Research Papers

Microstructure Effects on Cutting Forces and Flow Stress in Ultra-Precision Machining of Polycrystalline Brittle Materials

[+] Author and Article Information
Siva Venkatachalam

Corning, NY 14831
e-mail: venkatacS@corning.com

Omar Fergani

George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: omar.fergani@me.gatech.edu

Xiaoping Li

Department of Mechanical Engineering,
National University of Singapore,
Singapore 119260, Singapore
e-mail: mpelixp@nus.edu.sg

Jiang Guo Yang

School of Mechanical Engineering,
Donghua University,
Shanghai 200051, China
e-mail: jgyangm@dhu.edu.cn

Kuo-Ning Chiang

Fellow ASME
Department of Power Mechanical Engineering,
National Tsing Hua University,
Hsinchu 30013, Taiwan, China
e-mail: knchiang@pme.nthu.edu.tw

Steven Y. Liang

Fellow ASME
George W. Woodruff School
of Mechanical Engineering,
Georgia Institute of Technology,
Atlanta, GA 30332
e-mail: steven.liang@me.gatech.edu

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received November 18, 2013; final manuscript received December 22, 2014; published online February 11, 2015. Assoc. Editor: Eric R. Marsh.

J. Manuf. Sci. Eng 137(2), 021020 (Apr 01, 2015) (8 pages) Paper No: MANU-13-1403; doi: 10.1115/1.4029648 History: Received November 18, 2013; Revised December 22, 2014; Online February 11, 2015

This paper presents a physics-based analysis to quantitatively describe the effects of grain size, grain boundaries, and crystallographic orientation on the flow stress of the polycrystalline material and thereby on the cutting and thrust forces. The model has been experimentally validated, in terms of the force intensities and sensitivities to microstructure attributes such as the grain size and the misorientation by comparing the forces to measured data in micromachining of polycrystalline silicon carbide (p-SiC). Molecular dynamics (MD) simulations are performed to explore the effects of grain boundaries and misorientation and to validate the modeling analysis in the context of resulting force ratios.

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Fig. 1

Geometrical model for cutting forces

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Fig. 2

Schematic of machining setup and cutting force measurement system

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Fig. 3

Measured cutting and thrust forces for p-SiC

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Fig. 4

Grain size measurements for p-SiC

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Fig. 5

(a) p-SiC grain size measurement results and (b) lognormal distribution for grain size

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Fig. 6

Comparison of measured and predicted cutting and thrust forces for p-SiC

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Fig. 7

Variation of normal flow stress with grain size (D)

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Fig. 8

Force comparisons illustrating the effects of microstructure

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Fig. 9

Main effects plot for (a) cutting force (Fc) and (b) thrust force (Ft)

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Fig. 10

The deformation of (a) chip formation zone and (b) grain boundary zone

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Fig. 11

Results of cutting and thrust forces from MD simulation




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