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TECHNICAL PAPERS

The Effect of Grinding Machine Stiffness on Surface Integrity of Silicon Nitride

[+] Author and Article Information
Fulun Yang, Bi Zhang, Jiexin Wang, Zhenqi Zhu, Richard Monahan

Department of Mechanical Engineering, University of Connecticut, Storrs, CT 06269

J. Manuf. Sci. Eng 123(4), 591-600 (Aug 01, 2000) (10 pages) doi:10.1115/1.1371928 History: Received February 01, 1998; Revised August 01, 2000
Copyright © 2001 by ASME
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References

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Zhang,  B., and Howes,  T. D., 1994, “Material-Removal Mechanisms in Ceramics,” CIRP Ann., 43, No. 1, pp. 305–308.
Zhang,  B., and Howes,  T. D., 1995, “Subsurface Evaluation of Ground Ceramics,” CIRP Ann., 44, No. 1, pp. 263–266.
Xu,  H. K., Jahanmir,  S., and Ives,  L. K., 1996, “Material Removal and Damage Formation Mechanisms in Grinding Silicon Nitride,” J. Mater. Res., 11, No. 7, pp. 1717–1724.
Shore,  P., 1990, “State of the Art in ‘Damage-Free’ Grinding of Advanced Engineering Ceramics,” Br. Ceram. Proc., 46, pp. 189–200.
Bifano,  T. G., Dow,  T. A., and Scattergood,  R. O., 1991, “Ductile-Regime Grinding: A New Technology for Machining Brittle materials,” ASME J. Eng. Ind. 113, pp. 184–189.
McKeown, P. A., 1995, Private Communication, Storrs, Connecticut, May.
Kitajima,  K., Cai,  G. Q., Tanaka,  Y., and Zheng,  H. W., 1992, “Study on Mechanism of Ceramics Grinding,” CIRP Ann., 41, No. 1, pp. 367–371.
Xu,  H. K., Wei,  L., and Jahanmir,  S., 1995, “Grinding Force and Microcrack Density in Abrasive Machining of Silicon Nitride,” J. Mater. Res., 10, No. 12, pp. 3204–3209.
Werner, G., 1986, “Wheel Wear in Grinding as a Function of Energy Consumed,” Fundamentals of Tribology, N. P. Suh and N. Saka, The MIT Press, Cambridge, Massachusetts, and London, England, pp. 691–703.
Malkin, S., and Hwang, T. W., 1996, “Grinding Mechanisms of Ceramics,” CIRP Ann., 45 , No. 2.
Thompson,  R. A., 1986, “On the Doubly Regenerative Stability of a Grinder: The Theory of Chatter Growth,” ASME J. Eng. Ind., 108, No. 2, pp. 75–82.
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Zhang,  B., Wang,  J. X., Yang,  F. L., and Zhu,  Z. Q., 1999, “The Effect of Machine Stiffness on Grinding of Silicon Nitride,” Int. J. Mach. Tools Manuf., 39, No. 8, pp. 1263–1283.
Yoshikawa,  M., Zhang,  B., and Tokura,  H., 1987, “Observation of Ceramic Surface Cracks by Newly Proposed Methods,” J. Ceram. Soc. Jpn., 95, pp. 911–918.
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Figures

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Edge wear of a cup-type grinding wheel
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Static model of a mass, spring, and damper system for cup-type wheel grinding
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Dynamic model of a mass, spring, and damper system for cup-type wheel grinding
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Relationship between mean damage depth and machine stiffness
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Grinding setup showing the workholder with adjustable stiffness
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Measurement curve of the static stiffness for the workholder assembly
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Measurement result of the natural frequency of the grinding machine (40 N/μm)
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Relationship between grinding force and actual depth of cut
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Relationship between mean damage depth and machine stiffness in single-pass grinding
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Mean damage depth vs. grit size of grinding wheels of vitrified bond
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Mean damage depth vs. bond type of grinding wheels with 15 μm grit size
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Actual depth of cut of grinding wheel vs. machine stiffness at SDOC of 10 μm in a single-pass grinding
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Mean damage depth vs. actual depth of cut of grinding wheel at SDOC of 10 μm in a single-pass grinding

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