Research Papers

Modeling of Material Removal Rate in Vibration Assisted Nano Impact-Machining by Loose Abrasives

[+] Author and Article Information
Sagil James

Department of Mechanical
and Materials Engineering,
University of Cincinnati,
Cincinnati, OH 45221
e-mail: jamess5@mail.uc.edu

Murali M. Sundaram

Department of Mechanical
and Materials Engineering,
University of Cincinnati,
Cincinnati, OH 45221
e-mail: murali.sundaram@uc.edu

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received May 15, 2014; final manuscript received July 30, 2014; published online December 12, 2014. Assoc. Editor: Z. J. Pei.

J. Manuf. Sci. Eng 137(2), 021008 (Apr 01, 2015) (6 pages) Paper No: MANU-14-1284; doi: 10.1115/1.4028199 History: Received May 15, 2014; Revised July 30, 2014; Online December 12, 2014

Vibration assisted nano impact-machining by loose abrasives (VANILA) is a novel nanomachining process that combines the principles of vibration-assisted abrasive machining, and tip-based nanomachining, to perform target specific nano abrasive machining of hard and brittle materials. An atomic force microscope (AFM) is used as a platform in this process wherein, nano abrasives, injected in slurry between the workpiece and the vibrating AFM probe, impact the workpiece and cause nanoscale material removal. The objective of this study is to develop a mathematical model to determine the material removal rate (MRR) in the VANILA process. The experimental machining results reveal that the material removal happens primarily in ductile mode due to repeated deformation which happens at near normal angles of impact. A predictive model for MRR during the VANILA process is analytically developed based on elastoplastic impact theory for normal angles of impact. The model is validated through a series of experiments performed on silicon and borosilicate glass substrates and the results confirm that the model is capable of predicting the machining results within 10% deviation.

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Fig. 1

Schematic diagram of the VANILA process

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Fig. 2

Pattern design and AFM image of nanocavity pattern machined using the VANILA process (a) on silicon substrate [5]

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Fig. 3

Topography and cross section of the machined nanocavities on (a) silicon and (b) borosilicate glass

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Fig. 4

Modeling framework for material removal during VANILA process

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Fig. 5

Schematic showing machining zone in VANILA Process

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Fig. 6

Factors affecting nanoscale material removal during VANILA process

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Fig. 7

Experimental setup (inset: fluid cell)

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Fig. 8

Illustration of using nanoscope software's bearing analysis function to measure volume of nanocavities machined through the VANILA process

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Fig. 9

(a) Comparison of theoretical and experimental MRR for silicon substrate and (b) comparison of theoretical and experimental MRR for borosilicate glass substrate




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