Warping Analysis in Laminated Object Manufacturing Process

[+] Author and Article Information
Feng Lin, Wei Sun

Department of Mechanical Engineering and Mechanics, Drexel University, Philadelphia, PA 19104

J. Manuf. Sci. Eng 123(4), 739-746 (May 01, 2001) (8 pages) doi:10.1115/1.1403447 History: Received March 01, 2000; Revised May 01, 2001
Copyright © 2001 by ASME
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The sample of glue’s viscosity variation with temperature 6
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The illustration of the thermal force’s production
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Comparison between the calculated and the measured temperatures
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Temperature variations at the selected layers
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The conversion of thermal force with connecting intensity variation
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The simulated intralaminar thermal force at the 300th layer’s affected by the addition of the 301st layer
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Relationship of layer connecting intensity E with adhesive viscosity ω
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The coordination of the temperature field simulation
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The work cycle of LOM process
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Temperature calculation flowchart
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Simple warping phenomena
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Definition of layer adhesive connecting intensity
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Relationship of viscosity and adhesive connecting intensity with temperature
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The outside forces in LOM process




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