Research Papers

Mask-Less Electrochemical Additive Manufacturing: A Feasibility Study

[+] Author and Article Information
Murali M. Sundaram

Department of Mechanical
and Materials Engineering,
University of Cincinnati,
598 Rhodes Hall,
Cincinnati, OH 45221-0072
e-mail: murali.sundaram@uc.edu

Abishek B. Kamaraj

Department of Mechanical
and Materials Engineering,
University of Cincinnati,
634 Rhodes Hall,
Cincinnati, OH 45221-0072
e-mail: balsamak@mail.uc.edu

Varun S. Kumar

Department of Mechanical
and Materials Engineering,
University of Cincinnati,
634 Rhodes Hall,
Cincinnati, OH 45221-0072
e-mail: sharanvn@mail.uc.edu

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received April 15, 2014; final manuscript received October 29, 2014; published online December 12, 2014. Assoc. Editor: Joseph Beaman.

J. Manuf. Sci. Eng 137(2), 021006 (Apr 01, 2015) (9 pages) Paper No: MANU-14-1203; doi: 10.1115/1.4029022 History: Received April 15, 2014; Revised October 29, 2014; Online December 12, 2014

Additive manufacturing (AM) of metallic structures by laser based layered manufacturing processes involve thermal damages. In this work, the feasibility of mask-less electrochemical deposition as a nonthermal metallic AM process has been studied. Layer by layer localized electrochemical deposition using a microtool tip has been performed to manufacture nickel microstructures. Three-dimensional free hanging structures with about 600 μm height and 600 μm overhang are manufactured to establish the process capability. An inhouse built CNC system was integrated in this study with an electrochemical cell to achieve 30 layers thick microparts in about 5 h by AM directly from STL files generated from corresponding CAD models. The layer thickness achieved in this process was about 10 μm and the minimum feature size depends on the tool width. Simulation studies of electrochemical deposition performed to understand the pulse wave characteristics and their effects on the localization of the deposits.

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Bandyopadhyay, A., Krishna, B., Xue, W., and Bose, S., 2009, “Application of Laser Engineered Net Shaping (LENS) to Manufacture Porous and Functionally Graded Structures for Load Bearing Implants,” J. Mater. Sci.: Mater. Med., 20(1), pp. 29–34 [CrossRef].
Guo, N., and Leu, M. C., 2013, “Additive Manufacturing: Technology, Applications and Research Needs,” Front. Mech. Eng., 8(3), pp. 215–243. [CrossRef]
Lyons, B., 2012, “Additive Manufacturing in Aerospace: Examples and Research Outlook,” The Bridge, 42(1), pp. 13-19. https://www.nae.edu/Publications/Bridge/57865/58467.aspx
Vaezi, M., Seitz, H., and Yang, S., 2012, “A Review on 3D Micro-Additive Manufacturing Technologies,” Int. J. Adv. Manuf. Technol., 67(5–8), pp. 1721–1754. [CrossRef]
Paul, R., Anand, S., and Gerner, F., 2014, “Effect of Thermal Deformation on Part Errors in Metal Powder Based Additive Manufacturing Processes,” ASME J. Manuf. Sci. Eng., 136(3), p. 031009. [CrossRef]
Edwards, P., O'Conner, A., and Ramulu, M., 2013, “Electron Beam Additive Manufacturing of Titanium Components: Properties and Performance,” ASME J. Manuf. Sci. Eng., 135(6), p. 061016. [CrossRef]
Kruth, J. P., Froyen, L., Van Vaerenbergh, J., Mercelis, P., Rombouts, M., and Lauwers, B., 2004, “Selective Laser Melting of Iron-Based Powder,” J. Mater. Process. Technol., 149(1–3), pp. 616–622. [CrossRef]
Bard, A. J., Huesser, O. E., and Craston, D. H., 1990, “High Resolution Deposition and Etching in Polymer Films,” Google Patents, Patent No. US4968390A.
Kadekar, V., Fang, W., and Liou, F., 2005, “Deposition Technologies for Micromanufacturing: A Review,” ASME J. Manuf. Sci. Eng., 126(4), pp. 787–795. [CrossRef]
Madden, J. D., and Hunter, I. W., 1996, “Three-Dimensional Microfabrication by Localized Electrochemical Deposition,” J. Microelectromech. Syst., 5(1), pp. 24–32. [CrossRef]
El‐Giar, E. M., Said, R. A., Bridges, G. E., and Thomson, and D. J., 2000, “Localized Electrochemical Deposition of Copper Microstructures,” J. Electrochem. Soc., 147(2), pp. 586–591. [CrossRef]
Jansson, A., Thornell, G., and Johansson, S., 2000, “High Resolution 3D Microstructures Made by Localized Electrodeposition of Nickel,” J. Electrochem. Soc., 147(5), pp. 1810–1817. [CrossRef]
Yeo, S. H., and Choo, J. H., 2001, “Effects of Rotor Electrode in the Fabrication of High Aspect Ratio Microstructures by Localized Electrochemical Deposition,” J. Micromech. Microeng., 11(5), pp. 435–442. [CrossRef]
Lin, J. C., Chang, T. K., Yang, J. H., Jeng, J. H., Lee, D. L., and Jiang, S. B., 2009, “Fabrication of a Micrometer Ni–Cu Alloy Column Coupled With a Cu Micro-Column for Thermal Measurement,” J. Micromech. Microeng., 19(1). p. 015030. [CrossRef]
Cohen, A., Zhang, G., Tseng, F. G., Frodis, U., Mansfeld, F., and Will, P., 1999, “EFAB: Rapid, Low-Cost Desktop Micromachining of High Aspect Ratio True 3-D MEMS,” Proceedings of the 12th IEEE International Conference on Micro Electro Mechanical Systems, MEMS '99, Orlando, FL, Jan. 21–21, pp. 244–251.
Mughal, M. P., Fawad, H., and Mufti, R., 2006, “Finite Element Prediction of Thermal Stresses and Deformations in Layered Manufacturing of Metallic Parts,” Acta Mech., 183(1–2), pp. 61–79. [CrossRef]
Regenfuß, P., Ebert, R., Klötzer, S., Hartwig, L., Exner, H., Brabant, T., and Petsch, T., 2004, “Industrial Laser Micro Sintering,” Proceedings of the 4th LANE, Erlangen, Germany, Sept. 21–24, pp. 413–424.
Clare, A. T., Chalker, P. R., Davies, S., Sutcliffe, C. J., and Tsopanos, S., 2008, “Selective Laser Melting of High Aspect Ratio 3D Nickel–Titanium Structures Two Way Trained for MEMS Applications,” Int. J. Mech. Mater. Des., 4(2), pp. 181–187. [CrossRef]
Gibson, I., Rosen, D. W., and Stucker, B., 2010, Additive Manufacturing Technologies: Rapid Prototyping to Direct Digital Manufacturing, Springer-Verlag, New York.
Derby, B., and Reis, N., 2003, “Inkjet Printing of Highly Loaded Particulate Suspensions,” MRS Bull., 28(11), pp. 815–818. [CrossRef]
Wang, F., Shor, L., Darling, A., Khalil, S., Sun, W., Güçeri, S., and Lau, A., 2004, “Precision Extruding Deposition and Characterization of Cellular Poly-Caprolactone Tissue Scaffolds,” Rapid Prototyping J., 10(1), pp. 42–49. [CrossRef]
Yim, P., 1996, “The Role of Surface Oxidation in the Break-Up of Laminar Liquid Metal Jets,” Ph. D. thesis, Massachusetts Institute of Technology, University in Cambridge, MA.
Lai, W.-H., and Chen, C.-C., 2005, “Effect of Oxidation on the Breakup and Monosized Droplet Generation of the Molten Metal Jet,” Atomization Sprays, 15(1), pp. 81–102. [CrossRef]
Said, R. A., 2004, “Localized Electro-Deposition (LED): The March Toward Process Development,” Nanotechnology, 15(10), pp. S649–S659. [CrossRef]
Said, R. A., 2004, “Adaptive Tip-Withdrawal Control for Reliable Microfabrication by Localized Electrodeposition,” J. Microelectromech. Syst., 13(5), pp. 822–832. [CrossRef]
Chang, T. K., Lin, J. C., Yang, J. H., Yeh, P. C., Lee, D. L., and Jiang, S. B., 2007, “Surface and Transverse Morphology of Micrometer Nickel Columns Fabricated by Localized Electrochemical Deposition,” J. Micromech. Microeng., 17(11), pp. 2336–2343. [CrossRef]
Lin, J. C., Chang, T. K., Yang, J. H., Chen, Y. S., and Chuang, C. L., 2010, “Localized Electrochemical Deposition of Micrometer Copper Columns by Pulse Plating,” Electrochim. Acta, 55(6), pp. 1888–1894. [CrossRef]
Habib, M. A., Gan, S. W., and Rahman, M., 2009, “Fabrication of Complex Shape Electrodes by Localized Electrochemical Deposition,” J. Mater. Process. Technol., 209(9), pp. 4453–4458. [CrossRef]
Lin, J., Chang, T., Yang, J., Chen, Y., and Chuang, C., 2010, “Localized Electrochemical Deposition of Micrometer Copper Columns by Pulse Plating,” Electrochim. Acta, 55(6), pp. 1888–1894. [CrossRef]
Chandrasekar, M. S., and Pushpavanam, M., 2008, “Pulse and Pulse Reverse Plating—Conceptual, Advantages and Applications,” Electrochim. Acta, 53(8), pp. 3313–3322. [CrossRef]
Gamburg, Y., and Zangari, G., 2011, “Non-Steady State Electrodeposition Processes and Electrochemical Methods,” Theory and Practice of Metal Electrodeposition, Springer, New York, pp. 189–204 [CrossRef].
Schuster, R., 2007, “Electrochemical Microstructuring With Short Voltage Pulses,” ChemPhysChem, 8(1), pp. 34–39. [CrossRef] [PubMed]
Kamaraj, A. B., and Sundaram, M. M., 2013, “Mathematical Modeling and Verification of Pulse Electrochemical Micromachining of Microtools,” Int. J. Adv. Manuf. Technol., 68(5–8), pp. 1055–1061. [CrossRef]
Hoar, T., and Agar, J., 1947, “Factors in Throwing Power Illustrated by Potential-Current Diagrams,” Discuss. Faraday Soc., 1, pp. 162–168. [CrossRef]
Abdel-Hamid, Z., 1998, “Improving the Throwing Power of Nickel Electroplating Baths,” Mater. Chem. Phys., 53(3), pp. 235–238. [CrossRef]
Brant, A., Sundaram, M., and Kamaraj, A. B., 2014, “Finite Element Simulation of Localized Electrochemical Deposition for Mask-Less Electrochemical Additive Manufacturing,” ASME J. Manuf. Sci. Eng., (to be published). [CrossRef]
Dolenc, A., and Mäkelä, I., 1994, “Slicing Procedures for Layered Manufacturing Techniques,” Comput.-Aided Des., 26(2), pp. 119–126. [CrossRef]
Ryu, S. H., 2009, “Micro Fabrication by Electrochemical Process in Citric Acid Electrolyte,” J. Mater. Process. Technol., 209(6), pp. 2831–2837. [CrossRef]
Schuster, R., Kirchner, V., Allongue, P., and Ertl, G., 2000, “Electrochemical Micromachining,” Science, 289(5476), pp. 98–101. [CrossRef] [PubMed]


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Fig. 1

Approach followed to achieve mask-less ECAM

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Fig. 2

(Left) schematic of ECAM setup (right) in-house built micro-CNC stage and AM center

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Fig. 3

Overall ECAM process schematic

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Fig. 4

Electrical equivalent circuit for the deposition

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Fig. 5

Comparison of simulated and experimentally measured voltage characteristics during electrochemical deposition

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Fig. 6

Comparison of deposition times for varying applied voltage, interelectrode gap, and duty cycle

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Fig. 7

Cross-sectional view of the various outcomes of ECAM process

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Fig. 8

3D free hanging nickel microstructures built using two different control mechanisms for the tool motion

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Fig. 9

Scanning electron micrograph of the 7 deposited at a 60 deg tilt

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Fig. 10

Optical image and the profilometer scan of the line deposit

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Fig. 11

Optical microscope image of U shaped geometry and profilometer scan

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Fig. 12

Dimensions of the UC shaped geometry

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Fig. 13

Optical microscope image of UC shaped geometry and profilometer scan

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Fig. 14

Screenshot of the Mach3 window

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Fig. 15

(Left) part model and (right) the two layer deposit of the part

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Fig 16

(a) CAD model of letter “C” to be manufactured in 30 layers and (b) SEM image of electrochemically additive manufactured part




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