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Research Papers

Orthogonal Microcutting of Thin Workpieces

[+] Author and Article Information
Saptaji Kushendarsyah

e-mail: ksaptaji@ntu.edu.sg

Subbiah Sathyan

e-mail: SathyanS@ntu.edu.sg
Nanyang Technological University,
School of Mechanical and Aerospace Engineering,
Singapore, 639798 Singapore

References cited in Table 4 are [42-44].

Contributed by the Manufacturing Engineering Division of ASME for publication in the Journal of Manufacturing Science and Engineering. Manuscript received July 21, 2011; final manuscript received December 15, 2012; published online May 24, 2013. Assoc. Editor: Burak Ozdoganlar.

J. Manuf. Sci. Eng 135(3), 031004 (May 24, 2013) (11 pages) Paper No: MANU-11-1254; doi: 10.1115/1.4023710 History: Received July 21, 2011; Revised December 15, 2012

With a broader intention of producing thin sheet embossing molds, orthogonal cutting experiments of thin workpieces are conducted. Challenges in machining thin workpieces are many: machining induced stress and deformation, fixturing challenges, and substrate effects. A setup involving continuous orthogonal cutting with a single crystal diamond toolof an aluminum alloy (Al6061-T6) workpiece fixtured using an adhesive to reduce its thickness is used to study trends in forces, chip thickness, and to understand to what level of thickness we can machine the workpiece down to and in what form the adhesive fails. There are no significant changes observed in the forces and chip thickness between thick and thin workpieces during the experiments, meaning that the cutting energy required is the same in cutting thick or thin workpieces. The limitation to achieve thinner workpiece is attributed mainly due to the detachment of the thin workpiece by peel-off induced by adhesive failure mode, which occurs during initial chip formation as the tool initially engages with the workpiece. We use a finite element model to understand the stresses in the workpiece during this initial tool engagement when it is thick and when it is thin, as well as the effect of the adhesive itself and the effect of adhesive thickness. Simulation results show that the tensile stress induced by the tool at the workpiece-adhesive interface is higher for a thinner workpiece (45 μm) than a thicker workpiece (150 μm) and higher at the entrance. As such, a thinner workpiece is more susceptible to peel-off. The peeling of thin workpiece is induced when the high tensile stress at the interface exceeds the tensile-at-break value of the adhesive.

Copyright © 2013 by ASME
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References

Figures

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Fig. 1

Illustration of the cutting process on thick workpiece (left) and thin workpiece (right). In a thin workpiece, the machined workpiece thickness (tw) is comparable to the depth of cut (to).

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Fig. 2

Similar mechanism of the nanoindentation of thin film (left) and microcutting of thin workpiece (right)

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Fig. 3

Experimental setup of microcutting of thin workpieces

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Fig. 4

Cutting force profile (top) and thrust force profile (bottom) of workpiece #2 for thin (a) and thick (b)

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Fig. 5

Forces profile for one pass of workpiece #1 at the thickness of about 141 μm

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Fig. 6

Chip thickness profile of workpiece #1

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Fig. 7

The formation of chip in the thick workpiece (top) and the peel mechanism of the thin workpiece captured by high speed camera (bottom) for adhesive thickness of 31 μm

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Fig. 8

The comparison of the (a) rolled peeled sample just after cutting finished and (b) after the peeled sample straighten with (c) unpeeled sample

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Fig. 9

SEM Pictures of the bottom side of workpiece #2 (left) and #3 (right) after the thin workpieces peeled from the setup. No obvious remnant adhesive is observed suggesting adhesive failure mode.

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Fig. 10

Plot of the forces on the last pass when the thin workpieces peeled

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Fig. 11

Element mesh for 45 μm workpiece thickness and 30 μm adhesive thickness

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Fig. 12

Incipient chip formation during the tool engagement and the area of the interest

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Fig. 13

Tensile stress at the adhesive side on the interface during incipient chip formation

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Fig. 14

Shear stress at the adhesive side on the interface during incipient chip formation

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Fig. 15

Tensile stress across the thickness of the adhesive during incipient chip formation

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