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Research Papers

A Discussion on Removal Mechanisms in Grinding Polycrystalline Diamond

[+] Author and Article Information
Florestan Schindler

Laboratory for Machine Tools
and Production Engineering (WZL)
of RWTH Aachen University,
Steinbachstr. 19,
Aachen D52074, Germany
e-mail: f.schindler@wzl.rwth-aachen.de

Richard Brocker

Laboratory for Machine Tools
and Production Engineering (WZL)
of RWTH Aachen University,
Steinbachstr. 19,
Aachen D52074, Germany
e-mail: r.brocker@wzl.rwth-aachen.de

Fritz Klocke

Mem. ASME
Laboratory for Machine Tools
and Production Engineering (WZL)
of RWTH Aachen University,
Steinbachstr. 19,
Aachen D52074, Germany
e-mail: f.klocke@wzl.rwth-aachen.de

Patrick Mattfeld

Laboratory for Machine Tools
and Production Engineering (WZL)
of RWTH Aachen University,
Steinbachstr. 19,
Aachen D52074, Germany
e-mail: p.mattfeld@wzl.rwth-aachen.de

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received August 29, 2014; final manuscript received February 9, 2015; published online September 9, 2015. Assoc. Editor: Guillaume Fromentin.

J. Manuf. Sci. Eng 138(1), 011002 (Sep 09, 2015) (5 pages) Paper No: MANU-14-1449; doi: 10.1115/1.4029804 History: Received August 29, 2014

Polycrystalline diamond (PCD) grinding takes an important role in the field of tool manufacture. Regardless, there is still lack of process knowledge about the occurring material removal mechanisms in PCD grinding. In order to get a better understanding of the process characteristics, the surface integrity zone of PCD inserts has been analyzed in detail after grinding for the first time. The drawn conclusion questions solely ductile or brittle behavior as removal mechanisms. Both thermal and mechanical process loads during the grinding process lead to thermophysical and chemical effects on a micro- and mesoscopic-scale and might thus have a significant impact on the material removal mechanism.

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Copyright © 2016 by ASME
Topics: Grinding , Diamonds
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Figures

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Fig. 1

Material removal mechanisms in PCD grinding

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Fig. 2

SEM analyses of PCD flank before and after grinding

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Fig. 3

PCD lamella after FIB-preparation

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Fig. 4

STEM pictures of the PCD subsurface for lamella O, after grinding

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Fig. 5

STEM picture of the PCD subsurface for lamella P, after grinding

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Fig. 6

HRTEM magnification of the transition zone at the PCD subsurface

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