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Research Papers

Ablation Dynamics of Silicon by Femtosecond Laser and the Role of Early Plasma

[+] Author and Article Information
Y. C. Shin

e-mail: shin@purdue.edu
Center for Laser-Based Manufacturing,
School of Mechanical Engineering,
Purdue University,
West Lafayette, IN 47907

1Corresponding author.

Manuscript received April 29, 2013; final manuscript received October 18, 2013; published online November 18, 2013. Editor: Y. Lawrence Yao.

J. Manuf. Sci. Eng 135(6), 061015 (Nov 18, 2013) (5 pages) Paper No: MANU-13-1193; doi: 10.1115/1.4025805 History: Received April 29, 2013; Revised October 18, 2013

In this paper, the femtosecond laser ablation of silicon is investigated by a two-dimensional hydrodynamic model. The ablation depth of the silicon wafer ablated in air at different laser intensities is calculated, and the corresponding experimental measurements are carried out for validation. Two different ablation regimes have been identified by varying the laser fluence. While two-photon absorption dominates in the low fluence regime (<2 J/cm2), electron heat diffusion is a major energy transport mechanism at higher laser fluences (>2 J/cm2). The ablation efficiency first increases with the laser fluence, and reaches the peak value at the laser fluence around 8 J/cm2. It starts to drop when the laser fluence further increases, because of the early plasma absorption of the laser beam energy.

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Figures

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Fig. 1

Schematic diagram of the model setup

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Fig. 2

Experimental setup

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Fig. 3

Spatial distribution of the lattice temperature at 10 ps. Laser pulse duration: 100 fs, wavelength: 800 nm, laser fluence: 2.5 J/cm2.

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Fig. 4

Ablated crater geometry at the fluence of (a) 2.5 J/cm2 and (b) 20 J/cm2. Dashed line: experimental measurements; solid line: simulation results.

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Fig. 5

Ablation depth versus laser fluence. (a) From low to high fluence, (b) zoom in low fluence range. Laser pulse duration: 100 fs, wavelength: 800 nm.

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Fig. 6

Ablation efficiency versus laser fluence. Laser pulse duration: 100 fs, wavelength: 800 nm.

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Fig. 7

Plasma absorption of the incident laser beam energy. Laser pulse duration: 100 fs, wavelength: 800 nm.

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