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Research Papers

Suppression of Regenerative Chatter in a Plunge-Grinding Process by Spindle Speed

[+] Author and Article Information
Yao Yan

e-mail: yanyao19860624@gmail.com

Jian Xu

Professor
e-mail: xujian@tongji.edu.cn
School of Aerospace Engineering
and Applied Mechanics,
Tongji University,
Shanghai 200092, China

1Corresponding author.

Contributed by the Manufacturing Engineering Division of ASME for publication in the Journal of Manufacturing Science and Engineering. Manuscript received November 11, 2012; final manuscript received January 21, 2013; published online July 17, 2013. Assoc. Editor: Tony Schmitz.

J. Manuf. Sci. Eng 135(4), 041019 (Jul 17, 2013) (9 pages) Paper No: MANU-12-1332; doi: 10.1115/1.4023724 History: Received November 11, 2012; Revised January 21, 2013

This paper utilizes an effective control strategy to suppress the regenerative chatter in a plunge-grinding process. To begin with, the dynamical interaction between the workpiece and the grinding wheel is considered as a major factor influencing the grinding stability. Mathematically, the grinding stability is studied through numerical eigenvalue analysis. Consequently, critical chatter boundaries are obtained to distinguish the chatter-free and the chatter regions. As known, the grinding is unstable and the chatter happens in the chatter region. To observe the chatter vibrations, an analytical method and numerical simulations are employed. As a result, chatter vibrations both with and without losing contact between the workpiece and the wheel are obtained. Meanwhile, the coexistence of the chatter and the stable grinding is also found in the chatter-free region. Finally, a control strategy involving spindle speed variation (SSV) is introduced to suppress the chatter. Then, its effectiveness is analytically investigated in terms of the method of multiple scales (MMS).

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References

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Figures

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Fig. 1

Schematic of the cylindrical plunge-grinding process

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Fig. 2

Dynamical penetrations

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Fig. 3

Equivalent model of the cylindrical plunge-grinding process

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Fig. 4

Linear chatter boundaries with respect to different values of τ1: (a) τ1 = 11, (b) τ1 = 12, (c) τ1 = 13, (d) τ1 = 14

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Fig. 5

The magnified region marked by the dashed frame in Fig. 4

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Fig. 6

Distributions of the maximum and the minimum values of the dimensionless depth of cut δ*(t) = 1 + δd(t) with respect to τ2. When no chatter vibrations occur, one has δd(t)= y2(t) - y1(t) + y1(t - τ1) - y2(t - τ2) = 0 and δ*(t) = 1. On the contrary, when chatter vibrations happen (δd(t)≠0), the recorded values of δ*(t) turn up on both sides of δ*(t) = 1.

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Fig. 7

The time series of the dimensionless depth of cut δ*(t) with respect to different values of τ2: (a) the chatter vibration without losing contact for τ2 = 17.928, (b) the chatter vibration with losing contact for τ2 = 17.926, (c) the chatter vibration with large amplitude in the chatter-free region for τ2 = 18.98, (d) the stable grinding process for τ2 = 18.98

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Fig. 8

The surface of g = 0

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Fig. 9

Parameter plane of the SSV amplitudes when ɛτ2ɛ =-0.4

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Fig. 10

The time series of the dimensionless depth of cut δ*(t) with respect to different situations marked in Fig. 9: (a) the time series of δ*(t) without SSV control (ɛΔ1 = ɛΔ2 = 0 at point I), (b) the time series of δ*(t) with weak SSV control (ɛΔ1 = ɛΔ2 = 0.015 at point II), (c) the time series of δ*(t) with strong SSV control (ɛΔ1 = ɛΔ2 = 0.02 at point III)

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Fig. 11

The effect of SSV control with ɛΔ1 = ɛΔ2 = 0.02

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