Phenomena of Catalytic Graphitization,” J. Mater. Sci., 17(2), pp. 309–322. [CrossRef]
Pawlyta, M. , 2013, “Transmission Electron Microscope Studies on Carbon Nanostructured Materials,” Arch. Mater. Sci. Eng., 63(2), pp. 58–67.
Ralchenko, V. , Nistor, L. , Pleuler, E. , Khomich, A. , Vlasov, I. , and Khmelnitskii, R. , 2003, “Structure and Properties of High-Temperature Annealed CVD Diamond,” Diamond Relat. Mater., 12(10–11), pp. 1–8.
Tomita, S. , Hikita, M. , Fujii, M. , Hayashi, S. , Akamatsu, K. , Deki, S. , and Yasuda, H. , 2000, “Formation of Co Filled Carbon Nanotubes by Metal-template Graphitization of Diamond Nanoparticles,” J. Appl. Phys., 88(9), pp. 5452–5456. [CrossRef]


Grahic Jump Location
Fig. 1

Material removal mechanisms in PCD grinding

Grahic Jump Location
Fig. 2

SEM analyses of PCD flank before and after grinding

Grahic Jump Location
Fig. 3

PCD lamella after FIB-preparation

Grahic Jump Location
Fig. 4

STEM pictures of the PCD subsurface for lamella O, after grinding

Grahic Jump Location
Fig. 5

STEM picture of the PCD subsurface for lamella P, after grinding

Grahic Jump Location
Fig. 6

HRTEM magnification of the transition zone at the PCD subsurface




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