Comparison of Methods to Measure Grinding Temperatures

[+] Author and Article Information
Xipeng Xu, Stephen Malkin

Department of Mechanical & Industrial Engineering, University of Massachusetts, Amherst, MA 01003-2210e-mail: malkin@ecs.umass.edu

J. Manuf. Sci. Eng 123(2), 191-195 (Aug 01, 2000) (5 pages) doi:10.1115/1.1369358 History: Received March 01, 2000; Revised August 01, 2000
Copyright © 2001 by ASME
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Illustration of the setup for temperature and power measurements
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A typical power trace during a grinding pass and power variation from pass to pass: (a) power trace during a single pass and (b) power variation from pass to pass
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Temperature responses recorded by the three methods
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Thermal model for temperature matching and theoretical analysis
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Measured and analytical temperature profiles versus dimensionless length x/l
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Maximum temperature rise versus depth beneath workpiece surface
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Temperatures from the infrared detector versus temperatures from the embedded thermocouple




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