Research Papers

Unified Criterion for Brittle–Ductile Transition in Mechanical Microcutting of Brittle Materials

[+] Author and Article Information
X. Cheng, X. T. Wei, X. H. Yang

School of Mechanical Engineering,
Shandong University of Technology,
Zibo 255049, China

Y. B. Guo

Department of Mechanical Engineering,
The University of Alabama,
Tuscaloosa, AL 35487
e-mail: yguo@eng.ua.edu

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the JOURNAL OF MANUFACTURING SCIENCE AND ENGINEERING. Manuscript received January 1, 2014; final manuscript received June 28, 2014; published online August 6, 2014. Assoc. Editor: Donggang Yao.

J. Manuf. Sci. Eng 136(5), 051013 (Aug 06, 2014) (7 pages) Paper No: MANU-14-1002; doi: 10.1115/1.4027996 History: Received January 01, 2014; Revised June 28, 2014

Various brittle–ductile transition (BDT) criteria have been developed in the literature to estimate the critical conditions for ductile microcutting of brittle materials. This study provides a unified criterion to efficiently and accurately estimate the critical condition based on the indentation model on brittle materials. The unified criterion correlates with the cutting edge radius, material properties, and a dimensionless coefficient fitted by the experimental data. It shows that the cutting edge geometry is the dominant factor and the maximum undeformed chip thickness (MUCT) can be used as the unified criterion in BDTs. Based on the proposed model, microturning and micromilling have been analyzed to determine the threshold value of the MUCT for ductile microcutting. The model has been validated by the experimental data. Based on the models and three-dimensional geometrical model of microcutting, a further analysis shows that the process conditions greatly affect the microcutting efficiency even though all the conditions may achieve the ductile-regime cutting.

Copyright © 2014 by ASME
Your Session has timed out. Please sign back in to continue.


Rusnaldy, Ko, T. J., and Kim, H. S., 2007, “Micro-End-Milling of Single-Crystal Silicon,” Int. J. Mach. Tools Manuf., 47(14), pp. 2111–2119. [CrossRef]
Matsumura, T., Aristimuno, P., Gandarias, E., and Arrazola, P. J., 2013, “Cutting Process in Glass Peripheral Milling,” J. Mater. Process. Technol., 213(9), pp. 1523–1531. [CrossRef]
Liu, K., Li, X. P., Rahman, M., Neo, K. S., and Liu, X. D., 2007, “A Study on the Effect of Tool Cutting Edge Radius on Ductile Cutting of Silicon Wafers,” Int. J. Adv. Manuf. Technol., 32(7–8), pp. 631–637. [CrossRef]
Rusnaldy, Ko, T. J., and Kim, H. S., 2008, “An Experimental Study on Microcutting of Silicon Using a Micromilling Machine,” Int. J. Adv. Manuf. Technol., 39(1–2), pp. 85–91. [CrossRef]
Chao, C. L., Ma, K. J., Liu, D. S., Bai, C. Y., and Shy, T. L., 2002, “Ductile Behavior in Single-Point Diamond-Turning of Single-Crystal Silicon,” J. Mater. Process. Technol., 127(2), pp. 187–190. [CrossRef]
Blake, P. N., 1990, “Ductile-Regime Machining of Germanium and Silicon,” J. Am. Ceram. Soc., 73(4), pp. 949–957. [CrossRef]
Fang, F. Z., Wu, H., and Liu, Y. C., 2005, “Modeling and Experimental Investigation on Nanometric Cutting of Monocrystalline Silicon,” Int. J. Mach. Tools. Manuf., 45(15), pp. 1681–1686. [CrossRef]
Cai, M. B., Li, X. P., and Rahman, M., 2007, “Molecular Dynamics Modeling and Simulation of Nanoscale Ductile Cutting of Silicon,” Int. J. Comput. Appl. Technol., 28(1), pp. 2–8. [CrossRef]
Tanaka, H., Shimada, S., and Ikawa, N., 2004, “Brittle-Ductile Transition in Monocrystalline Silicon Analysed by Molecular Dynamics Simulation,” Proc. Inst. Mech. Eng., Part C, 218(6), pp. 583–590. [CrossRef]
Inanura, T., Takezawa, N., and Kumaki, Y., 1994, “Mechanics and Energy Dissipation in Nanoscale Cutting,” CIRP Ann. - Manuf. Technol., 42(1), pp. 79–82. [CrossRef]
Zhang, X. Q., Arif, M., Liu, K., Kumar, A. S., and Rahman, M., 2013, “A Model to Predict the Critical Undeformed Chip Thickness in Vibration-Assisted Cutting of Brittle Materials,” Int. J. Mach. Tools Manuf., 69, pp. 57–66. [CrossRef]
Arefin, S., Li, X. P., Rahman, M., and Liu, K., 2007, “The Upper Bound of Tool Edge Radius for Nanoscale Ductile Mode Cutting of Silicon Wafer,” Int. J. Mach. Tools Manuf., 31(7–8), pp. 655–662. [CrossRef]
Arif, M., Rahman, M., and San, W. Y., 2011, “Analytical Model to Determine the Critical Feed per Edge for Ductile Brittle Transition in Milling Process of Brittle Materials,” Int. J. Mach. Tools Manuf., 51(3), pp. 170–181. [CrossRef]
Chiu, W. C., Endres, W. J., and Thouless, M. D., 2001, “An Analysis of Surface Cracking During Orthogonal Cutting of Glass,” Mach. Sci. Technol., 5(2), pp. 195–215. [CrossRef]
Arif, M., Rahman, M., and San, W. Y., 2012, “Analytical Model to Determine the Critical Conditions for the Modes of Materials Removal in the Milling Process of Brittle Material,” J. Mater. Process. Technol., 212(9), pp. 1925–1933. [CrossRef]
Lawn, B. R., and Evans, A. G., 1977, “A Model for Crack Initiation in Elastic/Plastic Indentation Fields,” J. Mater. Sci., 12(11), pp. 2195–2199. [CrossRef]
Pethica, J. B., Hutchings, R., and Oliver, W. C., 1983, “Hardness Measurement at Penetration Depths as Small as 20 nm,” Philos. Mag. A, 48(4), pp. 593–606. [CrossRef]
Lawn, B., 1983, Fracture of Brittle Solids, Cambridge University, Cambridge, UK.
George, J., and Peter, G., 1985, “Microindentation Analysis of Di-Ammonium Hydrogen Citrate Single Crystals,” J. Mater. Sci., 20(9), pp. 3150–3156. [CrossRef]
Tiwari, A., 2013, Nanomechanical Analysis of High Performance Materials, Springer, London.
Lawn, B. R., Marshall, D. B., and Wiederhorn, S. M., 1979, “Strength Degradation of Glass Impacted With Sharp Particles—2. Tempered Surfaces,” J. Am. Ceram. Soc., 62(1–2), pp. 71–74. [CrossRef]
Jajam, K. J., and Tippur, H. V., 2012, “Quasi-Static and Dynamic Fracture Behavior of Particulate Polymer Composites: A Study of Nano- vs. Micro-Size Filler and Loading-Rate Effects,” Composites, Part B, 43(8), pp. 3467–3481. [CrossRef]
Chen, M. J., Don, S., Li, D., and Zhang, F. H., 2000, “Study on Critical Condition of Brittle Ductile Transition of Brittle Materials of Ultra-Precision Grinding,” High Technol. Lett., 10(2), pp. 67–70.
Cheng, X., Wang, Z. G., Nakamoto, K., and Yamazaki, K., 2010, “Design and Development of PCD Micro Straight Edge End Mills for Micro/Nano Cutting of Hard and Brittle Materials,” J. Mech. Sci. Technol., 24(11), pp. 1–8. [CrossRef]


Grahic Jump Location
Fig. 5

Definition of UCT (h) in micromilling

Grahic Jump Location
Fig. 6

Tip of the Vickers indenter

Grahic Jump Location
Fig. 4

Projected views of the radial and axial cutting actions

Grahic Jump Location
Fig. 3

Geometrical model of micromilling

Grahic Jump Location
Fig. 2

Definition of UCT (h) in microturning

Grahic Jump Location
Fig. 1

Geometrical model of microturning

Grahic Jump Location
Fig. 7

Micro cutting process in an orthogonal view

Grahic Jump Location
Fig. 8

Schematic view of the axial cutting action in micromilling

Grahic Jump Location
Fig. 9

The fitted dimensionless coefficient versus cutting edge radius

Grahic Jump Location
Fig. 10

Model predictions versus experimental data

Grahic Jump Location
Fig. 11

Efficiency comparison of microturning

Grahic Jump Location
Fig. 12

Efficiency comparison of micromilling



Some tools below are only available to our subscribers or users with an online account.

Related Content

Customize your page view by dragging and repositioning the boxes below.

Related Journal Articles
Related eBook Content
Topic Collections

Sorry! You do not have access to this content. For assistance or to subscribe, please contact us:

  • TELEPHONE: 1-800-843-2763 (Toll-free in the USA)
  • EMAIL: asmedigitalcollection@asme.org
Sign In