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Research Papers

A Study on Fabricating Microdeep Recessed Part on Copper Foil Using Laser Indirect Shock Forming

[+] Author and Article Information
Huixia Liu

e-mail: lhx@ujs.edu.cn

Chunxing Gu

School of Mechanical Engineering,
Jiangsu University,
Zhenjiang 212013, China

Contributed by the Manufacturing Engineering Division of ASME for publication in the Journal of Manufacturing Science and Engineering. Manuscript received May 20, 2012; final manuscript received May 3, 2013; published online July 17, 2013. Assoc. Editor: Yong Huang.

J. Manuf. Sci. Eng 135(4), 041011 (Jul 17, 2013) (8 pages) Paper No: MANU-12-1154; doi: 10.1115/1.4024533 History: Received May 20, 2012; Revised May 03, 2013; Accepted May 07, 2013

Laser indirect shock forming is a novel microfabrication technique to introduce 3D profiles in metallic thin films. Experiments were performed by allowing the laser-driven flyer to impact the thin film, which is placed above a micromould. The effects of laser energy and sample thickness on deformation mechanism were investigated experimentally. The experimental results show that increasing the laser energy could increase the deformation depth, but may induce fracture along the edges of the micromould when the laser energy is too high. Moreover, the target plate was completely sheared off for 10 μm copper when the pulse energy is 1200 mJ. So it can be found that the technique can also realize micro punching of metallic thin films. The transient deformation of copper foil impacted by laser-driven flyer is simulated in this paper. Experimental data obtained were then used to validate the corresponding simulation model. Good agreement has been obtained between the numerical simulation and the experiments under different laser energy. The rising temperature due to the adiabatic conditions is taken into account. And the strain distribution has been also calculated numerically.

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Figures

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Fig. 1

The schematic diagram of laser indirect shock forming

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Fig. 2

The layout of the experiment

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Fig. 3

Laser-launched flyer plate

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Fig. 4

The workpiece of laser indirect shock forming (copper foil thickness: 10, 20, and 30 μm; the pulse energy: 515, 835, 1200, and 1380 mJ)

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Fig. 5

The surface 3D microtopography

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Fig. 6

The surface profile curve of workpiece

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Fig. 7

Comparison of the surface 3D microtopography between the experimental and the numerical result (copper foil thickness: 10 and 30 μm; the pulse energy: 515 mJ)

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Fig. 8

Comparison of the profile microtopography between the experimental and the numerical result (copper foil thickness: 10 and 30 μm; the pulse energy: 515 mJ)

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Fig. 9

Comparison of the forming depth between simulation and experiment

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Fig. 10

Displacement history for the center point

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Fig. 11

Typical stages of deformation with temperature field ( °C): (a) 0 ns, (b) 1300 ns, and (c) 4000 ns

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Fig. 12

The theoretical strain distribution on hemispherical shaped part

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Fig. 13

The workpiece with contours of effective plastics strain distribution

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Fig. 14

The strain distribution results obtained from finite element method at different positions

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